DE69129060T2 - Halbleitergerät mit Spannungsbelastungskontaktfläche - Google Patents

Halbleitergerät mit Spannungsbelastungskontaktfläche

Info

Publication number
DE69129060T2
DE69129060T2 DE69129060T DE69129060T DE69129060T2 DE 69129060 T2 DE69129060 T2 DE 69129060T2 DE 69129060 T DE69129060 T DE 69129060T DE 69129060 T DE69129060 T DE 69129060T DE 69129060 T2 DE69129060 T2 DE 69129060T2
Authority
DE
Germany
Prior art keywords
semiconductor device
stress testing
contact surface
voltage stress
voltage load
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69129060T
Other languages
English (en)
Other versions
DE69129060D1 (de
Inventor
Hiroaki Tanaka
Masaru Koyanagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE69129060D1 publication Critical patent/DE69129060D1/de
Application granted granted Critical
Publication of DE69129060T2 publication Critical patent/DE69129060T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/316—Testing of analog circuits
    • G01R31/3161—Marginal testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/30—Marginal testing, e.g. by varying supply voltage
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31712—Input or output aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31712—Input or output aspects
    • G01R31/31715—Testing of input or output circuits; test of circuitry between the I/C pins and the functional core, e.g. testing of input or output driver, receiver, buffer
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/409—Read-write [R-W] circuits 
    • G11C11/4094—Bit-line management or control circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/50—Marginal testing, e.g. race, voltage or current testing
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
DE69129060T 1990-12-27 1991-12-23 Halbleitergerät mit Spannungsbelastungskontaktfläche Expired - Fee Related DE69129060T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP41876490A JP3381929B2 (ja) 1990-12-27 1990-12-27 半導体装置

Publications (2)

Publication Number Publication Date
DE69129060D1 DE69129060D1 (de) 1998-04-16
DE69129060T2 true DE69129060T2 (de) 1998-07-30

Family

ID=18526550

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69129060T Expired - Fee Related DE69129060T2 (de) 1990-12-27 1991-12-23 Halbleitergerät mit Spannungsbelastungskontaktfläche

Country Status (5)

Country Link
US (1) US5357193A (de)
EP (1) EP0492609B1 (de)
JP (1) JP3381929B2 (de)
KR (1) KR950014558B1 (de)
DE (1) DE69129060T2 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2533221B2 (ja) * 1990-05-11 1996-09-11 株式会社東芝 ダイナミック型ランダムアクセスメモリ
US5391984A (en) * 1991-11-01 1995-02-21 Sgs-Thomson Microelectronics, Inc. Method and apparatus for testing integrated circuit devices
US5648730A (en) * 1994-11-30 1997-07-15 Texas Instruments Incorporated Large integrated circuit with modular probe structures
US5627787A (en) * 1995-01-03 1997-05-06 Sgs-Thomson Microelectronics, Inc. Periphery stress test for synchronous RAMs
KR100375177B1 (ko) * 1995-05-19 2003-05-09 마츠시타 덴끼 산교 가부시키가이샤 반도체 장치의 검사방법
KR100220949B1 (ko) * 1996-11-06 1999-09-15 김영환 웨이퍼 번-인 회로
JPH10269767A (ja) * 1997-03-19 1998-10-09 Mitsubishi Electric Corp 半導体装置
US5898706A (en) * 1997-04-30 1999-04-27 International Business Machines Corporation Structure and method for reliability stressing of dielectrics
US6037795A (en) * 1997-09-26 2000-03-14 International Business Machines Corporation Multiple device test layout
US5999466A (en) * 1998-01-13 1999-12-07 Micron Technology, Inc. Method, apparatus and system for voltage screening of integrated circuits
US6055199A (en) * 1998-10-21 2000-04-25 Mitsubishi Denki Kabushiki Kaisha Test circuit for a semiconductor memory device and method for burn-in test
US6327682B1 (en) 1999-03-22 2001-12-04 Taiwan Semiconductor Manufacturing Company Wafer burn-in design for DRAM and FeRAM devices
JP2001067898A (ja) * 1999-08-30 2001-03-16 Mitsubishi Electric Corp 半導体記憶装置
JP4783487B2 (ja) * 2000-02-22 2011-09-28 株式会社カネカ 太陽電池モジュールの逆バイアス処理装置
JP2004247026A (ja) * 2003-01-24 2004-09-02 Renesas Technology Corp 半導体集積回路及びｉｃカード
KR100542695B1 (ko) * 2003-11-13 2006-01-11 주식회사 하이닉스반도체 반도체 소자의 테스트 모드 회로
KR20100125099A (ko) * 2009-05-20 2010-11-30 삼성전자주식회사 반도체 장치
KR20210026432A (ko) * 2019-08-30 2021-03-10 에스케이하이닉스 주식회사 반도체 메모리 장치

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3961254A (en) * 1974-12-20 1976-06-01 International Business Machines Corporation Testing embedded arrays
DE2905294A1 (de) * 1979-02-12 1980-08-21 Philips Patentverwaltung Integrierte schaltungsanordnung in mos-technik mit feldeffekttransistoren
DE2905271A1 (de) * 1979-02-12 1980-08-21 Philips Patentverwaltung Integrierte schaltungsanordnung in mos-technik mit feldeffekttransistoren
DE2944149C2 (de) * 1979-11-02 1985-02-21 Philips Patentverwaltung Gmbh, 2000 Hamburg Integrierte Schaltungsanordnung in MOS-Technik
WO1982000917A1 (en) * 1980-09-08 1982-03-18 Proebsting R Tape burn-in circuit
EP0059184A1 (de) * 1980-09-08 1982-09-08 Mostek Corporation Funktionstest für halbleiterspeicher bei versorgungsspannungsgrenzwerten
US4357703A (en) * 1980-10-09 1982-11-02 Control Data Corporation Test system for LSI circuits resident on LSI chips
US4519076A (en) * 1981-12-28 1985-05-21 National Semiconductor Corporation Memory core testing system
JPS59500840A (ja) * 1982-05-17 1984-05-10 モトロ−ラ・インコ−ポレ−テツド メモリの加速試験用のパッド
JPS60235455A (ja) * 1984-05-09 1985-11-22 Toshiba Corp ダイナミツクメモリ−
JPS61265829A (ja) * 1985-05-20 1986-11-25 Fujitsu Ltd 半導体集積回路
US4733168A (en) * 1986-03-21 1988-03-22 Harris Corporation Test enabling circuit for enabling overhead test circuitry in programmable devices
US4970454A (en) * 1986-12-09 1990-11-13 Texas Instruments Incorporated Packaged semiconductor device with test circuits for determining fabrication parameters
US4751679A (en) * 1986-12-22 1988-06-14 Motorola, Inc. Gate stress test of a MOS memory
EP0387379B1 (de) * 1989-03-16 1995-01-18 Siemens Aktiengesellschaft Integrierter Halbleiterspeicher vom Typ DRAM und Verfahren zu seinem Testen
US5107208A (en) * 1989-12-19 1992-04-21 North American Philips Corporation System for partitioning and testing submodule circuits of an integrated circuit

Also Published As

Publication number Publication date
JP3381929B2 (ja) 2003-03-04
JPH04230049A (ja) 1992-08-19
US5357193A (en) 1994-10-18
DE69129060D1 (de) 1998-04-16
EP0492609A2 (de) 1992-07-01
EP0492609B1 (de) 1998-03-11
KR950014558B1 (ko) 1995-12-05
EP0492609A3 (en) 1993-04-21
KR920013455A (ko) 1992-07-29

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Legal Events

Date Code Title Description
8320 Willingness to grant licences declared (paragraph 23)
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee