DE644580T1 - Ein Halbleiterscheibenbearbeiter. - Google Patents

Ein Halbleiterscheibenbearbeiter.

Info

Publication number
DE644580T1
DE644580T1 DE0644580T DE94115502T DE644580T1 DE 644580 T1 DE644580 T1 DE 644580T1 DE 0644580 T DE0644580 T DE 0644580T DE 94115502 T DE94115502 T DE 94115502T DE 644580 T1 DE644580 T1 DE 644580T1
Authority
DE
Germany
Prior art keywords
processing
wafer
wall
wafer carrier
processing head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE0644580T
Other languages
English (en)
Inventor
Aleksander Owczarz
Raymon F Thompson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semitool Inc
Original Assignee
Semitool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24096519&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE644580(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Semitool Inc filed Critical Semitool Inc
Publication of DE644580T1 publication Critical patent/DE644580T1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Weting (AREA)
  • Exchange Systems With Centralized Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Supplying Of Containers To The Packaging Station (AREA)
  • Die Bonding (AREA)

Claims (17)

- * Lippert, Stachow, Schmidt L-Gu/hg ^ & Partner 07· Juni 1995 Patentanwalts Frankenforster Straße 135-137 D-51427 Bergisch Gladbach 115 502.0 SEMITOOL, INC. Kalispell, Montana 59901 Patentansprüche
1. Vorrichtung zur Bearbeitung von Halbleiterwafern oder ähnlichen Gegenständen, mit einem Bearbeitungsbehalter (70) und einem Waferhalter (40) zur Halterung eines Wafers oder eines anderen Gegenstandes innerhalb des Bearbeitungsbehälters, dadurch gekennzeich-0 net, daß der Bearbeitungsbehalter eine bewegbare Wand (72) aufweist, welche gegenüber anderen Teilen des Bearbeitungsbehälters (71) dichtend abschließt und welche von diesen kontrolliert entfernbar ist, so daß Bearbeitungsflüssigkeiten passieren können.
2. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß Betätigungsmittel (84) zur kontrollierten Bewegung der bewegbaren Wand (72) vorgesehen sind.
3. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß die bewegbare Wand eine Bodenwand des Bearbeitungsbehälters darstellt.
4. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß ein Ablauf (85) vorgesehen ist, welcher zugänglich ist, wenn die bewegbare Wand sich in einem geöffneten Zustand befindet.
5. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß ein Balg (80) vorgesehen ist, welcher mit der bewegbaren Wand verbunden ist.
6. Vorrichtung zur Bearbeitung einzelner Wafer mit einem Bearbeitungskopf (12), welcher aufweist:
einen Waferträger (30), der für Bewegungen relativ zu dem Bearbeitungskopf (12) angebracht ist und eine innere und eine äußere Oberfläche (31, 32) aufweist,
betreibbar mit dem Waferträger (30) verbundene Antriebsmittel (34) zur wahlweisen Bewegung des Waferträgers relativ zu dem Bearbeitungskopf und
15
eine Mehrzahl von Einspannfingern (40), welche zur wahlweisen Halterung eines Wafers (10) benachbart der äußeren Fläche (32) des Waferträgers (30) angeordnet sind,
dadurch gekennzeichnet, daß eine Basis (70) der Bearbeitungsvorrichtung vorgesehen ist, die einen Behälter mit einer Seitenwand (71), einer abdichtenden Oberfläche (41) und einen bewegbaren Boden (72) aufweist, welcher mit der abdichtenden Fläche (41) zur Anlage bringbar ist, wobei die Seitenwand (71) und der Boden (72) zusammen einen nach oben hin geöffneten Innenraum des Gefäßes bilden.
7. Vorrichtung nach Anspruch 6, dadurch g e kennzeichnet, daß die Basis (70) der Bearbeitungsvorrichtung desweiteren eine ringförmige Rinne (78) über der Seitenwand (71) aufweist, um über die Seitenwand (71) auswärts entwichene Flüssigkeit aufzufangen.
8. Vorrichtung nach Anspruch 6 oder 7, dadurch gekennzeichnet, daß die Basis (70) der Bearbeitungsvorrichtung desweiteren aufweist:
eine Einfassung einer Wand mit einer unteren Wand (82), welche sich über den Boden der zylindrischen Wand (71) erstreckt, und
einen ringförmigen Balg (80), der zwischen der unteren Wand (82) der Einfassung und dem Boden (72) des Behälters zur beweglichen Unterstützung des Bodens (72) während einer axialen Bewegung relativ zu der Seitenwand (71) des Behälters angeordnet ist.
10
9. Vorrichtung zur Bearbeitung einzelner Wafer mit einem Bearbeitungskopf (12), welcher aufweist:
einen Waferträger (30), der für Bewegungen relativ zu dem Bearbeitungskopf (12) angebracht ist und eine innere und eine äußere Oberfläche (31, 32) aufweist,
betreibbar mit dem Waferträger (30) verbundene Antriebsmittel (34) zur wahlweisen Bewegung des Waferträgers relativ zu dem Bearbeitungskopf und
eine Mehrzahl von mit dem Waferträger verbundene Einspannfinger (40) zur Halterung eines Wafers (10) benachbart der äußeren Oberfläche (32) des Waferträgers (30),
dadurch gekennzeichnet, daß die Einspannfinger (40) über die äußere Oberfläche des Waferträgers (30) vorstehen und daß Betätigungsmittel (50, 51) zur wahlweisen Bewegung der Einspannfinger (40) durch Abwinkelung zwischen einer geschlossenen Position und einer offenen Position vorgesehen sind.
10. Vorrichtung nach Anspruch 9, dadurch gekennzeichnet, daß eine Ummantelung (18) mit einem den Waferträger (30) umgebenen, peripheren Rand (19) vorgesehen ist, wobei der Rand dazu geeignet ist, auf eine komplementäre periphere Fläche (75) einzuwirken, welche über einer den Bearbeitungskopf (12) tragenden Bearbei-
tungsbasis (70) angeordnet ist.
11. Vorrichtung nach Anspruch 9 oder 10, dadurch gekennzeichnet, daß jeder Finger (40) einzeln in dem Waferträger (30) innerhalb einer flexiblen, tragenden Scheidewand (42) befestigt ist.
12. Vorrichtung nach einem der Ansprüche 9 bis 11, dadurch gekennzeichnet, daß die Betäti- gungsmittel einen ringförmigen Ring (50) und zumindest ein lineares, innerhalb des Bearbeitungskopfes (12) angeordnetes und mit dem ringförmigen Ring (50) verbundenes Betätigungsmittel (51) aufweisen.
13. Vorrichtung nach einem der Ansprüche 9 bis 11, dadurch gekennzeichnet, daß biegsame federnde Mittel (53) vorgesehen sind, die betreibbar mit den Fingern (40) verbunden sind, um diese im Normalfall in deren geschlossene Stellung zu drängen.
14. Vorrichtung nach Anspruch 13, dadurch gekennzeichnet, daß die Betätigungsmittel einen ringförmigen Ring (50) und zumindest ein lineares, innerhalb des Bearbeitungskopfes (12) angeordnetes und mit 5 dem ringförmigen Ring (50) verbundenes Betätigungsmittel (51) aufweisen.
15. Basis (70) einer Bearbeitungsvorrichtung zur Verwendung mit einem bewegbaren Bearbeitungskopf (12) für einen einzelnen Halbleiterwafer, wobei die Basis der Bearbeitungsvorrichtung einen stationären Bearbeitungsbehälter aufweist, innerhalb dessen zumindest eine Oberfläche eines Wafers (10), der durch einen transportablen Bearbeitungskopf (12) gehalten ist, einem Kontakt mit einer Bearbei- tungsflüssigkeit unterworfen wird, dadurch gekennzeichnet, daß der Behälter eine stationäre, kreisförmig umgebende Seitenwand (71) mit einer abdichtenden Fläche und eine axial bewegliche Bodenwand
(72) aufweist, die dazu geeignet ist, an der abdichtenden Fläche der Seitenwand (71) abdichtend anzuliegen, wobei die Seitenwand (71) und die Bodenwand (72) zusammen ein nach oben hin offenes Inneres des Gefäßes bilden.
5
16. Basis einer Bearbeitungsvorrichtung nach Anspruch 10, dadurch gekennzeichnet, daß eine Einfassung mit einer unteren Wand (82) und ein kreisförmiger Balg (80), der zwischen der unteren Wand (82) der Einfassung und der Bodenwand (72) des Behälters zur beweglichen Unterstützung der Bodenwand (72) angeordnet ist, vorgesehen sind.
17. Basis einer Bearbeitungsvorrichtung nach Anspruch 11, dadurch gekennzeichnet, daß Betätigungsmittel (84) innerhalb des Balges (80) zur Bewegung des Bodens (72) vorgesehen sind.
DE0644580T 1990-05-18 1991-04-24 Ein Halbleiterscheibenbearbeiter. Pending DE644580T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/526,243 US5168887A (en) 1990-05-18 1990-05-18 Single wafer processor apparatus

Publications (1)

Publication Number Publication Date
DE644580T1 true DE644580T1 (de) 1995-11-09

Family

ID=24096519

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69108908T Expired - Fee Related DE69108908T2 (de) 1990-05-18 1991-04-24 Vorrichtung zur behandlung einer einzelnen waferscheibe.
DE0644580T Pending DE644580T1 (de) 1990-05-18 1991-04-24 Ein Halbleiterscheibenbearbeiter.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69108908T Expired - Fee Related DE69108908T2 (de) 1990-05-18 1991-04-24 Vorrichtung zur behandlung einer einzelnen waferscheibe.

Country Status (7)

Country Link
US (1) US5168887A (de)
EP (4) EP1028454A3 (de)
JP (2) JP3190331B2 (de)
AT (1) ATE121220T1 (de)
AU (1) AU7794891A (de)
DE (2) DE69108908T2 (de)
WO (1) WO1991018414A1 (de)

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JP2001291692A (ja) 2001-10-19
DE69108908T2 (de) 1995-11-16
AU7794891A (en) 1991-12-10
EP1028454A2 (de) 2000-08-16
JPH05507179A (ja) 1993-10-14
DE69108908D1 (de) 1995-05-18
EP1028454A3 (de) 2003-09-24
JP3190331B2 (ja) 2001-07-23
EP0644580A3 (de) 1995-05-24
EP0635872A3 (de) 1995-03-01
US5168887A (en) 1992-12-08
EP0635872A2 (de) 1995-01-25
WO1991018414A1 (en) 1991-11-28
EP0530230A1 (de) 1993-03-10
EP0644580A2 (de) 1995-03-22
EP0530230B1 (de) 1995-04-12
ATE121220T1 (de) 1995-04-15
JP3545713B2 (ja) 2004-07-21

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