DE69411740D1 - Elektrisch leitfähige Klebstoff-Zusammensetzungen - Google Patents
Elektrisch leitfähige Klebstoff-ZusammensetzungenInfo
- Publication number
- DE69411740D1 DE69411740D1 DE69411740T DE69411740T DE69411740D1 DE 69411740 D1 DE69411740 D1 DE 69411740D1 DE 69411740 T DE69411740 T DE 69411740T DE 69411740 T DE69411740 T DE 69411740T DE 69411740 D1 DE69411740 D1 DE 69411740D1
- Authority
- DE
- Germany
- Prior art keywords
- electrically conductive
- conductive adhesive
- adhesive compositions
- compositions
- electrically
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0239—Coupling agent for particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/121—Metallo-organic compounds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2839—Web or sheet containing structurally defined element or component and having an adhesive outermost layer with release or antistick coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/078,740 US5362421A (en) | 1993-06-16 | 1993-06-16 | Electrically conductive adhesive compositions |
PCT/US1994/004828 WO1994029397A1 (en) | 1993-06-16 | 1994-05-02 | Electrically conductive adhesive compositions |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69411740D1 true DE69411740D1 (de) | 1998-08-20 |
DE69411740T2 DE69411740T2 (de) | 1999-04-08 |
Family
ID=22145943
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69411740T Expired - Fee Related DE69411740T2 (de) | 1993-06-16 | 1994-05-02 | Elektrisch leitfähige Klebstoff-Zusammensetzungen |
Country Status (9)
Country | Link |
---|---|
US (1) | US5362421A (de) |
EP (1) | EP0703951B1 (de) |
JP (1) | JP3652698B2 (de) |
KR (1) | KR100336188B1 (de) |
CN (1) | CN1056399C (de) |
CA (1) | CA2162882C (de) |
DE (1) | DE69411740T2 (de) |
SG (1) | SG46676A1 (de) |
WO (1) | WO1994029397A1 (de) |
Families Citing this family (84)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7158031B2 (en) | 1992-08-12 | 2007-01-02 | Micron Technology, Inc. | Thin, flexible, RFID label and system for use |
US5744557A (en) * | 1993-06-16 | 1998-04-28 | Minnesota Mining And Manufacturing Company | Energy-curable cyanate/ethylenically unsaturated compositions |
US5494943A (en) * | 1993-06-16 | 1996-02-27 | Minnesota Mining And Manufacturing Company | Stabilized cationically-curable compositions |
US5891366A (en) * | 1994-05-10 | 1999-04-06 | Robert Bosch Gmbh | Anisotropically conducting adhesive, and process for producing an anisotropically conducting adhesive |
US20010028953A1 (en) * | 1998-11-16 | 2001-10-11 | 3M Innovative Properties Company | Adhesive compositions and methods of use |
WO1997003143A1 (en) | 1995-07-10 | 1997-01-30 | Minnesota Mining And Manufacturing Company | Screen printable adhesive compositions |
US5626948A (en) * | 1996-01-03 | 1997-05-06 | Ferber Technologies L.L.C. | Electrical system having a multilayer conductive composition |
US5734523A (en) * | 1996-07-24 | 1998-03-31 | Pemstar, Inc. | Conductive film connectors for use on head assemblies in drives |
US5920037A (en) | 1997-05-12 | 1999-07-06 | International Business Machines Corporation | Conductive bonding design for metal backed circuits |
US6613184B1 (en) | 1997-05-12 | 2003-09-02 | International Business Machines Corporation | Stable interfaces between electrically conductive adhesives and metals |
US6534724B1 (en) * | 1997-05-28 | 2003-03-18 | International Business Machines Corporation | Enhanced design and process for a conductive adhesive |
US6238599B1 (en) * | 1997-06-18 | 2001-05-29 | International Business Machines Corporation | High conductivity, high strength, lead-free, low cost, electrically conducting materials and applications |
US5883193A (en) * | 1997-07-01 | 1999-03-16 | Minnesota Mining And Manufacturing Company | Adhesive compositions with durability under conditions of high humidity |
US6309502B1 (en) | 1997-08-19 | 2001-10-30 | 3M Innovative Properties Company | Conductive epoxy resin compositions, anisotropically conductive adhesive films and electrical connecting methods |
US6339385B1 (en) | 1997-08-20 | 2002-01-15 | Micron Technology, Inc. | Electronic communication devices, methods of forming electrical communication devices, and communication methods |
US5968674A (en) * | 1997-10-14 | 1999-10-19 | Xerox Corporation | Conductive polymer coatings and processes thereof |
US6030423A (en) * | 1998-02-12 | 2000-02-29 | Micron Technology, Inc. | Thin profile battery bonding method and method of conductively interconnecting electronic components |
US6139777A (en) * | 1998-05-08 | 2000-10-31 | Matsushita Electric Industrial Co., Ltd. | Conductive paste for filling via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same |
KR20000005710A (ko) * | 1998-06-05 | 2000-01-25 | 성재갑 | 표백활성화제 |
US6133335A (en) | 1998-12-31 | 2000-10-17 | 3M Innovative Properties Company | Photo-polymerizable compositions and articles made therefrom |
US6265459B1 (en) | 1998-12-31 | 2001-07-24 | 3M Innovative Properties Company | Accelerators useful for energy polymerizable compositions |
US6482868B1 (en) | 1998-12-31 | 2002-11-19 | 3M Innovative Properties Company | Accelerators useful for energy polymerizable compositions |
US6572792B1 (en) * | 1999-10-13 | 2003-06-03 | Atomic Ordered Materials, L.L.C. | Composition of matter tailoring: system 1 |
US6921497B2 (en) * | 1999-10-13 | 2005-07-26 | Electromagnetics Corporation | Composition of matter tailoring: system I |
US6699351B2 (en) | 2000-03-24 | 2004-03-02 | 3M Innovative Properties Company | Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it |
US6635689B1 (en) * | 2000-06-26 | 2003-10-21 | 3M Innovative Properties Company | Accelerators for cationic polymerization catalyzed by iron-based catalysts |
US6867539B1 (en) * | 2000-07-12 | 2005-03-15 | 3M Innovative Properties Company | Encapsulated organic electronic devices and method for making same |
US7053133B2 (en) * | 2001-05-29 | 2006-05-30 | Hiroaki Yamaguchi | Ultraviolet activatable adhesive film |
US6695623B2 (en) * | 2001-05-31 | 2004-02-24 | International Business Machines Corporation | Enhanced electrical/mechanical connection for electronic devices |
KR100456064B1 (ko) * | 2001-07-06 | 2004-11-08 | 한국과학기술원 | 극미세 피치 cog 기술용 이방성 전도성 필름 |
US20030155656A1 (en) * | 2002-01-18 | 2003-08-21 | Chiu Cindy Chia-Wen | Anisotropically conductive film |
WO2003061949A1 (en) * | 2002-01-18 | 2003-07-31 | Avery Dennison Corporation | Sheet having microsized architecture |
WO2003062133A2 (en) * | 2002-01-18 | 2003-07-31 | Avery Dennison Corporation | Covered microchamber structures |
US6936131B2 (en) | 2002-01-31 | 2005-08-30 | 3M Innovative Properties Company | Encapsulation of organic electronic devices using adsorbent loaded adhesives |
JP4201519B2 (ja) * | 2002-04-01 | 2008-12-24 | スリーエム イノベイティブ プロパティズ カンパニー | カチオン重合性接着剤組成物及び異方導電性接着剤組成物 |
US20050256230A1 (en) * | 2002-04-01 | 2005-11-17 | Hiroaki Yamaguchi | Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition |
US6773474B2 (en) | 2002-04-19 | 2004-08-10 | 3M Innovative Properties Company | Coated abrasive article |
DE60306672T2 (de) * | 2002-10-30 | 2007-06-28 | Ciba Speciality Chemicals Holding Inc. | Verwendung von metallkomplexverbindungen als oxidationskatalysatoren |
US20040245611A1 (en) * | 2003-05-23 | 2004-12-09 | Paul Morganelli | Pre-applied thermoplastic reinforcement for electronic components |
US20040232530A1 (en) * | 2003-05-23 | 2004-11-25 | Paul Morganelli | Pre-applied thermoplastic reinforcement for electronic components |
US6978540B2 (en) * | 2003-05-23 | 2005-12-27 | National Starch And Chemical Investment Holding Corporation | Method for pre-applied thermoplastic reinforcement of electronic components |
US20040238925A1 (en) * | 2003-05-23 | 2004-12-02 | Paul Morganelli | Pre-applied thermoplastic reinforcement for electronic components |
DE10344801A1 (de) * | 2003-09-26 | 2005-05-04 | Celanese Emulsions Gmbh | Wässrige Polymerdispersionen mit hohem Feststoffgehalt, Verfahren zu deren Herstellung und deren Verwendung |
CN101483080A (zh) * | 2003-12-04 | 2009-07-15 | 旭化成电子材料元件株式会社 | 各向异性的导电粘合片材及连接结构体 |
US20050126697A1 (en) * | 2003-12-11 | 2005-06-16 | International Business Machines Corporation | Photochemically and thermally curable adhesive formulations |
JP4880478B2 (ja) * | 2003-12-30 | 2012-02-22 | スリーエム イノベイティブ プロパティズ カンパニー | 弾性表面波センサアセンブリ |
US20070281369A1 (en) * | 2003-12-30 | 2007-12-06 | Carter Chad J | Acousto-Mechanical Detection Systems and Methods of Use |
JP2005217369A (ja) * | 2004-02-02 | 2005-08-11 | Three M Innovative Properties Co | 発光ダイオード装置用接着シート及び発光ダイオード装置 |
US20050250929A1 (en) * | 2004-05-10 | 2005-11-10 | 3M Innovative Properties Company | Ferrocenium-derived catalyst for cationically polymerizable monomers |
US7078095B2 (en) * | 2004-07-07 | 2006-07-18 | Xerox Corporation | Adhesive film exhibiting anisotropic electrical conductivity |
US20060110600A1 (en) * | 2004-11-19 | 2006-05-25 | 3M Innovative Properties Company | Anisotropic conductive adhesive composition |
JP2006199778A (ja) * | 2005-01-19 | 2006-08-03 | Hitachi Chem Co Ltd | 接着剤組成物、回路接続用接着剤及びこれを用いた回路接続方法、接続体 |
US7655160B2 (en) * | 2005-02-23 | 2010-02-02 | Electromagnetics Corporation | Compositions of matter: system II |
US20070116961A1 (en) * | 2005-11-23 | 2007-05-24 | 3M Innovative Properties Company | Anisotropic conductive adhesive compositions |
US20070213429A1 (en) * | 2006-03-10 | 2007-09-13 | Chih-Min Cheng | Anisotropic conductive adhesive |
CN101495587B (zh) * | 2006-07-24 | 2011-08-10 | 3M创新有限公司 | 导电压敏粘合剂 |
WO2008083279A1 (en) * | 2006-12-29 | 2008-07-10 | 3M Innovative Properties Company | Method of detection of bioanalytes by acousto-mechanical detection systems comprising the addition of liposomes |
WO2009054168A1 (ja) * | 2007-10-22 | 2009-04-30 | Sharp Kabushiki Kaisha | 表示装置及びその製造方法 |
KR100934553B1 (ko) | 2007-11-16 | 2009-12-29 | 제일모직주식회사 | 이방 전도성 필름의 제조방법 및 그에 의해서 제조되는이방 전도성 필름 |
KR100891414B1 (ko) | 2007-11-20 | 2009-04-02 | 제일모직주식회사 | 저장안정성이 개선된 이방 도전성 필름용 조성물 |
US20090288770A1 (en) * | 2008-05-23 | 2009-11-26 | Loctite (R&D) Limited | Surface-promoted cure of one-part cationically curable compositions |
US20090288771A1 (en) * | 2008-05-23 | 2009-11-26 | Loctite (R&D) Limited | Surface-promoted cure of one-part radically curable compositions |
US8399099B1 (en) * | 2008-05-23 | 2013-03-19 | Henkel Ireland Limited | Coating compositions |
JP5499448B2 (ja) * | 2008-07-16 | 2014-05-21 | デクセリアルズ株式会社 | 異方性導電接着剤 |
WO2010094634A1 (en) | 2009-02-17 | 2010-08-26 | Loctite (R & D) Limited | Cationically curable compositions and a primer therefor |
WO2012039725A1 (en) * | 2009-10-30 | 2012-03-29 | Research Frontiers Incorporated | Spd films and light valve laminates with improved bus-bar connections |
NZ701435A (en) | 2010-11-22 | 2016-01-29 | Electromagnetics Corp | Tailoring a metal or modifying an electronic structure thereof |
EP2487215B1 (de) | 2011-02-11 | 2013-07-24 | Henkel AG & Co. KGaA | Elektrisch leitfähige Haftmittel mit mindestens einem Metallvorläufer |
JP2012230895A (ja) * | 2011-04-13 | 2012-11-22 | Sekisui Chem Co Ltd | 異方性導電材料及び接続構造体 |
JP2013016473A (ja) * | 2011-06-10 | 2013-01-24 | Sekisui Chem Co Ltd | 異方性導電材料及び接続構造体 |
JP5392333B2 (ja) * | 2011-09-28 | 2014-01-22 | 日立化成株式会社 | 回路接続用接着剤及びこれらを用いた回路接続方法、接続体 |
JP2012046757A (ja) * | 2011-09-28 | 2012-03-08 | Hitachi Chem Co Ltd | 回路接続用接着剤及びこれらを用いた回路接続方法、接続体 |
JP2012046756A (ja) * | 2011-09-28 | 2012-03-08 | Hitachi Chem Co Ltd | 回路接続用接着剤及びこれらを用いた回路接続方法、接続体 |
KR101391696B1 (ko) * | 2011-11-23 | 2014-05-07 | 제일모직주식회사 | 이방 전도성 조성물 및 필름 |
JP5662366B2 (ja) * | 2012-03-21 | 2015-01-28 | デクセリアルズ株式会社 | 接着剤 |
CN103000253B (zh) * | 2012-11-10 | 2015-05-20 | 江苏瑞德新能源科技有限公司 | 一种潜伏固化型导电浆料及用其在基板上形成电极的方法 |
CN103709954A (zh) * | 2013-12-24 | 2014-04-09 | 上海金大塑胶有限公司 | 一种热熔胶型不干胶材料的制备方法 |
DE102015212058A1 (de) * | 2015-06-29 | 2016-12-29 | Tesa Se | Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung |
KR20190129829A (ko) * | 2017-03-30 | 2019-11-20 | 하리마카세이 가부시기가이샤 | 도전성 페이스트 |
CN108165198B (zh) * | 2018-01-30 | 2019-07-12 | 东莞市恒尔朗实业有限公司 | 一种高导电的环氧树脂胶粘剂及其制备方法 |
CN110724486A (zh) * | 2019-09-20 | 2020-01-24 | 北京蓝海黑石科技有限公司 | 一种可回收型led封装导电胶组合物及其制备方法 |
CN111117539B (zh) * | 2019-12-16 | 2021-07-09 | 苏州瑞力博新材科技有限公司 | 一种高粘接力、低接触电阻导电胶及其制备的异质结叠瓦太阳能组件 |
DE102022102650A1 (de) | 2022-02-04 | 2023-08-10 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Kationisch polymerisierbare flammgeschützte Massen |
DE102022106647A1 (de) | 2022-03-22 | 2023-09-28 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Niedertemperaturhärtende Massen auf Basis von Glycidylethern |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0182744B1 (de) * | 1984-11-14 | 1992-08-12 | Ciba-Geigy Ag | Photohärtbare gefüllte Expoxidharz-Zusammensetzungen und deren Verwendung |
JPH0738502B2 (ja) * | 1989-10-17 | 1995-04-26 | シャープ株式会社 | 回路基板の接続方法 |
US4970624A (en) * | 1990-01-22 | 1990-11-13 | Molex Incorporated | Electronic device employing a conductive adhesive |
DK0508951T3 (da) * | 1991-04-08 | 1996-09-09 | Ciba Geigy Ag | Varmehærdelige blandinger |
EP0585360A1 (de) * | 1991-05-16 | 1994-03-09 | Minnesota Mining And Manufacturing Company | Uaf epoxidbasierende klebstoffe |
US5252694A (en) * | 1992-01-22 | 1993-10-12 | Minnesota Mining And Manufacturing Company | Energy-polymerization adhesive, coating, film and process for making the same |
US5245750A (en) * | 1992-02-28 | 1993-09-21 | Hughes Aircraft Company | Method of connecting a spaced ic chip to a conductor and the article thereby obtained |
-
1993
- 1993-06-16 US US08/078,740 patent/US5362421A/en not_active Expired - Lifetime
-
1994
- 1994-05-02 SG SG1996008092A patent/SG46676A1/en unknown
- 1994-05-02 WO PCT/US1994/004828 patent/WO1994029397A1/en active IP Right Grant
- 1994-05-02 CA CA002162882A patent/CA2162882C/en not_active Expired - Fee Related
- 1994-05-02 CN CN94192398A patent/CN1056399C/zh not_active Expired - Fee Related
- 1994-05-02 DE DE69411740T patent/DE69411740T2/de not_active Expired - Fee Related
- 1994-05-02 EP EP94915446A patent/EP0703951B1/de not_active Expired - Lifetime
- 1994-05-02 JP JP50176795A patent/JP3652698B2/ja not_active Expired - Fee Related
- 1994-05-02 KR KR1019950705686A patent/KR100336188B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CA2162882A1 (en) | 1994-12-22 |
KR960703159A (ko) | 1996-06-19 |
CN1128040A (zh) | 1996-07-31 |
CA2162882C (en) | 2005-07-26 |
JPH08511570A (ja) | 1996-12-03 |
CN1056399C (zh) | 2000-09-13 |
WO1994029397A1 (en) | 1994-12-22 |
EP0703951B1 (de) | 1998-07-15 |
EP0703951A1 (de) | 1996-04-03 |
JP3652698B2 (ja) | 2005-05-25 |
KR100336188B1 (ko) | 2002-10-11 |
US5362421A (en) | 1994-11-08 |
SG46676A1 (en) | 1998-02-20 |
DE69411740T2 (de) | 1999-04-08 |
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