DE69204828D1 - Herstellung von Laserdioden mit durch Spaltung erzeugten Stirnflächen auf einem vollständigen Wafer. - Google Patents

Herstellung von Laserdioden mit durch Spaltung erzeugten Stirnflächen auf einem vollständigen Wafer.

Info

Publication number
DE69204828D1
DE69204828D1 DE69204828T DE69204828T DE69204828D1 DE 69204828 D1 DE69204828 D1 DE 69204828D1 DE 69204828 T DE69204828 T DE 69204828T DE 69204828 T DE69204828 T DE 69204828T DE 69204828 D1 DE69204828 D1 DE 69204828D1
Authority
DE
Germany
Prior art keywords
manufacture
laser diodes
complete wafer
cleavage faces
cleavage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69204828T
Other languages
English (en)
Other versions
DE69204828T2 (de
Inventor
Theodor Forster
Christoph Dr Harder
Albertus Oosenbrug
Gary W Rubloff
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69204828D1 publication Critical patent/DE69204828D1/de
Publication of DE69204828T2 publication Critical patent/DE69204828T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
    • H01S5/0202—Cleaving
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/028—Dicing

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Dicing (AREA)
DE69204828T 1992-06-09 1992-06-09 Herstellung von Laserdioden mit durch Spaltung erzeugten Stirnflächen auf einem vollständigen Wafer. Expired - Lifetime DE69204828T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP92810438A EP0573724B1 (de) 1992-06-09 1992-06-09 Herstellung von Laserdioden mit durch Spaltung erzeugten Stirnflächen auf einem vollständigen Wafer

Publications (2)

Publication Number Publication Date
DE69204828D1 true DE69204828D1 (de) 1995-10-19
DE69204828T2 DE69204828T2 (de) 1996-05-02

Family

ID=8211936

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69204828T Expired - Lifetime DE69204828T2 (de) 1992-06-09 1992-06-09 Herstellung von Laserdioden mit durch Spaltung erzeugten Stirnflächen auf einem vollständigen Wafer.

Country Status (4)

Country Link
US (1) US5284792A (de)
EP (1) EP0573724B1 (de)
JP (1) JPH0637404A (de)
DE (1) DE69204828T2 (de)

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US5985687A (en) * 1996-04-12 1999-11-16 The Regents Of The University Of California Method for making cleaved facets for lasers fabricated with gallium nitride and other noncubic materials
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US6486068B2 (en) * 1998-01-08 2002-11-26 Toyoda Gosei Co., Ltd. Method for manufacturing group III nitride compound semiconductor laser diodes
EP0977276A1 (de) 1998-07-08 2000-02-02 Hewlett-Packard Company Spaltenauslösen von Halbleitervorrichtungen
US6444499B1 (en) 2000-03-30 2002-09-03 Amkor Technology, Inc. Method for fabricating a snapable multi-package array substrate, snapable multi-package array and snapable packaged electronic components
DE10032981A1 (de) * 2000-07-10 2002-01-24 Alltec Angewandte Laser Licht Verfahren zur Materialbearbeitung mittels Laser
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US6642127B2 (en) * 2001-10-19 2003-11-04 Applied Materials, Inc. Method for dicing a semiconductor wafer
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US7692289B2 (en) 2002-08-12 2010-04-06 Adc Telecommunications, Inc. Semiconductor devices with improved heat dissipation and method for fabricating same
US6974761B2 (en) * 2002-09-27 2005-12-13 Oki Electric Industry Co. Method of forming a semiconductor laser chip having a marker
US7223674B2 (en) * 2004-05-06 2007-05-29 Micron Technology, Inc. Methods for forming backside alignment markers useable in semiconductor lithography
DE102005046479B4 (de) * 2005-09-28 2008-12-18 Infineon Technologies Austria Ag Verfahren zum Spalten von spröden Materialien mittels Trenching Technologie
TWI300593B (en) * 2006-02-07 2008-09-01 Touch Micro System Tech Method of segmenting wafer
US8285149B2 (en) 2006-10-02 2012-10-09 Futurewei Technologies, Inc. Method and system for integrated DWDM transmitters
US8285150B2 (en) 2006-10-02 2012-10-09 Futurewei Technologies, Inc. Method and system for integrated DWDM transmitters
US8050525B2 (en) 2006-10-11 2011-11-01 Futurewei Technologies, Inc. Method and system for grating taps for monitoring a DWDM transmitter array integrated on a PLC platform
US8285151B2 (en) 2006-10-20 2012-10-09 Futurewei Technologies, Inc. Method and system for hybrid integrated 1XN DWDM transmitter
JP4765916B2 (ja) * 2006-12-04 2011-09-07 サンケン電気株式会社 半導体発光素子
US7858493B2 (en) * 2007-02-23 2010-12-28 Finisar Corporation Cleaving edge-emitting lasers from a wafer cell
US20100057040A1 (en) * 2008-08-31 2010-03-04 Abbott Diabetes Care, Inc. Robust Closed Loop Control And Methods
KR20120037980A (ko) * 2009-07-09 2012-04-20 더 리전츠 오브 더 유니버시티 오브 캘리포니아 무극성 또는 반극성 (Ｇａ,Ａｌ,Ｉｎ,Ｂ)Ｎ 기판들 상에 성장된 (Ｇａ,Ａｌ,Ｉｎ,Ｂ)Ｎ 레이저 다이오드들의 거울 패시트 클리빙 수율을 개선하기 위한 구조
KR101640830B1 (ko) * 2009-08-17 2016-07-22 삼성전자주식회사 기판 구조체 및 그 제조 방법
US20110039397A1 (en) * 2009-08-17 2011-02-17 Huilong Zhu Structures and methods to separate microchips from a wafer
DE102010040062B4 (de) * 2010-08-31 2014-05-22 Globalfoundries Dresden Module One Limited Liability Company & Co. Kg Eine Substratzerteilungstechnik für das Separieren von Halbleiterchips mit geringerem Flächenverbrauch
DE102011011862A1 (de) * 2011-02-21 2012-08-23 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Vielzahl optoelektronischer Halbleiterchips
JP5803457B2 (ja) * 2011-09-08 2015-11-04 三菱電機株式会社 レーザダイオード素子の製造方法
JP6281699B2 (ja) * 2013-07-01 2018-02-21 富士ゼロックス株式会社 半導体片の製造方法、半導体片を含む回路基板および電子装置、ならびに基板のダイシング方法
JP5637330B1 (ja) * 2013-07-01 2014-12-10 富士ゼロックス株式会社 半導体片の製造方法、半導体片を含む回路基板および画像形成装置
CN103701035B (zh) * 2013-12-19 2016-09-07 中国科学院上海微系统与信息技术研究所 一种边发射半导体激光器腔面的非解理制备方法
US9397314B2 (en) * 2013-12-23 2016-07-19 Universal Display Corporation Thin-form light-enhanced substrate for OLED luminaire
JP6189208B2 (ja) * 2013-12-26 2017-08-30 株式会社ディスコ ウエーハの加工方法
JP6325279B2 (ja) * 2014-02-21 2018-05-16 株式会社ディスコ ウエーハの加工方法
US9130030B1 (en) * 2014-03-07 2015-09-08 Applied Materials, Inc. Baking tool for improved wafer coating process
DE102015106712A1 (de) * 2015-04-30 2016-11-03 Osram Opto Semiconductors Gmbh Anordnung mit einem Substrat und einem Halbleiterlaser
ITUA20163362A1 (it) * 2016-05-11 2017-11-11 Prima Electro S P A Procedimento per la realizzazione di un diodo laser
JP2018074083A (ja) * 2016-11-02 2018-05-10 株式会社ディスコ ウエーハの加工方法
DE102018125496A1 (de) 2018-10-15 2020-04-16 Osram Opto Semiconductors Gmbh Halbleiterlaser und Herstellungsverfahren für Halbleiterlaser
CN111211477B (zh) * 2018-11-21 2023-07-28 深圳市中光工业技术研究院 半导体激光器及其制备方法
US20220415714A1 (en) * 2019-06-26 2022-12-29 Kyocera Corporation Layered body and manufacturing method for layered body

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FR1530610A (fr) * 1967-05-18 1968-06-28 Anciens Etablissements Chabas Distributeur hydraulique à voies multiples
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JPS6041478B2 (ja) * 1979-09-10 1985-09-17 富士通株式会社 半導体レ−ザ素子の製造方法
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JP2780981B2 (ja) * 1988-06-27 1998-07-30 三菱電機株式会社 多点発光型半導体レーザ及びその製造方法
JPH0750700B2 (ja) * 1989-06-27 1995-05-31 三菱電機株式会社 半導体チップの製造方法
US4961821A (en) * 1989-11-22 1990-10-09 Xerox Corporation Ode through holes and butt edges without edge dicing
JPH03286553A (ja) * 1990-04-03 1991-12-17 Furukawa Electric Co Ltd:The ダイシング方法
JPH0410554A (ja) * 1990-04-27 1992-01-14 Mitsubishi Electric Corp 半導体装置の製造方法
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Also Published As

Publication number Publication date
EP0573724B1 (de) 1995-09-13
EP0573724A1 (de) 1993-12-15
JPH0637404A (ja) 1994-02-10
DE69204828T2 (de) 1996-05-02
US5284792A (en) 1994-02-08

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Representative=s name: DUSCHER, R., DIPL.-PHYS. DR.RER.NAT., PAT.-ANW., 7

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