DE69108908T2 - Vorrichtung zur behandlung einer einzelnen waferscheibe. - Google Patents

Vorrichtung zur behandlung einer einzelnen waferscheibe.

Info

Publication number
DE69108908T2
DE69108908T2 DE69108908T DE69108908T DE69108908T2 DE 69108908 T2 DE69108908 T2 DE 69108908T2 DE 69108908 T DE69108908 T DE 69108908T DE 69108908 T DE69108908 T DE 69108908T DE 69108908 T2 DE69108908 T2 DE 69108908T2
Authority
DE
Germany
Prior art keywords
wafer
reference axis
fingers
shell
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69108908T
Other languages
German (de)
English (en)
Other versions
DE69108908D1 (de
Inventor
Aleksander Owczarz
Raymon Thompson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semitool Inc
Original Assignee
Semitool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24096519&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69108908(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Semitool Inc filed Critical Semitool Inc
Application granted granted Critical
Publication of DE69108908D1 publication Critical patent/DE69108908D1/de
Publication of DE69108908T2 publication Critical patent/DE69108908T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10P72/0462—
    • H10P72/0424—
    • H10P72/0426—
    • H10P72/7602—
    • H10P72/7608—
    • H10P72/7624—
    • H10P72/7626—
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Weting (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Exchange Systems With Centralized Control (AREA)
  • Supplying Of Containers To The Packaging Station (AREA)
  • Die Bonding (AREA)
DE69108908T 1990-05-18 1991-04-24 Vorrichtung zur behandlung einer einzelnen waferscheibe. Expired - Fee Related DE69108908T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/526,243 US5168887A (en) 1990-05-18 1990-05-18 Single wafer processor apparatus
PCT/US1991/002817 WO1991018414A1 (en) 1990-05-18 1991-04-24 Single wafer processor apparatus

Publications (2)

Publication Number Publication Date
DE69108908D1 DE69108908D1 (de) 1995-05-18
DE69108908T2 true DE69108908T2 (de) 1995-11-16

Family

ID=24096519

Family Applications (2)

Application Number Title Priority Date Filing Date
DE0644580T Pending DE644580T1 (de) 1990-05-18 1991-04-24 Ein Halbleiterscheibenbearbeiter.
DE69108908T Expired - Fee Related DE69108908T2 (de) 1990-05-18 1991-04-24 Vorrichtung zur behandlung einer einzelnen waferscheibe.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE0644580T Pending DE644580T1 (de) 1990-05-18 1991-04-24 Ein Halbleiterscheibenbearbeiter.

Country Status (7)

Country Link
US (1) US5168887A (cg-RX-API-DMAC10.html)
EP (4) EP1028454A3 (cg-RX-API-DMAC10.html)
JP (2) JP3190331B2 (cg-RX-API-DMAC10.html)
AT (1) ATE121220T1 (cg-RX-API-DMAC10.html)
AU (1) AU7794891A (cg-RX-API-DMAC10.html)
DE (2) DE644580T1 (cg-RX-API-DMAC10.html)
WO (1) WO1991018414A1 (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19825381B4 (de) * 1998-05-28 2004-10-28 Institut für Halbleiterphysik Frankfurt (Oder) GmbH Verfahren zur Handhabung von Wafern großen Durchmessers während eines Temperprozesses

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US5222310A (en) * 1990-05-18 1993-06-29 Semitool, Inc. Single wafer processor with a frame
US5658387A (en) * 1991-03-06 1997-08-19 Semitool, Inc. Semiconductor processing spray coating apparatus
JPH07245285A (ja) * 1994-03-03 1995-09-19 Dainippon Screen Mfg Co Ltd 基板処理装置
US5664337A (en) * 1996-03-26 1997-09-09 Semitool, Inc. Automated semiconductor processing systems
AT405225B (de) * 1995-05-02 1999-06-25 Sez Semiconduct Equip Zubehoer Vorrichtung zum behandeln annähernd runder oder kreisscheibenförmiger gegenstände, insbesondere siliziumwafer
US5744417A (en) * 1996-05-02 1998-04-28 Lyondell Petrochemical Company Supported catalyst
US6672820B1 (en) 1996-07-15 2004-01-06 Semitool, Inc. Semiconductor processing apparatus having linear conveyer system
US6203582B1 (en) * 1996-07-15 2001-03-20 Semitool, Inc. Modular semiconductor workpiece processing tool
US6091498A (en) * 1996-07-15 2000-07-18 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
US6599412B1 (en) * 1997-09-30 2003-07-29 Semitool, Inc. In-situ cleaning processes for semiconductor electroplating electrodes
US6001234A (en) * 1997-09-30 1999-12-14 Semitool, Inc. Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot
US5980706A (en) * 1996-07-15 1999-11-09 Semitool, Inc. Electrode semiconductor workpiece holder
US6805778B1 (en) * 1996-07-15 2004-10-19 Semitool, Inc. Contact assembly for supplying power to workpieces during electrochemical processing
US6358388B1 (en) * 1996-07-15 2002-03-19 Semitool, Inc. Plating system workpiece support having workpiece-engaging electrodes with distal contact-part and dielectric cover
US6645355B2 (en) 1996-07-15 2003-11-11 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
US5731678A (en) * 1996-07-15 1998-03-24 Semitool, Inc. Processing head for semiconductor processing machines
US7087143B1 (en) 1996-07-15 2006-08-08 Semitool, Inc. Plating system for semiconductor materials
US6228231B1 (en) 1997-05-29 2001-05-08 International Business Machines Corporation Electroplating workpiece fixture having liquid gap spacer
EP1027481A1 (en) 1997-09-30 2000-08-16 Semitool, Inc. Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations
US6921468B2 (en) * 1997-09-30 2005-07-26 Semitool, Inc. Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations
US6090711A (en) * 1997-09-30 2000-07-18 Semitool, Inc. Methods for controlling semiconductor workpiece surface exposure to processing liquids
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
JP2002506488A (ja) 1998-04-21 2002-02-26 アプライド マテリアルズ インコーポレイテッド 電気化学堆積システム及び基体の電気めっき方法
US6416647B1 (en) * 1998-04-21 2002-07-09 Applied Materials, Inc. Electro-chemical deposition cell for face-up processing of single semiconductor substrates
US6071388A (en) * 1998-05-29 2000-06-06 International Business Machines Corporation Electroplating workpiece fixture having liquid gap spacer
US6497801B1 (en) 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US6494984B2 (en) 1999-01-14 2002-12-17 Semitool, Inc. Flat media processing machine
US6190103B1 (en) * 1999-03-31 2001-02-20 Gasonics International Corporation Wafer transfer device and method
US6557237B1 (en) * 1999-04-08 2003-05-06 Applied Materials, Inc. Removable modular cell for electro-chemical plating and method
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7189318B2 (en) 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US6916412B2 (en) 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
EP1192298A4 (en) 1999-04-13 2006-08-23 Semitool Inc APPENDIX FOR THE ELECTROCHEMICAL TREATMENT OF A WORKPIECE
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7585398B2 (en) 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
TW499696B (en) * 1999-04-27 2002-08-21 Tokyo Electron Ltd Processing apparatus and processing method
JP3367476B2 (ja) 1999-07-07 2003-01-14 住友電気工業株式会社 路上送信装置
US6796517B1 (en) 2000-03-09 2004-09-28 Advanced Micro Devices, Inc. Apparatus for the application of developing solution to a semiconductor wafer
US20040178065A1 (en) * 2001-03-16 2004-09-16 Semitool, Inc. Electrode semiconductor workpiece holder and processing methods
US6645344B2 (en) 2001-05-18 2003-11-11 Tokyo Electron Limited Universal backplane assembly and methods
WO2003018874A2 (en) 2001-08-31 2003-03-06 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7247223B2 (en) 2002-05-29 2007-07-24 Semitool, Inc. Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces
US7114903B2 (en) 2002-07-16 2006-10-03 Semitool, Inc. Apparatuses and method for transferring and/or pre-processing microelectronic workpieces
US20040118694A1 (en) * 2002-12-19 2004-06-24 Applied Materials, Inc. Multi-chemistry electrochemical processing system
US20040255442A1 (en) * 2003-06-19 2004-12-23 Mcdiarmid James Methods and apparatus for processing workpieces
JP4265306B2 (ja) * 2003-06-27 2009-05-20 株式会社東京精密 ウェーハ受渡し装置
US20050077182A1 (en) * 2003-10-10 2005-04-14 Applied Materials, Inc. Volume measurement apparatus and method
KR100829923B1 (ko) * 2006-08-30 2008-05-16 세메스 주식회사 스핀헤드 및 이를 이용하는 기판처리방법
FR2912210B1 (fr) 2007-02-05 2013-01-11 Frisquet Sa Echangeur thermique pour chaudiere, chaudiere equipee d'un tel echangeur et procede de fabrication d'un tel echangeur
US8309045B2 (en) 2011-02-11 2012-11-13 General Electric Company System and method for controlling emissions in a combustion system
US9421617B2 (en) 2011-06-22 2016-08-23 Tel Nexx, Inc. Substrate holder
US8967935B2 (en) 2011-07-06 2015-03-03 Tel Nexx, Inc. Substrate loader and unloader

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US4161356A (en) * 1977-01-21 1979-07-17 Burchard John S Apparatus for in-situ processing of photoplates
JPS57166250A (en) * 1981-04-03 1982-10-13 Dainippon Screen Mfg Co Ltd Conveyance positioning device of sheet material
US4339297A (en) * 1981-04-14 1982-07-13 Seiichiro Aigo Apparatus for etching of oxide film on semiconductor wafer
US4429983A (en) * 1982-03-22 1984-02-07 International Business Machines Corporation Developing apparatus for exposed photoresist coated wafers
JPS59124591A (ja) * 1982-12-30 1984-07-18 大日本スクリ−ン製造株式会社 薄板物の移送装置
JPS59201782A (ja) * 1983-04-23 1984-11-15 大日本スクリ−ン製造株式会社 ウエハ等の薄板物搬送装置
US4439261A (en) * 1983-08-26 1984-03-27 International Business Machines Corporation Composite pallet
US4519846A (en) * 1984-03-08 1985-05-28 Seiichiro Aigo Process for washing and drying a semiconductor element
US4745422A (en) * 1985-11-18 1988-05-17 Kabushiki Kaisha Toshiba Automatic developing apparatus
US4724317A (en) * 1985-12-05 1988-02-09 Baxter Travenol Laboratories, Inc. Optical data collection apparatus and method used with moving members
US4651440A (en) * 1986-05-16 1987-03-24 Eastman Kodak Company Spin drying apparatus
JPS6314434A (ja) * 1986-07-04 1988-01-21 Dainippon Screen Mfg Co Ltd 基板表面処理方法および装置
US4788994A (en) * 1986-08-13 1988-12-06 Dainippon Screen Mfg. Co. Wafer holding mechanism
JPH0834205B2 (ja) * 1986-11-21 1996-03-29 株式会社東芝 ドライエツチング装置
JPS63133545A (ja) * 1986-11-25 1988-06-06 Dainippon Screen Mfg Co Ltd 熱処理装置の基板移載搬送装置
US4817556A (en) * 1987-05-04 1989-04-04 Varian Associates, Inc. Apparatus for retaining wafers
JPH0617295Y2 (ja) * 1987-11-27 1994-05-02 大日本スクリーン製造株式会社 基板受け渡し装置
JPH01304732A (ja) * 1988-06-01 1989-12-08 Nec Corp 半導体ウェハの洗浄装置
SU1734865A1 (ru) * 1988-07-18 1992-05-23 Московское научно-производственное объединение "Биофизприбор" Устройство дл контрол центрифуги
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19825381B4 (de) * 1998-05-28 2004-10-28 Institut für Halbleiterphysik Frankfurt (Oder) GmbH Verfahren zur Handhabung von Wafern großen Durchmessers während eines Temperprozesses

Also Published As

Publication number Publication date
JP3190331B2 (ja) 2001-07-23
DE644580T1 (de) 1995-11-09
JP2001291692A (ja) 2001-10-19
WO1991018414A1 (en) 1991-11-28
AU7794891A (en) 1991-12-10
EP0530230B1 (en) 1995-04-12
ATE121220T1 (de) 1995-04-15
EP1028454A3 (en) 2003-09-24
DE69108908D1 (de) 1995-05-18
EP0635872A2 (en) 1995-01-25
EP1028454A2 (en) 2000-08-16
JP3545713B2 (ja) 2004-07-21
EP0644580A3 (en) 1995-05-24
EP0530230A1 (en) 1993-03-10
US5168887A (en) 1992-12-08
EP0635872A3 (cg-RX-API-DMAC10.html) 1995-03-01
EP0644580A2 (en) 1995-03-22
JPH05507179A (ja) 1993-10-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee