ATE202579T1 - Laminatzubereitung mit niedrigem gehalt an flüchtigen organischen verbindungen - Google Patents

Laminatzubereitung mit niedrigem gehalt an flüchtigen organischen verbindungen

Info

Publication number
ATE202579T1
ATE202579T1 AT95936878T AT95936878T ATE202579T1 AT E202579 T1 ATE202579 T1 AT E202579T1 AT 95936878 T AT95936878 T AT 95936878T AT 95936878 T AT95936878 T AT 95936878T AT E202579 T1 ATE202579 T1 AT E202579T1
Authority
AT
Austria
Prior art keywords
volatile organic
low
staging
organic compound
organic solvent
Prior art date
Application number
AT95936878T
Other languages
English (en)
Inventor
Joseph Gan
Alan R Goodson
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=10763296&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE202579(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Application granted granted Critical
Publication of ATE202579T1 publication Critical patent/ATE202579T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/02—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
    • C08J3/09—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
AT95936878T 1994-10-21 1995-10-13 Laminatzubereitung mit niedrigem gehalt an flüchtigen organischen verbindungen ATE202579T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9421405A GB9421405D0 (en) 1994-10-21 1994-10-21 Low voc laminating formulations
PCT/US1995/013358 WO1996012751A2 (en) 1994-10-21 1995-10-13 Low voc laminating formulations

Publications (1)

Publication Number Publication Date
ATE202579T1 true ATE202579T1 (de) 2001-07-15

Family

ID=10763296

Family Applications (1)

Application Number Title Priority Date Filing Date
AT95936878T ATE202579T1 (de) 1994-10-21 1995-10-13 Laminatzubereitung mit niedrigem gehalt an flüchtigen organischen verbindungen

Country Status (12)

Country Link
US (1) US7579392B2 (de)
EP (1) EP0787161B2 (de)
JP (1) JP3742104B2 (de)
KR (1) KR100424208B1 (de)
CN (1) CN1075823C (de)
AT (1) ATE202579T1 (de)
BR (1) BR9509514A (de)
DE (1) DE69521519T3 (de)
GB (1) GB9421405D0 (de)
RU (1) RU2159255C2 (de)
TW (1) TW322506B (de)
WO (1) WO1996012751A2 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6613839B1 (en) 1997-01-21 2003-09-02 The Dow Chemical Company Polyepoxide, catalyst/cure inhibitor complex and anhydride
KR100569617B1 (ko) † 1997-01-21 2006-04-11 다우 글로벌 테크놀로지스 인크. 에폭시 수지 조성물
GB9817799D0 (en) 1998-08-14 1998-10-14 Dow Deutschland Inc Viscosity modifier for thermosetting resin compositioning
GB9827367D0 (en) 1998-12-11 1999-02-03 Dow Deutschland Inc Adhesive resin composition
WO2001042253A2 (en) 1999-12-13 2001-06-14 The Dow Chemical Company Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith
TWI261059B (en) 1999-12-13 2006-09-01 Dow Global Technologies Inc Flame retardant phosphorus element-containing epoxy resin compositions
KR100419063B1 (ko) 2000-06-10 2004-02-14 주식회사 엘지화학 에폭시 수지 조성물 및 이를 이용한 적층판
TWI335347B (en) 2003-05-27 2011-01-01 Ajinomoto Kk Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg
EP1753772B1 (de) 2004-05-28 2016-12-28 Blue Cube IP LLC Phosphorhaltige verbindungen, die sich für die herstellung von halogenfreien entzündungsgehemmten polymeren eignen
CA2655504A1 (en) * 2006-06-15 2007-12-21 Fibron Ltd. Antibodies blocking fibroblast growth factor receptor activation and methods of use thereof
US8877866B2 (en) * 2006-10-19 2014-11-04 Dow Global Technologies Llc Curable epoxy resin compositions having improved adhesion to metal substrates and processes for making and using the same
KR20100017712A (ko) * 2007-05-09 2010-02-16 다우 글로벌 테크놀로지스 인크. 과잉 에폭시 수지를 포함하는 에폭시 열경화성 조성물 및 이의 제조 방법
SG172872A1 (en) * 2009-01-06 2011-08-29 Dow Global Technologies Llc Metal stabilizers for epoxy resins and advancement process
JP5136573B2 (ja) * 2009-02-24 2013-02-06 日立化成工業株式会社 ワニス、プリプレグ、樹脂付きフィルム、金属箔張積層板、プリント配線板
FR2967296B1 (fr) 2010-11-05 2018-05-25 Commissariat A L'energie Atomique Et Aux Energies Alternatives Elements de connexion pour l'hybridation de circuits electroniques
WO2013054320A1 (en) 2011-10-11 2013-04-18 Tel Hashomer Medical Research Infrastructure And Services Ltd. Antibodies to carcinoembryonic antigen-related cell adhesion molecule (ceacam)
CN104136482B (zh) 2011-12-29 2016-08-17 陶氏环球技术有限责任公司 使用多环多胺作为环氧硬化剂的环氧涂料体系
EP3492095A1 (de) 2012-04-01 2019-06-05 Technion Research & Development Foundation Limited Extrazelluläre matrix-metalloproteasen-induktor (emmprin)-peptide und bindende antikörper
US9243294B2 (en) 2013-09-30 2016-01-26 Hadasit Medical Research Services And Development Ltd. Modulation of NLGn4 expression, NK cell activity in non-alcoholic fatty liver disease (NAFLD)
US11427647B2 (en) 2014-04-27 2022-08-30 Famewave Ltd. Polynucleotides encoding humanized antibodies against CEACAM1
AU2015254886A1 (en) 2014-04-27 2016-11-03 Ccam Biotherapeutics Ltd. Humanized antibodies against CEACAM1
US20180111989A1 (en) 2015-04-01 2018-04-26 Hadasit Medical Research Services And Development Ltd. Inhibitors of neuroligin 4 - neurexin 1-beta protein-protein interaction for treatment of liver disorders
CN108137691B (zh) 2015-09-02 2021-10-19 耶路撒冷希伯来大学伊萨姆研究发展有限公司 特异性针对人类t-细胞免疫球蛋白和itim结构域(tigit)的抗体
CN111978513A (zh) * 2019-06-14 2020-11-24 上海雄润树脂有限公司 一种高压电开关浇注用环氧树脂及其制备方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3738862A (en) 1971-11-08 1973-06-12 Shell Oil Co Process for preparing reinforced laminates in situ with epoxy-polyhydric phenol condensates
US3842037A (en) * 1972-06-08 1974-10-15 Shell Oil Co Process for preparing higher molecular weight polyepoxide products by condensing lower molecular weight polyepoxide with polyhydric phenols
US4251594A (en) 1979-09-27 1981-02-17 The Dow Chemical Company Process for preparing resin impregnated substrates for use in preparing electrical laminates
US4501787A (en) 1983-04-29 1985-02-26 Westinghouse Electric Corp. Flame retardant B-staged epoxy resin prepregs and laminates made therefrom
IL75806A (en) † 1984-07-17 1988-10-31 Dow Chemical Co Partially advanced epoxy resin compositions and products resulting from reacting and curing said compositions
GB8622654D0 (en) 1986-09-19 1986-10-22 Shell Int Research Casting of epoxy resins
US4868059A (en) † 1987-11-16 1989-09-19 The Dow Chemical Company Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
US4820784A (en) 1988-01-13 1989-04-11 The Dow Chemical Company Modified advanced epoxy resins
US4925901A (en) 1988-02-12 1990-05-15 The Dow Chemical Company Latent, curable, catalyzed mixtures of epoxy-containing and phenolic hydroxyl-containing compounds
US5310854A (en) 1989-08-23 1994-05-10 The Dow Chemical Company Epoxy resin composition and process therefor
US5721323A (en) 1990-05-21 1998-02-24 The Dow Chemical Company Cure inhibited epoxy resin compositions and laminates prepared from the compositions
ZA913801B (en) 1990-05-21 1993-01-27 Dow Chemical Co Latent catalysts,cure-inhibited epoxy resin compositions and laminates prepared therefrom
DE69133280T2 (de) 1990-05-21 2004-05-06 Dow Global Technologies, Inc., Midland Latente Katalysatoren, Härtungsinhibierte Epoxyharzzusammensetzungen und daraus hergestellte Laminate
US5169473A (en) * 1990-05-21 1992-12-08 The Dow Chemical Company Latent catalysts, epoxy compositions incorporating same, and coating, impregnating and bonding methods employing the compositions
GB9208955D0 (en) 1992-04-24 1992-06-10 Dow Europ Sa Dicyandiamide solution
WO1994011415A1 (en) 1992-11-12 1994-05-26 The Dow Chemical Company Curable composition containing anhydride resins
CA2151834A1 (en) 1992-12-21 1994-07-07 Alliedsignal Inc. Solvent free epoxy resin compositions
CN1069658C (zh) 1993-11-02 2001-08-15 陶氏化学公司 含固化抑制剂的环氧树脂组合物及由该组合物制成的层压板
GB9421407D0 (en) 1994-10-21 1994-12-07 Dow Chemical Co Curable epoxy resin accelerated by boric acid and its analogs
KR970700068A (ko) 1994-10-25 1997-01-08 미노루 다나까 슬래브 공급 야드(slab feed yard)

Also Published As

Publication number Publication date
US7579392B2 (en) 2009-08-25
DE69521519T3 (de) 2009-07-09
WO1996012751A2 (en) 1996-05-02
EP0787161A2 (de) 1997-08-06
DE69521519D1 (de) 2001-08-02
JP3742104B2 (ja) 2006-02-01
EP0787161B2 (de) 2008-12-17
KR100424208B1 (ko) 2004-09-18
BR9509514A (pt) 1997-12-30
TW322506B (de) 1997-12-11
KR970707198A (ko) 1997-12-01
DE69521519T2 (de) 2002-03-28
CN1075823C (zh) 2001-12-05
WO1996012751A3 (en) 1996-07-11
GB9421405D0 (en) 1994-12-07
US20030044521A1 (en) 2003-03-06
JPH10507787A (ja) 1998-07-28
RU2159255C2 (ru) 2000-11-20
CN1164244A (zh) 1997-11-05
EP0787161B1 (de) 2001-06-27

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