DE69010227D1 - Thermisch leitfähige Organosiloxanzusammensetzungen. - Google Patents

Thermisch leitfähige Organosiloxanzusammensetzungen.

Info

Publication number
DE69010227D1
DE69010227D1 DE69010227T DE69010227T DE69010227D1 DE 69010227 D1 DE69010227 D1 DE 69010227D1 DE 69010227 T DE69010227 T DE 69010227T DE 69010227 T DE69010227 T DE 69010227T DE 69010227 D1 DE69010227 D1 DE 69010227D1
Authority
DE
Germany
Prior art keywords
thermally conductive
organosiloxane compositions
conductive organosiloxane
compositions
thermally
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69010227T
Other languages
English (en)
Other versions
DE69010227T2 (de
Inventor
Adam Lee Peterson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp filed Critical Dow Corning Corp
Publication of DE69010227D1 publication Critical patent/DE69010227D1/de
Application granted granted Critical
Publication of DE69010227T2 publication Critical patent/DE69010227T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE69010227T 1989-02-08 1990-02-07 Thermisch leitfähige Organosiloxanzusammensetzungen. Expired - Fee Related DE69010227T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/308,151 US5011870A (en) 1989-02-08 1989-02-08 Thermally conductive organosiloxane compositions

Publications (2)

Publication Number Publication Date
DE69010227D1 true DE69010227D1 (de) 1994-08-04
DE69010227T2 DE69010227T2 (de) 1994-11-24

Family

ID=23192775

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69010227T Expired - Fee Related DE69010227T2 (de) 1989-02-08 1990-02-07 Thermisch leitfähige Organosiloxanzusammensetzungen.

Country Status (7)

Country Link
US (1) US5011870A (de)
EP (1) EP0382188B1 (de)
JP (1) JP2986825B2 (de)
KR (1) KR0152997B1 (de)
AU (1) AU631597B2 (de)
CA (1) CA2008216C (de)
DE (1) DE69010227T2 (de)

Families Citing this family (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5288769A (en) * 1991-03-27 1994-02-22 Motorola, Inc. Thermally conducting adhesive containing aluminum nitride
US5194480A (en) * 1991-05-24 1993-03-16 W. R. Grace & Co.-Conn. Thermally conductive elastomer
EP0555184B1 (de) * 1992-02-07 1996-07-17 Ciba-Geigy Ag Füllstoff für wärmeleitende Kunststoffe
US5589714A (en) * 1992-06-08 1996-12-31 The Dow Chemical Company Epoxy polymer filled with aluminum nitride-containing polymer and semiconductor devices encapsulated with a thermosetting resin containing aluminum nitride particles
US5627107A (en) * 1992-06-08 1997-05-06 The Dow Chemical Company Semiconductor devices encapsulated with aluminum nitride-filled resins and process for preparing same
US6197859B1 (en) 1993-06-14 2001-03-06 The Bergquist Company Thermally conductive interface pads for electronic devices
JPH07157664A (ja) * 1993-12-03 1995-06-20 Fuji Kobunshi Kogyo Kk 熱伝導性シリコーンゴムシート及びその製造方法
US5601874A (en) * 1994-12-08 1997-02-11 The Dow Chemical Company Method of making moisture resistant aluminum nitride powder and powder produced thereby
US5801332A (en) * 1995-08-31 1998-09-01 Minnesota Mining And Manufacturing Company Elastically recoverable silicone splice cover
US5950066A (en) * 1996-06-14 1999-09-07 The Bergquist Company Semisolid thermal interface with low flow resistance
JP3142800B2 (ja) * 1996-08-09 2001-03-07 信越化学工業株式会社 熱伝導性シリコーン組成物、熱伝導性材料及び熱伝導性シリコーングリース
WO2002086911A1 (en) * 2001-04-23 2002-10-31 Henkel Loctite Corporation Conductive, silicone-based compositions with improved initial adhesion and reduced microvoiding
US6884314B2 (en) * 1997-02-07 2005-04-26 Henkel Corporation Conducive, silicone-based compositions with improved initial adhesion reduced microvoiding
US6020424A (en) * 1997-06-30 2000-02-01 Ferro Corporation Screen printable thermally curing conductive gel
US6168859B1 (en) 1998-01-29 2001-01-02 The Dow Chemical Company Filler powder comprising a partially coated alumina powder and process to make the filler powder
EP0939115A1 (de) * 1998-02-27 1999-09-01 Shin-Etsu Chemical Co., Ltd. Wärmeleitende Schmierfettzusammensetzung
US6419981B1 (en) 1998-03-03 2002-07-16 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US6593255B1 (en) 1998-03-03 2003-07-15 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US6949289B1 (en) 1998-03-03 2005-09-27 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US8105690B2 (en) 1998-03-03 2012-01-31 Ppg Industries Ohio, Inc Fiber product coated with particles to adjust the friction of the coating and the interfilament bonding
JP3948642B2 (ja) * 1998-08-21 2007-07-25 信越化学工業株式会社 熱伝導性グリース組成物及びそれを使用した半導体装置
JP2000169873A (ja) * 1998-12-02 2000-06-20 Shin Etsu Chem Co Ltd シリコーングリース組成物
DE29923250U1 (de) * 1998-12-24 2000-08-31 Ispo Gmbh Form- oder Beschichtungsmaterial
US6048919A (en) 1999-01-29 2000-04-11 Chip Coolers, Inc. Thermally conductive composite material
DE19905869C1 (de) * 1999-02-12 2000-10-26 Peters Research Gmbh & Co Kg Bindemittel enthaltende Masse für die Beschichtung von Leiterplatten , Verwendung als Leiterplatten und Verfahren zur Herstellung
US6620497B2 (en) 2000-01-11 2003-09-16 Cool Options, Inc. Polymer composition with boron nitride coated carbon flakes
US20010049028A1 (en) * 2000-01-11 2001-12-06 Mccullough Kevin A Metal injection molding material with high aspect ratio filler
US6680015B2 (en) * 2000-02-01 2004-01-20 Cool Options, Inc. Method of manufacturing a heat sink assembly with overmolded carbon matrix
US6660241B2 (en) * 2000-05-01 2003-12-09 Saint-Gobain Ceramics & Plastics, Inc. Highly delaminated hexagonal boron nitride powders, process for making, and uses thereof
US6794435B2 (en) 2000-05-18 2004-09-21 Saint Gobain Ceramics & Plastics, Inc. Agglomerated hexagonal boron nitride powders, method of making, and uses thereof
US6710109B2 (en) * 2000-07-13 2004-03-23 Cool Options, Inc. A New Hampshire Corp. Thermally conductive and high strength injection moldable composition
US6764975B1 (en) 2000-11-28 2004-07-20 Saint-Gobain Ceramics & Plastics, Inc. Method for making high thermal diffusivity boron nitride powders
JP3608612B2 (ja) * 2001-03-21 2005-01-12 信越化学工業株式会社 電磁波吸収性熱伝導組成物及び熱軟化性電磁波吸収性放熱シート並びに放熱施工方法
CA2445555C (en) * 2001-04-30 2010-11-23 Saint-Gobain Ceramics & Plastics, Inc. Polymer processing aid and method for processing polymers
TWI242584B (en) 2001-07-03 2005-11-01 Lord Corp High thermal conductivity spin castable potting compound
US6645612B2 (en) 2001-08-07 2003-11-11 Saint-Gobain Ceramics & Plastics, Inc. High solids hBN slurry, hBN paste, spherical hBN powder, and methods of making and using them
US20030040563A1 (en) * 2001-08-23 2003-02-27 Sagal E. Mikhail Substantially non-abrasive thermally conductive polymer composition containing boron nitride
US6756005B2 (en) * 2001-08-24 2004-06-29 Cool Shield, Inc. Method for making a thermally conductive article having an integrated surface and articles produced therefrom
US7038009B2 (en) * 2001-08-31 2006-05-02 Cool Shield, Inc. Thermally conductive elastomeric pad and method of manufacturing same
US20030139510A1 (en) * 2001-11-13 2003-07-24 Sagal E. Mikhail Polymer compositions having high thermal conductivity and dielectric strength and molded packaging assemblies produced therefrom
US20030128519A1 (en) * 2002-01-08 2003-07-10 International Business Machine Corporartion Flexible, thermally conductive, electrically insulating gap filler, method to prepare same, and method using same
US20030220432A1 (en) * 2002-04-15 2003-11-27 James Miller Thermoplastic thermally-conductive interface articles
JP4587636B2 (ja) * 2002-11-08 2010-11-24 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物
US8062746B2 (en) * 2003-03-10 2011-11-22 Ppg Industries, Inc. Resin compatible yarn binder and uses thereof
US7494635B2 (en) * 2003-08-21 2009-02-24 Saint-Gobain Ceramics & Plastics, Inc. Boron nitride agglomerated powder
JP4828429B2 (ja) * 2003-11-05 2011-11-30 ダウ・コーニング・コーポレイション 熱伝導性グリース、並びに前記グリースを用いる方法及びデバイス
CN1946784A (zh) * 2004-03-09 2007-04-11 汉高公司 导热性两部分粘合剂组合物
TWI385246B (zh) 2004-05-21 2013-02-11 Shinetsu Chemical Co 聚矽氧烷潤滑油組成物
US7445141B2 (en) * 2004-09-22 2008-11-04 International Business Machines Corporation Solder interconnection array with optimal mechanical integrity
US7354641B2 (en) 2004-10-12 2008-04-08 Ppg Industries Ohio, Inc. Resin compatible yarn binder and uses thereof
CN101084275B (zh) 2004-12-23 2011-09-14 陶氏康宁公司 可交联的糖-硅氧烷组合物，和由其形成的网络、涂层和制品
JP5122444B2 (ja) * 2005-05-23 2013-01-16 ダウ・コーニング・コーポレイション サッカリド−シロキサンコポリマーを含むパーソナルケア組成物
ATE486165T1 (de) * 2005-05-23 2010-11-15 Dow Corning Oberflächenbehandlungszusammensetzungen mit saccharid-siloxan-polymeren
JP2007138100A (ja) * 2005-11-22 2007-06-07 Shin Etsu Chem Co Ltd 高熱伝導性シリコーンゴム組成物
KR101264438B1 (ko) * 2005-11-28 2013-05-14 신에쓰 가가꾸 고교 가부시끼가이샤 열 정착 롤 또는 정착 벨트
JP4900584B2 (ja) * 2005-11-28 2012-03-21 信越化学工業株式会社 熱定着ロール又は定着ベルト
JP4933094B2 (ja) 2005-12-27 2012-05-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
CN101478973B (zh) * 2006-05-23 2013-08-28 陶氏康宁公司 用于递送活性成分的新型硅氧烷成膜剂
JP5388409B2 (ja) * 2006-09-28 2014-01-15 東レ・ダウコーニング株式会社 硬化性シリコーン組成物およびその硬化物
US20080166552A1 (en) * 2006-11-06 2008-07-10 Arlon, Inc. Silicone based compositions for thermal interface materials
EP2115065B1 (de) * 2007-02-20 2016-05-11 Dow Corning Corporation Füllstoffbehandlungsmittel auf basis wasserstoffbindender polyorganosiloxane
US7462294B2 (en) * 2007-04-25 2008-12-09 International Business Machines Corporation Enhanced thermal conducting formulations
CN102414831B (zh) 2009-03-11 2015-09-30 信越化学工业株式会社 太阳能电池电极的连接片材、太阳能电池组件的制造方法和太阳能电池组件
JP5651676B2 (ja) 2009-03-16 2015-01-14 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 熱伝導性グリース、並びに、該グリースを用いる方法及びデバイス
JP5828835B2 (ja) * 2010-04-08 2015-12-09 デンカ株式会社 熱伝導性湿気硬化型樹脂組成物
EP2609138B1 (de) 2010-08-23 2017-05-17 Dow Corning Corporation In wässrigen umgebungen stabile saccharidsiloxane sowie verfahren für die herstellung und verwendung derartiger saccharidsiloxane
KR101917338B1 (ko) * 2011-10-06 2018-11-09 덴카 주식회사 저아웃가스용 열전도성 조성물
WO2016190189A1 (ja) * 2015-05-22 2016-12-01 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性組成物
EP3150672B1 (de) 2015-10-02 2018-05-09 Shin-Etsu Chemical Co., Ltd. Wärmeleitende und silikonzusammensetzung und halbleiterbauelement
JP6610429B2 (ja) 2016-05-24 2019-11-27 信越化学工業株式会社 熱伝導性シリコーン組成物、その硬化物及びその製造方法
CN107057558A (zh) * 2016-09-13 2017-08-18 华北电力大学 一种环保型导热硅脂组合物及其制备方法和应用
CN109844030B (zh) * 2016-10-18 2022-04-26 信越化学工业株式会社 导热性有机硅组合物
JP6607166B2 (ja) 2016-10-31 2019-11-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
EP3708613B1 (de) 2017-11-09 2022-11-23 Shin-Etsu Chemical Co., Ltd. Wärmeleitfähige silikonschmierzusammensetzung
JP6866877B2 (ja) 2018-05-31 2021-04-28 信越化学工業株式会社 低熱抵抗シリコーン組成物
JP7092212B2 (ja) 2018-12-21 2022-06-28 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
CN111669956B (zh) 2019-03-06 2024-04-02 天津莱尔德电子材料有限公司 热管理和/或电磁干扰减轻材料以及相关装置和方法
JP7076400B2 (ja) 2019-05-27 2022-05-27 信越化学工業株式会社 熱伝導性シリコーン組成物、半導体装置及びその製造方法
JP7303159B2 (ja) 2020-06-18 2023-07-04 信越化学工業株式会社 シリコーン組成物、及び高熱伝導性を有する熱伝導性シリコーン硬化物
JP2022181451A (ja) 2021-05-26 2022-12-08 信越化学工業株式会社 熱伝導性シリコーン組成物
KR20240028463A (ko) 2021-07-02 2024-03-05 신에쓰 가가꾸 고교 가부시끼가이샤 열전도성 실리콘 조성물, 반도체 장치 및 그의 제조 방법

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3050490A (en) * 1962-08-21 Boron nitride containing self-adhering
US3499859A (en) * 1968-07-05 1970-03-10 Dow Corning Stable thermally conductive room temperature vulcanizable silicone rubber
DE2527681C3 (de) * 1975-06-21 1978-05-24 Multi-Contact Ag, Allschwil (Schweiz) Elektrische Kontaktanordnung
JPS52125539A (en) * 1976-04-15 1977-10-21 Toshiba Corp Heat resistant adhesives
US4147669A (en) * 1977-03-28 1979-04-03 Rockwell International Corporation Conductive adhesive for providing electrical and thermal conductivity
SU771138A1 (ru) * 1978-06-29 1980-10-15 Предприятие П/Я Г-4236 Композици на основе низкомолекул рного силоксанового каучука
JPS5579408A (en) * 1978-12-11 1980-06-14 Olympus Optical Co Ltd Microscope objective lens
JPS56837A (en) * 1979-06-15 1981-01-07 Denki Kagaku Kogyo Kk Heat-radiating sheet
JPS5648664A (en) * 1979-09-28 1981-05-01 Ricoh Co Ltd Fixing roll of copying machine or the like
US4292223A (en) * 1980-01-04 1981-09-29 Ford Motor Company Highly filled thermally conductive elastomers I
US4292225A (en) * 1980-01-04 1981-09-29 Ford Motor Company Highly filled thermally conductive elastomers IV
JPS5948063B2 (ja) * 1980-01-30 1984-11-24 電気化学工業株式会社 放熱シ−トの製造法
JPS56144565A (en) * 1980-04-10 1981-11-10 Hitachi Ltd Semiconductor device
JPS57100148A (en) * 1980-12-13 1982-06-22 Denki Kagaku Kogyo Kk Heat dissipating sheet
DD205772A1 (de) * 1982-02-16 1984-01-04 Reinhard Butz Niederdruckgasentladungslampe, insbesondere leuchtstofflampe kleiner leistung
JPS6037142B2 (ja) * 1982-09-03 1985-08-24 日本電信電話株式会社 海底光中継器用緩衛ゴム
JPS59145202A (ja) * 1983-02-07 1984-08-20 Dainippon Ink & Chem Inc 輻射線硬化型樹脂組成物
JPS59147033A (ja) * 1983-02-14 1984-08-23 Mitsubishi Electric Corp 熱伝導性強化樹脂
US4685987A (en) * 1983-09-02 1987-08-11 The Bergquist Company Method of preparing interfacings of heat sinks with electrical devices
US4602678A (en) * 1983-09-02 1986-07-29 The Bergquist Company Interfacing of heat sinks with electrical devices, and the like
US4574879A (en) * 1984-02-29 1986-03-11 The Bergquist Company Mounting pad for solid-state devices
US4588768A (en) * 1984-10-29 1986-05-13 Sws Silicones Corporation Thermally conductive heat curable organopolysiloxane compositions
US4544696A (en) * 1984-10-29 1985-10-01 Sws Silicones Corporation Silicone elastomers having thermally conductive properties
US4584336A (en) * 1984-10-29 1986-04-22 Sws Silicones Corporation Thermally conductive room temperature vulcanizable compositions
US4604424A (en) * 1986-01-29 1986-08-05 Dow Corning Corporation Thermally conductive polyorganosiloxane elastomer composition
JPS63183958A (ja) * 1986-09-04 1988-07-29 Toray Silicone Co Ltd 熱硬化性樹脂組成物
US4772521A (en) * 1986-09-10 1988-09-20 United Technologies Corporation Solid flowable polymer medium with metal additives and method of molding using same
JPS63307748A (ja) * 1987-06-10 1988-12-15 Toshiba Corp 樹脂材料
US4852646A (en) * 1987-06-16 1989-08-01 Raychem Corporation Thermally conductive gel materials
US4763158A (en) * 1987-09-11 1988-08-09 Xerox Corporation Boron nitride filled fuser rolls

Also Published As

Publication number Publication date
JPH0314873A (ja) 1991-01-23
EP0382188B1 (de) 1994-06-29
AU4912190A (en) 1990-08-16
AU631597B2 (en) 1992-12-03
EP0382188A1 (de) 1990-08-16
US5011870A (en) 1991-04-30
DE69010227T2 (de) 1994-11-24
CA2008216C (en) 2000-09-05
KR0152997B1 (ko) 1998-12-01
CA2008216A1 (en) 1990-08-08
KR900013021A (ko) 1990-09-03
JP2986825B2 (ja) 1999-12-06

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