DE69025801T2 - Verfahren zum Formen von elektrischen Kontakten zwischen Verbindungsleiterschichten auf verschiedenen Ebenen - Google Patents

Verfahren zum Formen von elektrischen Kontakten zwischen Verbindungsleiterschichten auf verschiedenen Ebenen

Info

Publication number
DE69025801T2
DE69025801T2 DE69025801T DE69025801T DE69025801T2 DE 69025801 T2 DE69025801 T2 DE 69025801T2 DE 69025801 T DE69025801 T DE 69025801T DE 69025801 T DE69025801 T DE 69025801T DE 69025801 T2 DE69025801 T2 DE 69025801T2
Authority
DE
Germany
Prior art keywords
electrical contacts
different levels
interconnect layers
forming electrical
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69025801T
Other languages
English (en)
Other versions
DE69025801D1 (de
Inventor
Minoru Inoue
Ryuji Iwama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of DE69025801D1 publication Critical patent/DE69025801D1/de
Application granted granted Critical
Publication of DE69025801T2 publication Critical patent/DE69025801T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76853—Barrier, adhesion or liner layers characterized by particular after-treatment steps
    • H01L21/76861—Post-treatment or after-treatment not introducing additional chemical elements into the layer
    • H01L21/76862—Bombardment with particles, e.g. treatment in noble gas plasmas; UV irradiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
    • H01L21/76844—Bottomless liners
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76853—Barrier, adhesion or liner layers characterized by particular after-treatment steps
    • H01L21/76855—After-treatment introducing at least one additional element into the layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5226—Via connections in a multilevel interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE69025801T 1989-06-06 1990-05-31 Verfahren zum Formen von elektrischen Kontakten zwischen Verbindungsleiterschichten auf verschiedenen Ebenen Expired - Fee Related DE69025801T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1143395A JPH038359A (ja) 1989-06-06 1989-06-06 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
DE69025801D1 DE69025801D1 (de) 1996-04-18
DE69025801T2 true DE69025801T2 (de) 1996-07-25

Family

ID=15337768

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69025801T Expired - Fee Related DE69025801T2 (de) 1989-06-06 1990-05-31 Verfahren zum Formen von elektrischen Kontakten zwischen Verbindungsleiterschichten auf verschiedenen Ebenen

Country Status (5)

Country Link
US (1) US5081064A (de)
EP (1) EP0401688B1 (de)
JP (1) JPH038359A (de)
KR (1) KR930011054B1 (de)
DE (1) DE69025801T2 (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5177589A (en) * 1990-01-29 1993-01-05 Hitachi, Ltd. Refractory metal thin film having a particular step coverage factor and ratio of surface roughness
JPH088301B2 (ja) * 1990-06-07 1996-01-29 株式会社東芝 半導体装置の製造方法
JP2598335B2 (ja) * 1990-08-28 1997-04-09 三菱電機株式会社 半導体集積回路装置の配線接続構造およびその製造方法
JPH04242088A (ja) * 1991-01-16 1992-08-28 Nec Corp Ｉｃソケット
JPH06177127A (ja) * 1991-05-30 1994-06-24 Sony Corp 配線形成方法
JP3139781B2 (ja) * 1991-08-07 2001-03-05 沖電気工業株式会社 半導体装置およびその製造方法
US5200359A (en) * 1991-10-03 1993-04-06 Micron Technology, Inc. Method of decreasing contact resistance between a lower elevation aluminum layer and a higher elevation electrically conductive layer
US5376820A (en) * 1992-02-05 1994-12-27 Ncr Corporation Semiconductor fuse structure
JP2755035B2 (ja) * 1992-03-28 1998-05-20 ヤマハ株式会社 多層配線形成法
JPH065715A (ja) * 1992-06-18 1994-01-14 Sony Corp 配線層の形成方法
US5486492A (en) * 1992-10-30 1996-01-23 Kawasaki Steel Corporation Method of forming multilayered wiring structure in semiconductor device
JPH07105441B2 (ja) * 1992-11-30 1995-11-13 日本電気株式会社 半導体装置の製造方法
US5443995A (en) * 1993-09-17 1995-08-22 Applied Materials, Inc. Method for metallizing a semiconductor wafer
US5747360A (en) * 1993-09-17 1998-05-05 Applied Materials, Inc. Method of metalizing a semiconductor wafer
US6077781A (en) 1995-11-21 2000-06-20 Applied Materials, Inc. Single step process for blanket-selective CVD aluminum deposition
US5877087A (en) 1995-11-21 1999-03-02 Applied Materials, Inc. Low temperature integrated metallization process and apparatus
US6726776B1 (en) 1995-11-21 2004-04-27 Applied Materials, Inc. Low temperature integrated metallization process and apparatus
US6016012A (en) * 1996-11-05 2000-01-18 Cypress Semiconductor Corporation Thin liner layer providing reduced via resistance
US6110828A (en) * 1996-12-30 2000-08-29 Applied Materials, Inc. In-situ capped aluminum plug (CAP) process using selective CVD AL for integrated plug/interconnect metallization
US6537905B1 (en) * 1996-12-30 2003-03-25 Applied Materials, Inc. Fully planarized dual damascene metallization using copper line interconnect and selective CVD aluminum plug
US6139697A (en) * 1997-01-31 2000-10-31 Applied Materials, Inc. Low temperature integrated via and trench fill process and apparatus
US5930669A (en) * 1997-04-03 1999-07-27 International Business Machines Corporation Continuous highly conductive metal wiring structures and method for fabricating the same
US5985762A (en) * 1997-05-19 1999-11-16 International Business Machines Corporation Method of forming a self-aligned copper diffusion barrier in vias
US5989623A (en) * 1997-08-19 1999-11-23 Applied Materials, Inc. Dual damascene metallization
US6228754B1 (en) * 1999-01-05 2001-05-08 Advanced Micro Devices, Inc. Method for forming semiconductor seed layers by inert gas sputter etching
US6207558B1 (en) 1999-10-21 2001-03-27 Applied Materials, Inc. Barrier applications for aluminum planarization
US6812147B2 (en) * 2001-10-11 2004-11-02 Epion Corporation GCIB processing to improve interconnection vias and improved interconnection via
JP4774931B2 (ja) * 2005-11-07 2011-09-21 コニカミノルタビジネステクノロジーズ株式会社 現像装置、プロセスカートリッジ及び画像形成装置
KR100938347B1 (ko) * 2007-05-18 2010-01-22 김재화 분말화된 음식물 쓰레기 소각 장치
US10679891B2 (en) * 2017-06-30 2020-06-09 Taiwan Semiconductor Manufacturing Company, Ltd. Methods of forming interconnect structures using a vacuum environment

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4107726A (en) * 1977-01-03 1978-08-15 Raytheon Company Multilayer interconnected structure for semiconductor integrated circuit
US4507852A (en) * 1983-09-12 1985-04-02 Rockwell International Corporation Method for making a reliable ohmic contact between two layers of integrated circuit metallizations
DE3683679D1 (de) * 1985-04-26 1992-03-12 Fujitsu Ltd Verfahren zur herstellung einer kontaktanordnung fuer eine halbleiteranordnung.
JPH0719841B2 (ja) * 1987-10-02 1995-03-06 株式会社東芝 半導体装置
US4962414A (en) * 1988-02-11 1990-10-09 Sgs-Thomson Microelectronics, Inc. Method for forming a contact VIA
US4998157A (en) * 1988-08-06 1991-03-05 Seiko Epson Corporation Ohmic contact to silicon substrate
US4983543A (en) * 1988-09-07 1991-01-08 Fujitsu Limited Method of manufacturing a semiconductor integrated circuit having an interconnection wire embedded in a protective layer covering the semiconductor integrated circuit

Also Published As

Publication number Publication date
JPH038359A (ja) 1991-01-16
EP0401688A3 (de) 1991-07-31
KR910001923A (ko) 1991-01-31
DE69025801D1 (de) 1996-04-18
EP0401688B1 (de) 1996-03-13
US5081064A (en) 1992-01-14
KR930011054B1 (ko) 1993-11-20
EP0401688A2 (de) 1990-12-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee