DE69131273D1 - Elektronisches-Computer-Kühlsystem - Google Patents

Elektronisches-Computer-Kühlsystem

Info

Publication number
DE69131273D1
DE69131273D1 DE69131273T DE69131273T DE69131273D1 DE 69131273 D1 DE69131273 D1 DE 69131273D1 DE 69131273 T DE69131273 T DE 69131273T DE 69131273 T DE69131273 T DE 69131273T DE 69131273 D1 DE69131273 D1 DE 69131273D1
Authority
DE
Germany
Prior art keywords
cooling system
electronic computer
computer cooling
electronic
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69131273T
Other languages
English (en)
Other versions
DE69131273T2 (de
Inventor
Shigeo Ohashi
Tadakatsu Nakajima
Heikichi Kuwahara
Toshio Hatada
Hitoshi Matsushima
Motohiro Sato
Hiroshi Inouye
Takao Ohba
Akira Yamagiwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE69131273D1 publication Critical patent/DE69131273D1/de
Application granted granted Critical
Publication of DE69131273T2 publication Critical patent/DE69131273T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208Liquid cooling with phase change
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/206Cooling means comprising thermal management
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208Liquid cooling with phase change
    • H05K7/20809Liquid cooling with phase change within server blades for removing heat from heat source
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid
DE69131273T 1990-11-28 1991-11-25 Elektronisches-Computer-Kühlsystem Expired - Fee Related DE69131273T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2322823A JPH04196395A (ja) 1990-11-28 1990-11-28 冷却装置を備えた電子計算機

Publications (2)

Publication Number Publication Date
DE69131273D1 true DE69131273D1 (de) 1999-07-01
DE69131273T2 DE69131273T2 (de) 1999-09-23

Family

ID=18148009

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69131273T Expired - Fee Related DE69131273T2 (de) 1990-11-28 1991-11-25 Elektronisches-Computer-Kühlsystem

Country Status (5)

Country Link
US (1) US5504924A (de)
EP (1) EP0489326B1 (de)
JP (1) JPH04196395A (de)
KR (1) KR950013558B1 (de)
DE (1) DE69131273T2 (de)

Families Citing this family (114)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1267411B1 (it) * 1994-03-15 1997-02-05 Olivetti & Co Spa Dispositivo per il controllo termico di una unita' centrale di elaborazione
US5752011A (en) 1994-06-20 1998-05-12 Thomas; C. Douglas Method and system for controlling a processor's clock frequency in accordance with the processor's temperature
US7167993B1 (en) 1994-06-20 2007-01-23 Thomas C Douglass Thermal and power management for computer systems
US5881298A (en) * 1996-09-05 1999-03-09 Micron Technology, Inc. Portable computer with selectively operable cooling unit
US6275945B1 (en) * 1996-11-26 2001-08-14 Kabushiki Kaisha Toshiba Apparatus for radiating heat for use in computer system
US6034872A (en) * 1997-07-16 2000-03-07 International Business Machines Corporation Cooling computer systems
KR19980019402A (ko) * 1998-03-16 1998-06-05 천기완 피.씨의 씨.피.유 냉각장치(cpu cooling device of pc)
US6050326A (en) * 1998-05-12 2000-04-18 International Business Machines Corporation Method and apparatus for cooling an electronic device
US9119705B2 (en) 1998-06-08 2015-09-01 Thermotek, Inc. Method and system for thermal and compression therapy relative to the prevention of deep vein thrombosis
JP2000049479A (ja) * 1998-07-28 2000-02-18 Fujitsu Ltd 電子装置
US6047766A (en) 1998-08-03 2000-04-11 Hewlett-Packard Company Multi-mode heat transfer using a thermal heat pipe valve
KR20000061442A (ko) * 1999-03-26 2000-10-16 최은광 수냉 공냉 혼합형 컴퓨터 냉각 시스템
JP3521423B2 (ja) * 1999-03-31 2004-04-19 東芝ホームテクノ株式会社 ファンモータ
US6618268B2 (en) 1999-07-15 2003-09-09 Incep Technologies, Inc. Apparatus for delivering power to high performance electronic assemblies
US20030214800A1 (en) * 1999-07-15 2003-11-20 Dibene Joseph Ted System and method for processor power delivery and thermal management
US6356448B1 (en) 1999-11-02 2002-03-12 Inceptechnologies, Inc. Inter-circuit encapsulated packaging for power delivery
US6452113B2 (en) 1999-07-15 2002-09-17 Incep Technologies, Inc. Apparatus for providing power to a microprocessor with integrated thermal and EMI management
US20030156400A1 (en) * 1999-07-15 2003-08-21 Dibene Joseph Ted Method and apparatus for providing power to a microprocessor with intergrated thermal and EMI management
US6801431B2 (en) * 1999-07-15 2004-10-05 Incep Technologies, Inc. Integrated power delivery and cooling system for high power microprocessors
US6304450B1 (en) 1999-07-15 2001-10-16 Incep Technologies, Inc. Inter-circuit encapsulated packaging
US6623279B2 (en) 1999-07-15 2003-09-23 Incep Technologies, Inc. Separable power delivery connector
US6947293B2 (en) * 1999-07-15 2005-09-20 Incep Technologies Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
US6741480B2 (en) 1999-07-15 2004-05-25 Incep Technologies, Inc. Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems
US6847529B2 (en) * 1999-07-15 2005-01-25 Incep Technologies, Inc. Ultra-low impedance power interconnection system for electronic packages
AU7645000A (en) 1999-10-04 2001-05-10 Asetek A/S Computer system comprising a cooling system and a cooling system for a computer system
US6233959B1 (en) 1999-10-12 2001-05-22 International Business Machines Corporation Dehumidified cooling assembly for IC chip modules
US6233960B1 (en) 1999-10-12 2001-05-22 International Business Machines Corporation Spot cooling evaporator cooling system for integrated circuit chip modules
US6246581B1 (en) 1999-10-12 2001-06-12 International Business Machines Corporation Heated PCB interconnect for cooled IC chip modules
US6243268B1 (en) 1999-10-12 2001-06-05 International Business Machines Corporation Cooled IC chip modules with an insulated circuit board
US6122926A (en) * 1999-10-12 2000-09-26 International Business Machine Corporation Low thermal conductance insulated cooling assembly for IC chip modules
US6125036A (en) * 1999-10-12 2000-09-26 International Business Machines Corporation Moisture barrier seals for cooled IC chip module assemblies
US6285550B1 (en) * 2000-01-04 2001-09-04 Hewlett Packard Company Sub-cooled processor and companion voltage regulator
US6483078B2 (en) 2000-02-09 2002-11-19 Oceanit Laboratories, Inc. Moisture control system for electrical devices
DE10007467B4 (de) * 2000-02-18 2005-02-03 Rittal Gmbh & Co. Kg Schaltgehäuse mit einem Kühlgerät
EP1160649A1 (de) * 2000-06-02 2001-12-05 Roberto Pena Gonzalez Inneres Kühlungssystem für Rechner
US6462949B1 (en) 2000-08-07 2002-10-08 Thermotek, Inc. Electronic enclosure cooling system
DE10058739A1 (de) * 2000-11-27 2002-08-22 Leukhardt Systemelektronik Industriecomputer
US7167379B2 (en) * 2001-02-16 2007-01-23 Dibene Ii Joseph T Micro-spring interconnect systems for low impedance high power applications
US6611071B2 (en) 2001-08-17 2003-08-26 Siemens Automotive Inc. Embedded electronics for high convection cooling in an engine cooling motor application
US6981543B2 (en) * 2001-09-20 2006-01-03 Intel Corporation Modular capillary pumped loop cooling system
US7134486B2 (en) * 2001-09-28 2006-11-14 The Board Of Trustees Of The Leeland Stanford Junior University Control of electrolysis gases in electroosmotic pump systems
US6942018B2 (en) * 2001-09-28 2005-09-13 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
DE10152239C2 (de) 2001-10-23 2003-11-27 Rittal Gmbh & Co Kg Kühlgerät mit Kältemittel-Kreislauf
US6643132B2 (en) * 2002-01-04 2003-11-04 Intel Corporation Chassis-level thermal interface component for transfer of heat from an electronic component of a computer system
US6836407B2 (en) * 2002-01-04 2004-12-28 Intel Corporation Computer system having a plurality of server units transferring heat to a fluid flowing through a frame-level fluid-channeling structure
US7133283B2 (en) * 2002-01-04 2006-11-07 Intel Corporation Frame-level thermal interface component for transfer of heat from an electronic component of a computer system
US6980450B2 (en) * 2002-01-24 2005-12-27 Inverters Unlimited, Inc. High power density inverter and components thereof
US6606251B1 (en) 2002-02-07 2003-08-12 Cooligy Inc. Power conditioning module
US6845013B2 (en) * 2002-03-04 2005-01-18 Incep Technologies, Inc. Right-angle power interconnect electronic packaging assembly
KR100464046B1 (ko) * 2002-03-14 2005-01-03 엘지전자 주식회사 컴퓨터의 냉각장치
JP3651677B2 (ja) * 2002-07-12 2005-05-25 株式会社東芝 発熱素子冷却装置及び電子機器
JP3629257B2 (ja) * 2002-08-30 2005-03-16 株式会社東芝 電子機器
DE10245103A1 (de) * 2002-09-27 2004-04-08 General Electric Co. Schaltschrank für eine Windenergieanlage und Verfahren zum Betreiben einer Windenergieanlage
US7410484B2 (en) 2003-01-15 2008-08-12 Cryodynamics, Llc Cryotherapy probe
US7273479B2 (en) * 2003-01-15 2007-09-25 Cryodynamics, Llc Methods and systems for cryogenic cooling
US7083612B2 (en) * 2003-01-15 2006-08-01 Cryodynamics, Llc Cryotherapy system
US7148492B2 (en) * 2003-05-13 2006-12-12 Affymetrix, Inc. System, method, and product for providing a wavelength tunable excitation beam
ATE503452T1 (de) 2003-07-18 2011-04-15 Thermotek Inc Thermisches system für eine decke
US8574278B2 (en) 2006-05-09 2013-11-05 Thermotek, Inc. Wound care method and system with one or both of vacuum-light therapy and thermally augmented oxygenation
US8100956B2 (en) 2006-05-09 2012-01-24 Thermotek, Inc. Method of and system for thermally augmented wound care oxygenation
US8778005B2 (en) 2003-07-18 2014-07-15 Thermotek, Inc. Method and system for thermal and compression therapy relative to the prevention of deep vein thrombosis
US8128672B2 (en) 2006-05-09 2012-03-06 Thermotek, Inc. Wound care method and system with one or both of vacuum-light therapy and thermally augmented oxygenation
US7274106B2 (en) * 2003-09-24 2007-09-25 Intel Corporation Packaged electroosmotic pumps using porous frits for cooling integrated circuits
US7355277B2 (en) * 2003-12-31 2008-04-08 Intel Corporation Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package
US6955215B2 (en) * 2004-03-09 2005-10-18 King Fahd University Of Petroleum And Minerals Hybrid cooling system and method for cooling electronic devices
US20050213306A1 (en) * 2004-03-25 2005-09-29 Lockheed Martin Corporation Environmental control method and apparatus for electronic device enclosures
JP4271705B2 (ja) * 2004-05-26 2009-06-03 株式会社カンキョー 空気から水を取り出す方法及びそのための装置
US7129501B2 (en) * 2004-06-29 2006-10-31 Sii Nanotechnology Usa, Inc. Radiation detector system having heat pipe based cooling
US10016583B2 (en) 2013-03-11 2018-07-10 Thermotek, Inc. Wound care and infusion method and system utilizing a thermally-treated therapeutic agent
US10765785B2 (en) 2004-07-19 2020-09-08 Thermotek, Inc. Wound care and infusion method and system utilizing a therapeutic agent
USD679023S1 (en) 2004-07-19 2013-03-26 Thermotek, Inc. Foot wrap
US20060034053A1 (en) 2004-08-12 2006-02-16 Thermotek, Inc. Thermal control system for rack mounting
FR2876812B1 (fr) * 2004-10-15 2006-12-22 J C C Chereau Aeronautique Dispositif a fluide de refroidissement pour ordinateur
US7478541B2 (en) * 2004-11-01 2009-01-20 Tecumseh Products Company Compact refrigeration system for providing multiple levels of cooling
US7149086B2 (en) * 2004-12-10 2006-12-12 Intel Corporation Systems to cool multiple electrical components
DE102004063039B4 (de) * 2004-12-28 2011-09-22 Siemens Ag Anordnung mit einem elektrischen Leistungshalbleiterbauelement und einer Zwei-Phasen-Kühlvorrichtung
JP4738121B2 (ja) * 2005-09-30 2011-08-03 三洋電機株式会社 電子機器の冷却装置および電子機器
JP4196983B2 (ja) * 2005-10-07 2008-12-17 セイコーエプソン株式会社 冷却装置、プロジェクタ及び冷却方法
US7909861B2 (en) 2005-10-14 2011-03-22 Thermotek, Inc. Critical care thermal therapy method and system
US7412844B2 (en) 2006-03-07 2008-08-19 Blue Zone 40 Inc. Method and apparatus for cooling semiconductor chips
TW200734859A (en) 2006-03-15 2007-09-16 Asustek Comp Inc Electronic device with airflow guiding function
US7952873B2 (en) * 2006-06-26 2011-05-31 Raytheon Company Passive conductive cooling module
EP1912110A1 (de) * 2006-10-13 2008-04-16 ASUSTeK Computer Inc. Elektronisches Gerät
JP2008191996A (ja) * 2007-02-06 2008-08-21 Hitachi Ltd ディスクアレイ装置および電子装置
USD662214S1 (en) 2007-04-10 2012-06-19 Thermotek, Inc. Circumferential leg wrap
US7900468B2 (en) * 2007-07-11 2011-03-08 Liebert Corporation Method and apparatus for equalizing a pumped refrigerant system
CN101115370B (zh) * 2007-08-14 2012-05-09 诶比控股集团杭州南广科技有限公司 全固态无线发射设备及电子功率组件双冷源液冷系统
US8758419B1 (en) 2008-01-31 2014-06-24 Thermotek, Inc. Contact cooler for skin cooling applications
US20100039770A1 (en) * 2008-08-15 2010-02-18 Danello Paul A Pneumatic presssure wedge
US7872867B2 (en) * 2008-09-02 2011-01-18 International Business Machines Corporation Cooling system for an electronic component system cabinet
WO2011078754A1 (en) * 2009-12-23 2011-06-30 Telefonaktiebolaget L M Ericsson (Publ) Heat conducting mounting structure, method and radio base station housing arrangement for mounting electronic modules
US8351199B2 (en) * 2010-07-23 2013-01-08 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Computer case with dehumidification
US10512587B2 (en) 2011-07-27 2019-12-24 Thermotek, Inc. Method and apparatus for scalp thermal treatment
US8634192B2 (en) * 2011-09-19 2014-01-21 Dell Products L.P. Information handling system cooling system
KR101928005B1 (ko) 2011-12-01 2019-03-13 삼성전자주식회사 열전 냉각 패키지 및 이의 열관리 방법
US20130153187A1 (en) * 2011-12-14 2013-06-20 International Business Machines Corporation Dual Heat Sinks For Distributing A Thermal Load
US20150062821A1 (en) * 2012-03-22 2015-03-05 Nec Corporation Cooling Structure for Electronic Circuit Board, and Electronic Device Using the Same
WO2013162728A1 (en) 2012-04-24 2013-10-31 Thermotek, Inc. Method and system for therapeutic use of ultra-violet light
CN103808097A (zh) * 2012-11-05 2014-05-21 刘万辉 一种新型多功能半导体冷藏暖藏两用箱的制作方法
US10300180B1 (en) 2013-03-11 2019-05-28 Thermotek, Inc. Wound care and infusion method and system utilizing a therapeutic agent
JP2015012282A (ja) * 2013-07-02 2015-01-19 富士通株式会社 電子装置
AU2014327045B2 (en) 2013-09-24 2019-08-08 Adagio Medical, Inc. Endovascular near critical fluid based cryoablation catheter and related methods
US9669233B2 (en) 2013-11-11 2017-06-06 Thermotek, Inc. Method and system for wound care
CN103687451B (zh) * 2013-12-13 2016-05-11 陕西宝成航空仪表有限责任公司 用于惯性导航类产品中精密器件的散热优化结构
EP3131487A4 (de) 2014-04-17 2017-12-13 Adagio Medical, Inc. Auf nahkritischer flüssigkeit basierender endovaskulärer kryoablationskatheter mit mehreren vorgeformten behandlungsformen
CN107205766B (zh) 2014-11-13 2020-04-14 艾达吉欧医疗公司 压力调控的冷冻消融系统及相关方法
EP3349676A4 (de) 2015-09-18 2019-05-15 Adagio Medical, Inc. Gewebekontaktverifizierungssystem
US10864031B2 (en) 2015-11-30 2020-12-15 Adagio Medical, Inc. Ablation method for creating elongate continuous lesions enclosing multiple vessel entries
JP2018010500A (ja) * 2016-07-14 2018-01-18 富士通株式会社 情報処理装置
CN111225626B (zh) 2017-09-05 2023-11-14 艾达吉欧医疗公司 具有形状记忆探针的消融导管
WO2019139917A1 (en) 2018-01-10 2019-07-18 Adagio Medical, Inc. Cryoablation element with conductive liner
CN110941156B (zh) * 2018-09-25 2023-08-25 富士胶片商业创新有限公司 图像形成装置及基板
US10925179B2 (en) * 2019-06-04 2021-02-16 Arista Networks, Inc. Cooling structures having shielding for electromagnetic inteference
CN114510133B (zh) * 2020-11-16 2024-02-23 英业达科技有限公司 服务器的冷却系统

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU503641B2 (en) * 1977-05-06 1979-09-13 Control Data Corporation Cooling system for data processing apparatus
JPS5755205A (en) * 1980-09-19 1982-04-02 Toyo Tire & Rubber Co Ltd Tire tread for construction car
JPS57152152A (en) * 1981-03-13 1982-09-20 Nippon Univac Kk Cooler
US4498530A (en) * 1981-08-03 1985-02-12 International Business Machines Corporation Flexible thermal conduction element for cooling semiconductor devices
DE3278616D1 (en) * 1982-09-29 1988-07-07 Ibm Electronic assembly with forced convection cooling
JPS59104593A (ja) * 1982-12-07 1984-06-16 株式会社東芝 沸騰水型原子炉の原子炉圧力容器内の水位計測装置
US4489363A (en) * 1983-01-31 1984-12-18 Sperry Corporation Apparatus for cooling integrated circuit chips
JPS60126853A (ja) * 1983-12-14 1985-07-06 Hitachi Ltd 半導体デバイス冷却装置
JPS60160594A (ja) * 1984-01-31 1985-08-22 シャープ株式会社 薄膜el素子
US4546619A (en) * 1984-06-25 1985-10-15 Rohner Thomas G Mechanical cooler for electronics
JPS61220359A (ja) * 1985-03-26 1986-09-30 Hitachi Ltd 半導体モジユ−ル冷却構造体
FR2580060B1 (de) * 1985-04-05 1989-06-09 Nec Corp
US4879632A (en) * 1985-10-04 1989-11-07 Fujitsu Limited Cooling system for an electronic circuit device
US4750086A (en) * 1985-12-11 1988-06-07 Unisys Corporation Apparatus for cooling integrated circuit chips with forced coolant jet
JPS62252197A (ja) * 1986-04-24 1987-11-02 日本電信電話株式会社 電子装置用冷却装置
US4674004A (en) * 1986-07-03 1987-06-16 Burroughs Corporation Parallel-flow air system for cooling electronic equipment
US4851965A (en) * 1987-03-09 1989-07-25 Unisys Corporation Directed air management system for cooling multiple heat sinks
JPH063831B2 (ja) * 1987-04-08 1994-01-12 株式会社日立製作所 冷却装置及びそれを用いた半導体装置
JPH07120866B2 (ja) * 1987-07-23 1995-12-20 富士通株式会社 半導体素子の冷却装置
JPH0821139B2 (ja) * 1987-09-28 1996-03-04 松下電器産業株式会社 信号重畳方法
US4996589A (en) * 1987-10-21 1991-02-26 Hitachi, Ltd. Semiconductor module and cooling device of the same
US4812733A (en) * 1987-10-27 1989-03-14 Richard Tobey Computer element performance enhancer
JPH01143347A (ja) * 1987-11-30 1989-06-05 Komatsu Ltd Lsiチップの集合体の冷却装置
JPH01191917A (ja) * 1988-01-27 1989-08-02 Nec Corp 電子装置の冷却構造
JPH01270296A (ja) * 1988-04-22 1989-10-27 Hitachi Ltd 電子機器およびその冷却方法
JPH01296061A (ja) * 1988-05-19 1989-11-29 Mitsubishi Electric Corp ヒートポンプ式熱制御装置
GB8818069D0 (en) * 1988-07-29 1988-09-28 Baj Ltd Improvements relating to electrodeposited coatings
JPH0760006B2 (ja) * 1988-09-19 1995-06-28 三洋電機株式会社 空気調和機の制御装置
JP2507561B2 (ja) * 1988-10-19 1996-06-12 株式会社日立製作所 半導体の冷却装置
US4901201A (en) * 1988-10-25 1990-02-13 Sundstrand Corporation Plate fin/chic heat exchanger
US5092130A (en) * 1988-11-09 1992-03-03 Mitsubishi Denki Kabushiki Kaisha Multi-stage cold accumulation type refrigerator and cooling device including the same
JPH02196454A (ja) * 1989-01-25 1990-08-03 Hitachi Ltd 半導体パッケージ
JP3120982B2 (ja) * 1989-04-17 2000-12-25 株式会社日立製作所 流体温度制御システム及びそれを用いたコンピユータシステム
US4935864A (en) * 1989-06-20 1990-06-19 Digital Equipment Corporation Localized cooling apparatus for cooling integrated circuit devices
US5063476A (en) * 1989-12-05 1991-11-05 Digital Equipment Corporation Apparatus for controlled air-impingement module cooling
US5285347A (en) * 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
JPH06226899A (ja) * 1993-02-05 1994-08-16 Unitika Ltd 多層構造不織シート

Also Published As

Publication number Publication date
JPH04196395A (ja) 1992-07-16
DE69131273T2 (de) 1999-09-23
EP0489326A2 (de) 1992-06-10
EP0489326B1 (de) 1999-05-26
US5504924A (en) 1996-04-02
EP0489326A3 (en) 1993-06-30
KR920010398A (ko) 1992-06-26
KR950013558B1 (ko) 1995-11-08

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