DE69030234T2 - Lichtvernetzbares kunststofflaminat und verfahren zur herstellung einer gedruckten leiterplatte unter dessen verwendung - Google Patents

Lichtvernetzbares kunststofflaminat und verfahren zur herstellung einer gedruckten leiterplatte unter dessen verwendung

Info

Publication number
DE69030234T2
DE69030234T2 DE69030234T DE69030234T DE69030234T2 DE 69030234 T2 DE69030234 T2 DE 69030234T2 DE 69030234 T DE69030234 T DE 69030234T DE 69030234 T DE69030234 T DE 69030234T DE 69030234 T2 DE69030234 T2 DE 69030234T2
Authority
DE
Germany
Prior art keywords
producing
circuit board
printed circuit
board under
plastic laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69030234T
Other languages
English (en)
Other versions
DE69030234D1 (de
Inventor
Hideki Matsuda
Jiro Sato
Toru Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Asahi Kasei Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd, Asahi Kasei Kogyo KK filed Critical Asahi Chemical Industry Co Ltd
Publication of DE69030234D1 publication Critical patent/DE69030234D1/de
Application granted granted Critical
Publication of DE69030234T2 publication Critical patent/DE69030234T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
DE69030234T 1989-05-17 1990-05-17 Lichtvernetzbares kunststofflaminat und verfahren zur herstellung einer gedruckten leiterplatte unter dessen verwendung Expired - Fee Related DE69030234T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP12132589 1989-05-17
JP24026289 1989-09-18
JP30487889 1989-11-27
PCT/JP1990/000630 WO1990014225A1 (fr) 1989-05-17 1990-05-17 Stratifie en resine photopolymerisable et procede de production d'une carte de cablage imprime l'utilisant

Publications (2)

Publication Number Publication Date
DE69030234D1 DE69030234D1 (de) 1997-04-24
DE69030234T2 true DE69030234T2 (de) 1997-10-09

Family

ID=27314225

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69030234T Expired - Fee Related DE69030234T2 (de) 1989-05-17 1990-05-17 Lichtvernetzbares kunststofflaminat und verfahren zur herstellung einer gedruckten leiterplatte unter dessen verwendung

Country Status (8)

Country Link
US (1) US5356755A (de)
EP (1) EP0425703B1 (de)
JP (1) JPH0798381B2 (de)
KR (1) KR940004022B1 (de)
CA (1) CA2022753C (de)
DE (1) DE69030234T2 (de)
SG (1) SG43840A1 (de)
WO (1) WO1990014225A1 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5648320A (en) * 1985-05-31 1997-07-15 Jacobs; Richard L. Method of manufacturing ceramic superconductor circuit board
JP3252442B2 (ja) * 1992-06-03 2002-02-04 日立化成工業株式会社 プリント回路板の製造法及び非液体感光性樹脂組成物
JP3272045B2 (ja) * 1992-08-20 2002-04-08 日本合成化学工業株式会社 プリント配線板の製造方法
US5663212A (en) * 1993-02-05 1997-09-02 Fuji Photo Film Co., Ltd. Light-sensitive resin composition
DE4310814C2 (de) * 1993-04-02 1997-11-27 Du Pont Deutschland Verfahren zur Beschichtung von Leiterplatten
US5610371A (en) * 1994-03-15 1997-03-11 Fujitsu Limited Electrical connecting device and method for making same
US5616256A (en) * 1993-11-22 1997-04-01 Ibiden Co., Inc. Printed wiring board and process for producing thereof
JP3366722B2 (ja) * 1994-03-11 2003-01-14 旭化成株式会社 光硬化性樹脂積層体及びそれを用いるプリント配線板の製造方法
JPH07281437A (ja) * 1994-04-14 1995-10-27 Asahi Chem Ind Co Ltd 光硬化性樹脂積層体
US5773195A (en) * 1994-12-01 1998-06-30 International Business Machines Corporation Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic structures including the cap, and a process of forming the cap and for forming multi-layer electronic structures including the cap
TW323430B (de) * 1995-04-25 1997-12-21 Goon Kagaku Kogyo Kk
JP3782134B2 (ja) * 1995-07-20 2006-06-07 旭化成エレクトロニクス株式会社 プリント配線板の製造方法
JP3627394B2 (ja) * 1996-08-13 2005-03-09 東レ株式会社 感光性樹脂凸版材
JPH10161308A (ja) * 1996-11-26 1998-06-19 Asahi Chem Ind Co Ltd 光重合性樹脂組成物およびその用途
JPH10198027A (ja) * 1997-01-14 1998-07-31 Asahi Chem Ind Co Ltd 光重合性樹脂及びその用途
US6090474A (en) * 1998-09-01 2000-07-18 International Business Machines Corporation Flowable compositions and use in filling vias and plated through-holes
US6485892B1 (en) 1999-12-17 2002-11-26 International Business Machines Corporation Method for masking a hole in a substrate during plating
DE112005000522T5 (de) 2004-03-03 2007-01-18 Shinko Electric Industries Co., Ltd. Platinen-Herstellungsverfahren und Platine
US8387228B2 (en) 2004-06-10 2013-03-05 Ati Properties, Inc. Clad alloy substrates and method for making same
WO2006121894A2 (en) * 2005-05-09 2006-11-16 Roamware, Inc. Dynamic generation of csi for inbound roamers
KR101175079B1 (ko) * 2007-12-18 2012-08-21 아사히 가세이 이-매터리얼즈 가부시키가이샤 네거티브형 감광성 수지 적층체를 사용한 레지스트 경화물의 제조 방법, 네거티브형 감광성 수지 적층체, 및 네거티브형 감광성 수지 적층체의 사용 방법
JP5471987B2 (ja) * 2010-09-07 2014-04-16 株式会社大真空 電子部品パッケージ用封止部材、電子部品パッケージ、及び電子部品パッケージ用封止部材の製造方法
JP6274498B2 (ja) * 2013-11-08 2018-02-07 日東電工株式会社 光導波路用感光性樹脂組成物および光導波路コア層形成用光硬化性フィルム、ならびにそれを用いた光導波路、光・電気伝送用混載フレキシブルプリント配線板
KR102582577B1 (ko) * 2014-05-23 2023-09-25 가부시끼가이샤 레조낙 레지스트 패턴의 형성 방법, 프린트 배선판의 제조 방법, 투영 노광용 감광성 수지 조성물 및 감광성 엘리먼트
JP6576152B2 (ja) * 2015-08-05 2019-09-18 キヤノン株式会社 構造物の製造方法、および液体吐出ヘッドの製造方法
CN110798983B (zh) * 2019-11-18 2022-08-19 高德(江苏)电子科技股份有限公司 一种应用于pcb半塞孔溢油上焊盘的改善方法
WO2022113161A1 (ja) * 2020-11-24 2022-06-02 昭和電工マテリアルズ株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3469982A (en) 1968-09-11 1969-09-30 Jack Richard Celeste Process for making photoresists
CS159358B1 (de) * 1970-03-26 1975-01-31
GB1418169A (en) * 1972-02-25 1975-12-17 Hitachi Chemical Co Ltd Resist image formation process and resin compositions and materials for use in said process
JPS528303A (en) * 1975-04-11 1977-01-22 Hitachi Chemical Co Ltd Filmmlike laminated body
GB2049972B (en) * 1977-07-12 1982-06-23 Asahi Chemical Ind Photosensitive element for producing a printed circuit board
US4293635A (en) * 1980-05-27 1981-10-06 E. I. Du Pont De Nemours And Company Photopolymerizable composition with polymeric binder
US4298678A (en) * 1980-08-14 1981-11-03 E. I. Du Pont De Nemours And Company Photosensitive compositions and elements containing substituted hydroxylamine
JPS59130568A (ja) * 1983-01-17 1984-07-27 Nitto Electric Ind Co Ltd 表面保護層形成方法
EP0127762B1 (de) * 1983-05-02 1987-07-22 E.I. Du Pont De Nemours And Company N-Alkyl-Amino-Aryl-Keton als Sensibilisator in Photopolymer-Zusammensetzungen
DE3427519A1 (de) * 1984-07-26 1986-02-06 Hoechst Ag, 6230 Frankfurt Durch strahlung polymerisierbares gemisch, darin enthaltenes mischpolymerisat und verfahren zur herstellung des mischpolymerisats
JPS6189846A (ja) * 1984-10-11 1986-05-08 旭化成株式会社 新規なる光重合性積層体
JPS61171721A (ja) * 1985-01-23 1986-08-02 Toyobo Co Ltd 積層体
EP0259853A3 (de) * 1986-09-12 1989-11-08 E.I. Du Pont De Nemours And Company Laminierung eines photopolymerisierbaren Films auf einem Träger mittels einer photoempfindlichen flüssigen Zwischenschicht
JPS6380594A (ja) * 1986-09-24 1988-04-11 三菱化学株式会社 ソルダ−マスクの製法
JPS63132233A (ja) * 1986-11-25 1988-06-04 Mitsubishi Electric Corp フオトレジスト組成物
JP2675345B2 (ja) * 1988-08-29 1997-11-12 旭化成工業株式会社 感光性樹脂組成物

Also Published As

Publication number Publication date
SG43840A1 (en) 1997-11-14
JPH0798381B2 (ja) 1995-10-25
WO1990014225A1 (fr) 1990-11-29
CA2022753C (en) 1996-11-12
KR920700108A (ko) 1992-02-19
EP0425703B1 (de) 1997-03-19
US5356755A (en) 1994-10-18
DE69030234D1 (de) 1997-04-24
EP0425703A1 (de) 1991-05-08
KR940004022B1 (ko) 1994-05-11
CA2022753A1 (en) 1990-11-18
JPH03236956A (ja) 1991-10-22
EP0425703A4 (en) 1991-11-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee