EP0939115A1 - Wärmeleitende Schmierfettzusammensetzung - Google Patents

Wärmeleitende Schmierfettzusammensetzung Download PDF

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Publication number
EP0939115A1
EP0939115A1 EP98308489A EP98308489A EP0939115A1 EP 0939115 A1 EP0939115 A1 EP 0939115A1 EP 98308489 A EP98308489 A EP 98308489A EP 98308489 A EP98308489 A EP 98308489A EP 0939115 A1 EP0939115 A1 EP 0939115A1
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Prior art keywords
thermally conductive
component
group
thermal conductivity
grease composition
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EP98308489A
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English (en)
French (fr)
Inventor
Takayuki Takahashi
Kunihiro Yamada
Kenichi Isobe
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Priority claimed from JP10064582A external-priority patent/JP2938429B1/ja
Priority claimed from JP10064581A external-priority patent/JP2938428B1/ja
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of EP0939115A1 publication Critical patent/EP0939115A1/de
Withdrawn legal-status Critical Current

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    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M169/00—Lubricating compositions characterised by containing as components a mixture of at least two types of ingredient selected from base-materials, thickeners or additives, covered by the preceding groups, each of these compounds being essential
    • C10M169/04—Mixtures of base-materials and additives
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    • C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
    • C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
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    • C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
    • C10M2209/105—Polyethers, i.e. containing di- or higher polyoxyalkylene groups of alkylene oxides containing three carbon atoms only
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    • C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
    • C10M2209/107—Polyethers, i.e. containing di- or higher polyoxyalkylene groups of two or more specified different alkylene oxides covered by groups C10M2209/104 - C10M2209/106
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    • C10M2211/06—Perfluorinated compounds
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    • C10M2213/00—Organic macromolecular compounds containing halogen as ingredients in lubricant compositions
    • C10M2213/04—Organic macromolecular compounds containing halogen as ingredients in lubricant compositions obtained from monomers containing carbon, hydrogen, halogen and oxygen
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    • C10M2223/00—Organic non-macromolecular compounds containing phosphorus as ingredients in lubricant compositions
    • C10M2223/02—Organic non-macromolecular compounds containing phosphorus as ingredients in lubricant compositions having no phosphorus-to-carbon bonds
    • C10M2223/04—Phosphate esters
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    • C10M2223/04—Phosphate esters
    • C10M2223/041—Triaryl phosphates
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    • C10M2229/04—Siloxanes with specific structure
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    • C10M2229/04—Siloxanes with specific structure
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Definitions

  • the present invention relates to a thermally conductive material and, more particularly, to a thermally conductive grease composition which comprises liquid silicone, liquid hydrocarbon or/and fluorohydrocarbon oil as base oil and has thermal conductivity adequate to the use for reduction of the heat from electronic parts.
  • thermally conductive materials such as thermally conductive grease and a thermally ccnductive sheet
  • Tokko means an "examined patent publication”
  • Japanese Tokkai Sho 61-157587 wherein the term “Tokkai” means an "unexamined published patent application”
  • an electronic device comprises integrated circuits and cap parts for protecting them, and a thermally conductive material is applied so as to contact directly with both the circuit element and the heat reducing part, or indirectly therewith via certain materials.
  • a thermally conductive material is applied so as to contact directly with both the circuit element and the heat reducing part, or indirectly therewith via certain materials.
  • thermally conductive material As the thermally conductive material mentioned above, there has already been known a heat-reducing grease of the type which uses a silicone oil as a base material and a zinc oxide or alumina powder as a thickener (Japanese Tokko Sho 52-33272 and Japanese Tokko Sho 59-52195). In recent years, aluminum nitride has been developed as a thickener which enables further improvement of thermal conductivity (as disclosed, e.g., in Japanese Tokkai Sho 52-125506).
  • the grease compositions undergo no great improvement in thermal conductivity by containing aluminum nitride instead of other known thickeners though the aluminum nitride itself has high thermal conductivity.
  • the permissible content of aluminum nitride in silicone oil is restricted within very narrow limits, or to the range of about 50 to about 95 weight parts per 100 weight parts of silicone oil used as a base oil, due to its insufficient oil-keeping power.
  • the thixotropic thermally conductive material comprising an oily organosilicone carrier, silica fiber in an amount effective for prevention of oily carrier exudation and a thermal conductivity-providing powder selected from a group consisting of dendrite-form zinc oxide, thin-leaf aluminum nitride, thin-leaf boron nitride and a mixture of two or more thereof. From this material also, sufficient improvement of thermal conductivity cannot be expected because it is inevitable to reduce the aluminum nitride powder content due to the incorporation of spherical silica fiber as an essential component for enhancement of oil keeping power.
  • the effect produced by such an increase of the aluminum nitride powder content upon improvement of thermal conductivity is smaller than expected, and the thermal conductivity attained is of the order of 2.3 W/m°K which is still unsatisfactory.
  • the reason therefor is that aluminum nitride is a very hard material having Mohs' hardness of from 7 to 9, and so there are spaces between aluminum nitride grains when they are coarse.
  • organopolysiloxanes of the kind which can hold inorganic fillers in large amounts are employed as base oil and they are combined with at least one inorganic filler selected from the group consisting of ZnO, Al 2 O 3 , AlN and Si 3 N 4 [e.g., Japanese Tokkai Hei 2-212556 (U.S. Patent No. 5,221,339) and Japanese Tokkai Hei 3-162493 (U.S. Patent No. 5,100,568)].
  • ZnO ZnO
  • Al 2 O 3 AlN
  • Si 3 N 4 e.g., Japanese Tokkai Hei 2-212556 (U.S. Patent No. 5,221,339) and Japanese Tokkai Hei 3-162493 (U.S. Patent No. 5,100,568).
  • those combinations as heat-reducing grease are still unsatisfactory.
  • an object of the present invention is to provide a thermally conductive grease having both high thermal conductivity and excellent dispensation suitability.
  • thermally conductive grease composition comprising:
  • thermally conductive grease composition according to the present invention, the gaps among hard particles of thermal conductive inorganic filler having Mohs' hardness of at least 6 and thermal conductivity of at least 100 W/m°K are filled up with soft particles of thermal conductive inorganic filler having Mohs' hardness of at most 5 and thermal conductivity of at least 20 W/m°K; as a result, high thermal conductivity is secured and dispensation suitability is improved.
  • Fig. 1 is a schematic view showing the removal of heat generated from electronic parts by the use of thermally conductive grease.
  • the figures 1, 2 and 3 represent a heat-releasing member, thermally conductive grease and heat-generating electronic parts respectively.
  • base oils generally used for lubricating oil, including liquid silicones, such as silicone oils containing methyl groups or/and phenyl groups, and mineral oils of naphthene and paraffin types.
  • liquid silicones such as silicone oils containing methyl groups or/and phenyl groups
  • mineral oils of naphthene and paraffin types such as mineral oils of naphthene and paraffin types.
  • synthetic oils as recited below are suitable for the base oil of grease or the like to be used under temperatures covering a wide range because of their excellent fluidity, viscosity index and thermal stability.
  • the liquid silicone used as base oil in the present invention can be properly selected from known silicones which are liquid at room temperature, such as organopolysiloxanes, polyorganosilalkylenes, polyorganosilanes and copolymers thereof. From the viewpoint of ensuring heat resistance, stability and electric insulation, however, it is desirable to use organopolysiloxanes, particularly an organopolysiloxane represented by compositional formula R a SiO (4-a)/2 . Each R in this formula is a group selected from monovalent organic groups, and all R groups may be the same or different.
  • Examples of a monovalent organic group as R include monovalent unsubstituted or substituted hydrocarbon groups having 1 to 30 carbon atoms, such as alkyl groups (e.g., methyl, ethyl, propyl, butyl, pentyl, hexyl, octyl, decyl, dodecyl, tetradecyl, hexadecyl, octadecyl, etc.), cycloalkyl groups (e.g., cyclohexyl, etc.), alkenyl groups (e.g., vinyl, allyl, etc.), aryl groups (e.g., phenyl, naphthyl, tolyl, etc.), and groups formed by substituting halogen atom(s), cyano group(s), hydroxyl group(s) or/and so on for part or all of the hydrogen atoms attached to carbon atoms present in the above-recited groups (e.
  • the viscosity of the foregoing organopolysiloxane be from 50 to 500,000 cs, particularly from 50 to 300,000 cs, at 25°C.
  • the viscosity is below 50 cs at 25°C, the grease obtained shows a strong tendency to oil separation; while, when it is above 500,000 cs at °C, the grease prepared is so high in viscosity that it cannot possibly be dispensed to a substrate in a satisfactory condition.
  • the organopolysiloxane used in the present invention can have any of linear, branched and cyclic structures, and it is not necessarily a single compound, but it can be a mixture of two or more of organopolysiloxanes different in structure.
  • "a” may be from 1.8 to 2.3, it is desirable for the organopolysiloxane to have "a” in the range of 1.9 to 2.1, because this range enables the organopolysiloxane to have a linear structure or a structure close thereto.
  • Suitable examples of such an organopolysiloxane include dimethylpolysiloxane, diethylpolysiloxane, methylphenylpolysiloxane, dimethylsiloxane-diphenylsiloxane copolymer, and alkyl-modified methylpolysiloxanes.
  • these polysiloxanes homopolymers and copolymers produced from dimethylsiloxane, alkylmethylsiloxane, methylphenylsiloxane or/and diphenylsiloxane and blocked at their molecular-chain ends with trimethylsilyl or dimethylhydrosilyl groups are preferred in particular.
  • organopolysiloxanes are represented by, e.g., the following formula (I): wherein each of R 1 groups is a group selected from monovalent unsubstituted or substituted hydrocarbon groups having 1 to 30 carbon atoms, such as alkyl groups (e.g., methyl, ethyl, propyl, butyl, amyl, octyl, etc.
  • R 1 groups is a group selected from monovalent unsubstituted or substituted hydrocarbon groups having 1 to 30 carbon atoms, such as alkyl groups (e.g., methyl, ethyl, propyl, butyl, amyl, octyl, etc.
  • alkenyl groups e.g., vinyl, allyl, etc.
  • aryl groups e.g., phenyl, tolyl, etc.
  • groups formed by substituting halogen atom(s), cyano group(s), hydroxyl group(s) or/and so on for part or all of the hydrogen atoms attached to carbon atoms present in the above-recited groups e.g., chloromethyl, 3,3,3-trifluoropropyl, cyano-propyl, phenol, hindered phenol, etc.
  • R 2 and R 3 groups are the same or different, and each of them is the same monovalent hydrocarbon group as R 1 represents, an amino group-containing organic group, a polyether group-containing organic group or an epoxy group-containing organic group
  • R 4 is a hydrogen atom, the same monovalent hydrocarbon group as R 1 represents or the same monovalent organic group as R 2 or R 3 represents
  • l is a positive number to ensure the viscosity of from 50 to
  • R 1 , R 2 and R 3 each, an alkyl group such as methyl or ethyl, an aryl group such as phenyl or tolyl, or a group formed by substituting hydroxyl group(s) for a part of the hydrogen atoms of the group as recited above, particularly a methyl group, a phenyl group or an alkyl group having 6 to 14 carbon atoms, is preferable with respect to easiness of synthesis and thermal resistance and electric insulation of the oil obtained.
  • dimethylpolysiloxane oil can be produced in accordance with known methods.
  • dimethylpolysiloxane oil can be produced by subjecting a low molecular cyclic siloxane, such as octamethylcyclotetrasiloxane or decamethylcyclopentasiloxane, to a ring-opening reaction in the presence of an acid catalyst, such as sulfuric acid, chlorosulfonic acid, nitric acid, phosphoric acid, activated clay, acid clay or trifluoroacetic acid, or an alkaline catalyst, such as potassium hydroxide, sodium hydroxide, rubidium hydroxide, caesium hydroxide, potassium oxide, potassium acetate or calcium silanolate, and then polymerizing the reaction product.
  • an acid catalyst such as sulfuric acid, chlorosulfonic acid, nitric acid, phosphoric acid, activated clay, acid clay or trifluoroacetic acid
  • an alkaline catalyst such as potassium hydroxide
  • a low molecular weight siloxane having a terminal blocking group such as hexamethyldisiloxane, octamethyltrisiloxane or decamethyltetrasiloxane, can be added properly at the stage of polymerization.
  • an amino group-containing organopolysiloxane can be produced by the dealcoholating condensation reaction between an organopolysiloxane having at least one silanol group and an amino group-containing alkoxysilane, and an epoxy group- or polyether group-containing organopolysiloxane can be produced by subjecting a compound having both epoxy or polyether group and an unsaturated group, such as vinyl group, and an organohydrogenpolysiloxane having hydrogen-attached silicon atom(s) to an addition reaction in the presence of a platinum catalyst.
  • organopolysiloxane oils produced in accordance with the foregoing methods generally contain low molecular weight siloxanes having at most 12 siloxane units in a proportion of about 10 %, because they are obtained as equilibrated mixtures of polysiloxanes produced with the progress of polymerization which are various in their polymerization degrees.
  • the products obtained generally undergo a stripping treatment at a temperature of 120-250°C under a reduced pressure to remove the low molecular weight siloxanes therefrom. Even after the stripping treatment, however, the low molecular weight siloxanes still remain in a quantity of 500-20,000 ppm. These low molecular weight siloxanes have a strong adsorbing power, compared with nonpolar combustible gases, so that their vapors are adsorbed strongly by various electrical contact parts and so on.
  • the low molecular weight siloxanes adsorbed to electrical contact parts are converted into SiO 2 ⁇ nH 2 O by undergoing oxidation, and further accumulated in the form of ⁇ SiO 2 on the surface of the contact parts to cause a contact point disturbance. Therefore, the presence of low molecular weight siloxanes is already known to be undesirable.
  • the removal of the foregoing low molecular weight siloxanes can be effected by subjecting an organopolysiloxane oil produced by the foregoing conventional method to a stripping treatment at a high temperature of 150-300°C under a reduced pressure of 50 mmHg or below in an atmosphere of dried nitrogen gas, or by extracting the low molecular weight siloxanes contained in the foregoing organopolysiloxane oil with an alcohol or ketone solvent.
  • each of the contents of low molecular weight siloxanes in the organopolysiloxane oil produced in the foregoing manner can be reduced to less than 50 ppm, and the total content of the low molecular weight siloxanes having from 2 to 12 siloxane units can be reduced to less than 500 ppm.
  • R 1 in formula (I) may be a monovalent substituted hydrocarbon group having the hindered phenol structure as described in Japanese Tokko Hei 3-131692.
  • Examples of a liquid silicone suitable for the present invention include those represented by the following formula (II), but these examples should not be construed as limiting on the scope of the present invention anyway: wherein R 5 is -C 4 H 9 , -C 6 H 13 , -C 8 H 17 , -C 10 H 21 , -C 12 H 25 , -C 15 H 31 or -C 18 H 37 ; R 6 is -(CH 2 ) s -Q; s is an integer of 1 to 6; Q is a group selected from the following monovalent organic groups having hindered phenol structures, R 7 is a 2-phenylethyl group or a 2-phenylpropyl group; and m, n, p, q and r are each a number satisfying the following equations: 0 ⁇ m ⁇ 1,000, 0 ⁇ n ⁇ 100, 0 ⁇ p ⁇ 1,000, 0 ⁇ q ⁇ 1,000, 0 ⁇ r ⁇ 2,000 and 5 ⁇
  • the liquid silicone used in the present invention have its viscosity in the range of 50 to 500,000 cs, particularly 100 to 100,000 cs, at 25°C.
  • mineral oil and synthetic oil usable as base oil in the present invention include paraffin oil, naphthene oil, ⁇ -olefin oligomers (poly- ⁇ -olefins), polybutenes (polyisobutylenes), substituted aromatic compounds, polyalkylene glycols (polyglycol, polyether, polyalkylene oxides), diesters (dibasic acid esters), polyol esters (neopentylpolyol esters and hindered esters), phosphoric acid esters (phosphate esters), fluorinated compounds, such as chlorofluorocarbons, fluoroesters and perfluoroalkyl ethers (fluoropolyglycols, perfluoropolyethers, polyperfluoroalkylethers), and polyphenylether.
  • paraffin oil naphthene oil
  • ⁇ -olefin oligomers poly- ⁇ -olefins
  • polybutenes polyis
  • the ⁇ -olefin oligomers include those represented by the following formula (III)
  • the polybutenes include those represented by the following formula (IV)
  • the substituted aromatic compounds include those represented by the following formula (V)
  • the polyalkylene glycols include those represented by the following formula (VI):
  • R, and R'' each are generally H or CH 3
  • R' is H, CH 3 or C 2 H 5
  • n is from 1 to 200.
  • the polyalkylene glycol of formula (VI) is polyethylene glycol or polypropylene glycol. Further, it may be a copolymer of these two glycols.
  • the diesters are generally produced by the esterification reaction between alcohols and dibasic acids as shown below; 2 ROH + HOOCR'COOH ⁇ ROOCR'COOR + 2 H 2 O wherein R is H or a C 4-18 alkyl group and R' is a C 4-18 alkylene group or an arylene group.
  • the alcohols used in combination with those acids are 7-13C primary alcohols having a side chain, with examples including 2-ethylhexanol (C 8 ), isodecanol (C 10 ) and tridecanol (C 13 ).
  • various diesters can be obtained.
  • examples thereof include diisodecyl phthalate, di-2-ethylhexyl phthalate, dibutyl phthalate, diisodecyl adipate, diisononyl adipate, diisobutyl adipate, mixed acid esters of 2-ethylhexanol, di-2-hexyl sebacate, dibutyl sebacate, di-2-ethylhexyl azelate, di-n-hexyl azelate, di-2-hexyl dodecanoate and dibutoxyethoxyethyl adipate.
  • the polyol esters including neopentylpolyol esters and hindered esters, are monobasic fatty acid esters of polyhydric alcohols, such as neopentylpolyols.
  • neopentylpolyols which are mass-produced as the starting material for syntheses of alkyd resin and surfactants can be employed as raw materials of alcohols.
  • neopentyl glycol NPG
  • TMP trimethylolpropane
  • TAE trimethylolethane
  • PE pentaerithritol
  • DPE dipentaerithritol
  • the monobasic fatty acids usable as the other starting material in the polyol ester synthesis include straight-chain and branched C 3-13 carboxylic acids.
  • C 9 carboxylic acids are exemplified the following acids having a straight-chain structure, a branched structure and a structure having a neopentyl type branch respectively:
  • esters produced by the reaction of an acid having a neopentyl type branch with an alcohol having a neopentyl type branch have the advantage of high thermal stability.
  • the phosphoric acid esters include esters prepared from phosphoric acid as an inorganic acid and phenols or alcohols.
  • the phenyl phosphate as triphenyl phosphate is in a solid state at ordinary temperature, the phenyl phosphates in a liquid state can be generally prepared by using phenols substituted by alkyl group(s). Examples of such a liquid phenyl phosphate include tricresyl phosphate (TCP), trixylenyl phosphate, tripropylphenyl phosphate and tributylphenyl phosphate.
  • alkyl phosphate examples include tributyl phosphate (TBP) and tri-2-ethylhexyl phosphate (TOP).
  • TBP tributyl phosphate
  • TOP tri-2-ethylhexyl phosphate
  • the chlorofluorocarbons have a structure such that hydrogen atoms of n-paraffin are replaced by fluorine atoms and chlorine atoms, and can be produced by polymerizing chlorotrifluoroethylene in a low polymerization degree as shown in the following reaction scheme:
  • the chlorofluorocarbon produced has a viscosity depending on the polymerization degree, and the viscosity can be varied over a wide range.
  • fluoroester usable in the present invention examples include sebacic acid esters of C 7 perfluoroalcohols, pyromellitic acid esters of perfluoroalcohols and camphoric acid esters of perfluoroalcohols.
  • perfluoroalkyl ethers are generally represented by the following formula (VII) or (VIII):
  • liquid hydrocarbons and/or fluorinated hydrocarbon oil used in the present invention have their viscosity in the range of 50 to 500,000 cs, especially 100 to 100,000 cs, at 25°C.
  • the Component (B) of the present grease composition is a thermally conductive inorganic filler having Mohs' hardness of at least 6 and thermal conductivity of at least 100 W/m°K (in theory).
  • the Component (B) is used for conferring high thermal conductivity on the grease composition, it is the more advantageous to the composition to use a filler having higher thermal conductivity.
  • the filler In order to provide a thermally conductive material useful for the heat removal from heat-generating electronic parts, which is an object of the present invention, it is required for the filler to have theoretical thermal conductivity of at least 100 W/m°K, preferably at least 300 W/m°K. Further, it is required for the filler as Component (B) to have Mohs' hardness of at least 6, though inorganic fillers having such high thermal conductivity are generally high in Mohs' hardness. When the filler used as Component (B) has Mohs' hardness lower than 6, it cannot have good compatibility with an inorganic filler having low Mohs' hardness used as Component (C). Examples of a filler suitable for Component (B) include an aluminum nitride powder, a diamond powder and a silicon carbide powder.
  • the aluminum nitride powder used as a thermal conductivity providing filler in the present invention is a nitride of Group III-V metal which generally has a crystal structure of hexagonal system or wurtzite type, and colored white or grayish white in appearance.
  • the particle shape of the powder is polygonal or spherical depending on the preparation method adopted.
  • Such an aluminum nitride powder is prepared using, e.g., a direct nitriding method in which a metallic aluminum powder is allowed to react directly with nitrogen or ammonia, an alumina reduction method in which a mixture of alumina and carbon powders is heated in an atmosphere of nitrogen or ammonia to undergo reduction and nitriding reactions at the same time, a method of reacting aluminum vapor directly with nitrogen, or the pyrolysis of AlCl 3 ⁇ NH 3 .
  • a direct nitriding method in which a metallic aluminum powder is allowed to react directly with nitrogen or ammonia
  • an alumina reduction method in which a mixture of alumina and carbon powders is heated in an atmosphere of nitrogen or ammonia to undergo reduction and nitriding reactions at the same time
  • a method of reacting aluminum vapor directly with nitrogen or the pyrolysis of AlCl 3 ⁇ NH 3 .
  • the present invention can also be used a highly pure aluminum nitride ceramic prepared by using as a raw material an aluminum nitride powder prepared by the method as mentioned above and sintering the raw material.
  • the aluminum nitride powder used as a raw material is required to be susceptible to sintering by having high purity and being a fine powder having a uniform primary particle size of the order of 0.5 ⁇ m.
  • the aluminum nitride powders prepared by any methods can be used in the present invention, although they differ in characteristics, including the chemical composition (impurities), the particle shape and the particle size distribution, depending on the preparation method adopted. Also, the powders prepared by different methods may be used as a mixture.
  • the thus obtained aluminum nitride powder is a very hard material, and has an excellent thermal conductivity, electric insulation and mechanical strength.
  • the aluminum nitride powders having their average particle sizes in a wide range of 0.5 to 5 ⁇ m can be used in the present invention.
  • the powder When the average particle size of an aluminum nitride powder used is smaller than 0.5 ⁇ m, the powder is undesirable because of its too great viscosity-increasing effect. In other words, the grease obtained using such a powder has low consistency (or high hardness and poor dispensation suitability).
  • the average particle size is larger than 5 ⁇ m, on the other hand, the thermally conductive material obtained is poor in uniformity and stability and, what is worse, the base oil separates therefrom to a considerable extent (namely, the material obtained has a high oil-separation degree). Therefore, it is a matter of course that good grease cannot be obtained in the foregoing cases.
  • such a powder it is desirable for such a powder to have a specific surface area of from 1 to 5 m 2 /g.
  • the specific surface area ranging from 2 to 4 m 2 /g is preferred from the viewpoint of compatibility with a base oil.
  • aluminum nitride is very hard, and the Mohs' hardness thereof is within the range of 7 to 9. Any aluminum nitride can be used in the present invention as far as the Mohs' hardness thereof is in the foregoing range. In particular, the aluminum nitride having Mohs' hardness of from 8 to 9 is used to advantage.
  • the thermal conductivity of aluminum nitride is 320 W/m°K in theory, but the actually measured value is lower than the theoretical value, specifically 250 W/m°K or below, because the aluminum nitride powder obtained in practice is more or less contaminated with impurities and contains voids and bubbles. It is required for the aluminum nitride powder used in the present invention to have a thermal conductivity of at least 100 W/m°K at room temperature. In particular, it is desirable that the thermal conductivity thereof be at least 150 W/m°K, especially at least 200 W/m°K, at room temperature. When the thermal conductivity of an aluminum nitride powder used is below 100 W/m°K, the thermal conductivity of the grease or sheet obtained cannot reach such a high value as to be aimed at by the present invention.
  • Examples of aluminum nitride which can be used in the present invention include US, UF and UM, trade names, produced by Toyo Aluminum Co., Ltd., XUS-55548, trade name, produced by Dow Chemical Co., Ltd., H-grade and F-grade, trade names, produced by K.K. Tokuyama, FA and ES-10, trade names, produced by Nippon Light Metal Co., Ltd., and A-100WR, A-100 and AG-SD, trade names, produced by Advanced Refractory Technologies Inc.
  • the diamond powder used as a thermal conductivity providing filler in the present invention is a synthetic diamond powder which is generally produced on an industrial scale.
  • the synthetic diamond powders have a density of about 3.5 and a hexahedral or octahedral crystal shape originating in diamond structure, and produced according to the ultra-high pressure synthesis method or low pressure synthesis method using graphite as a starting material.
  • the synthetic diamond changes its crystal shape depending on the synthesis condition including the combination of pressure and temperature, and the crushing characteristic value thereof depends on the crystal shape. Accordingly, the synthesis condition can be chosen so as to achieve the grain form and the grain size distribution adapted for the use intended.
  • synthetic diamond powders various in grain form and grain size distribution are procurable.
  • the diamond powders of micron sizes there are known diamond powders the grain size of which ranges from 0.1 to 60 ⁇ m and the bulk density of which ranges from 1.4 to 2.1.
  • the synthetic diamond powders usable in the present invention are those various in average grain size. Specifically, their average grain sizes are in the range of 0.2 to 5 ⁇ m. From the viewpoint of dispersibility in base oils, it is desirable for their average grain sizes to range from 0.5 to 4 ⁇ m, particularly from 1 to 3 ⁇ m. Moreover, it is favorable to prepare such a diamond powder by properly mixing a relatively coarse diamond powder having a grain size of from 8 to 20 ⁇ m, a diamond powder having a medium grain size of from 1 to 8 ⁇ m and a relatively fine diamond powder having a grain size of from 0.1 to 1 ⁇ m, because the mixture obtained can have a broad grain size distribution to ensure excellent dispensation suitability in the heat-reducing grease as the dispersion thereof in a base oil. Additionally, the theoretical thermal conductivity of synthetic diamond, though depends on its crystal form, is very high, specifically in the range of 900 to 2,000 W/m°K.
  • Silicon carbide powders usable as a thermal conductivity providing filler in the present invention are generally obtained by producing high-purity ⁇ -SiC ingot from silica and coke as the main raw materials by means of an electric resistance furnace (Acheson furnace) and subjecting the thus produced ingot to pulverizing, decarburizing, iron-removing and sieving steps in succession. According to this process, silicon carbide powders various in grain size distribution can be produced depending on the intended uses. Further, an ultra fine silicon carbide powder can be prepared by choosing a powder having a moderate particle size distribution as starting material, thoroughly grinding the powder into fine particles of sub-micron order in size, sieving them, and further purifying by a chemical treatment.
  • the grain size and the grain size distribution of silicon carbide are determined by the methods defined in JIS R6001, JIS R6002 and JIS R6124.
  • the average particle size of a silicon carbide powder usable in the present invention is desirably in the range of 0.4 to 5 ⁇ m from the viewpoints of securing high dispersibility in base oil and preventing oil separation.
  • the silicon carbide powders are bluish black in appearance, have a crystal form of trigonal prism, and are generally hard.
  • the theoretical thermal conductivity of silicon carbide is 100 W/m°K.
  • the silicon carbide powders having Mohs' hardness in the range of 8 to 9 are usable in the present invention.
  • thermally conductive inorganic filler having Mohs' hardness of at least 6 and a theoretical thermal conductivity of at least 100 W/m°K which is referred to as Component (B) of the present invention
  • the above-recited fillers are exemplified. However, these exemplified fillers should not be construed as limiting the scope of the present invention in any way. Additionally, the fillers as recited above may be used alone or in combination to constitute the Component (B).
  • the Component (B) As it is required for the Component (B) to have a thermal conductivity of at least 100 W/m°K, especially at least 200 W/m°K in order to impart excellent thermal properties upon the grease composition, it is desirable that the aluminum nitride and diamond powders having high thermal conductivity be used alone as Component (B) or the Component (B) comprises such powders in appropriate proportions.
  • the Component (C) of the present invention is a thermally conductive inorganic filler having Mohs' hardness of no higher than 5 and theoretical thermal conductivity of at least 20 W/m°K.
  • This Component (C) enables the Component (B) to have a high filling factor when used in combination with the Component (B). More specifically, when the present thermally conductive composition is used as heat-reducing grease, the Component (C) functions so as to secure satisfactory dispensation suitability and, at the same time, attain a high filling factor of thermally conductive inorganic filler.
  • the Component (C) is required to have Mohs' hardness of no higher than 5, desirably in the range of 1 to 5.
  • Mohs' hardness thereof is higher than 5, the Component (C) cannot have good compatibility with the Component (B) having high hardness.
  • the Component (C) is required to have theoretical thermal conductivity of at least 20 W/m°K.
  • an inorganic filler as Component (C) which can meet the foregoing requirements include a boron nitride powder and a zinc oxide powder.
  • the zinc oxide usable in the present invention is a white zinc oxide powder having a hexagonal or wurtzite crystal structure, generally referred to as "Zinc White".
  • Zinc White a white zinc oxide powder having a hexagonal or wurtzite crystal structure
  • Such a zinc oxide powder can be prepared using known methods. For instance, one of the known methods is an indirect method in which the zinc vapor generally produced by heating metallic zinc to 1,000°C is oxidized with hot air, and another thereof is a direct method wherein the zinc oxide obtained by roasting zinc ore is reduced by coal or the like and the zinc vapor produced is oxidized with hot air, or wherein the slag obtained by the leaching of zinc ore with sulfuric acid is admixed with coke and then heated in an electric furnace, and further the zinc vapor produced thereby is oxidized with hot air.
  • the zinc oxide produced using any of the foregoing methods is cooled by passing through an air condenser equipped with a blower, and fractionated according to the grain size.
  • a wet method in which a zinc salt solution is admixed with an alkali carbonate solution to precipitate zinc hydroxycarbonate and the zinc hydroxycarbonate obtained is roasted.
  • the thus obtained zinc oxide powders are defined in accordance with the Japanese Industrial Standards, JIS K1410 and K5102, or American standards, ASTM-D79.
  • the zinc oxide powders produced by any of the aforementioned methods can be used alone, or a mixture of zinc oxide powders produced by different methods may be used.
  • the zinc oxide powder is used not only as a vulcanization accelerator for rubber but also in the fields of coating color, ceramics, enameled ware, glass, ferrite, cosmetics and medicines. Further, it is known to use a zinc oxide powder as a thermal conductivity providing filler in a thermally conductive grease [Japanese Tokkai Sho 51-55870, Sho 54-116055, Sho 55-45770, Sho 56-28264, Sho 61-157587, Hei 2-212556 (U.S. Patent No. 5,221,339), Hei 3-162493 (U.S. Patent No. 5,100,568) and Hei 4-202496].
  • the average grain size of a zinc oxide powder which can be used in the present invention is in a wide range of 0.2 to 5 ⁇ m.
  • a zinc oxide powder having a grain size in the range of 0.3 to 4 ⁇ m, particularly 0.3 to 3 ⁇ m.
  • the oil separation degree of the thermal conductive material obtained can be reduced to 0.01 % or below.
  • the zinc oxide used it is desirable for the zinc oxide used to have Mohs' hardness of from 4 to 5.
  • the boron nitride powders usable in the present invention are boron nitride powders having a hexagonal crystal structure similar to that of graphite, or a hexagonal network laminate which are produced by heating boric acid or a borate in combination with a nitrogen-containing organic compound or ammonia.
  • the boron nitride of hexagonal system has characteristics such that it retains high lubricity even in a high temperature range, has high thermal conductivity as well as high electrical insulating capacity, and further is chemically stable and hardly wetted with fused metal or glass. Accordingly, it is used as an electrical insulating filler having high thermal conductivity, a solid lubricant, a filler for modification of resins, or the like.
  • boron nitride powders having a crystal structure ox hexagonal system are white in appearance, the average grain size thereof is from 1 to 10 ⁇ m, and they are generally soft.
  • the boron nitride powders having Mohs' hardness in the range of 1 to 3 are usable.
  • the boron nitride powders having Mohs' hardness of the order of 2 are used to advantage.
  • the boron nitride powders usable in the present invention have their average grain sizes in a wide range of 1 to 10 ⁇ m. In viewing the dispersibility in base oil and the prevention of oil separation, however, it is desirable for the powder used in the present invention to have an average particle size in the range of 1 to 5 ⁇ m.
  • the hexagonal boron nitride as described above is converted to cubic boron nitride based on the same structural principle of diamond when it undergoes a high temperature-ultrahigh pressure processing.
  • the boron nitride having a crystal structure of cubic system has the hardness second to that of diamond, and its powdered products available on the market are from liver brown to black in appearance and the average particle size thereof is in the range of several ⁇ m to 800 ⁇ m.
  • Such cubic boron nitride powders also are usable in the present invention, but they are not favorable because their thermal conductivity is in a low range of 0.5 to 3.6 W/m °K; as a result, even if they are incorporated in grease or sheet, the achievement of the thermal conductivity satisfactory to the present invention is difficult. Another reason for this difficulty is that the thermal conductivity of the present thermal conductive material depends also on the filling rate of thermal conductivity providing fillers in the base oil used.
  • filling rate of fillers especially an aluminum nitride or diamond powder as Component (B)
  • B Component
  • the shape and size of filler particles are of great importance.
  • increasing a filling rate renders the resulting composition highly viscous to tend to fair dispensation suitability.
  • dispensation suitability indicates the ease of the work in coating a grease on a substrate.
  • the ease of the coating work using a cylinder-form apparatus equipped with a grease extruding means is reduced and it becomes difficult to form a thin coating of the grease on a substrate.
  • the shape as well as the size of filler particles constitutes a very important factor for achieving a high filling rate while securing a dispensation suitability.
  • each of aluminum nitride and diamond powders consists of square- or flake-shaped particles rather than spherical particles due to the production process and crystal structure thereof, so that the powder tends to increase the viscosity of a thermally conductive material with a rise in the filling rate.
  • the rise in the filling rate causes an increase in the viscosity, or a drop in consistency, of the thermally conductive material to impair the dispensation suitability required for a thermally conductive grease.
  • the theoretical thermal conductivity of zinc oxide or boron nitride as Component (C) is in the range of 20 to 60 W/m°K. In other words, this range is much lower than the thermal conductivity required for the filler as Component (B), or about 1/(5-15) as high as the thermal conductivity 300 W/m°K which an aluminum nitride or diamond powder as Component (B) can have. Therefore, zinc oxide and boron nitride powders have rarely been used in the fields where high thermal conductivity is needed. As for the hardness, however, these powders are softer than the powders used as Component (B).
  • every individual soft particle of Component (C) can be arranged among hard particles of Component (B) to function so as to confer a mobility on the close-packed structure to enable an improvement in dispensation suitability.
  • the ratio of the filler as Component (C) to the total fillers, or the Component (C)/(Component (B) + Component (C)) ratio be from 0.05 to 0.5 by weight, particularly from 0.1 to 0.3.
  • the filler as Component (C) is mixed in a proportion lower than 5 weight %, it cannot fill up sufficiently the gaps among hard filler particles as Component (B) to fail in not only efficiently improving the thermal conductivity but also imparting satisfactory dispensation suitability to a thermally conductive material intended for grease.
  • the fillers can be most appropriately dispersed into a base oil used as component (A) to enable the heat-reducing grease obtained to have a moderate consistency and to avoid deterioration in the dispensation suitability.
  • the present thermal conductive grease can acquire thermal conductivity of at least 2.5 W/m°K which is in the optimum range for the removal of the heat from highly heat-generating electronic parts.
  • the proportion of a filler mixture of Component (B) with Component (C) be from 500 to 1,000 parts by weight, preferably from 800 to 1,000 parts by weight, to 100 parts by weight of base oil as Component (A).
  • the content of a filler mixture in the present composition is less than 500 parts by weight, the thermal conductivity of the composition obtained is in almost the same level as those of conventional grease compositions; while, when it is increased beyond 1,000 parts by weight, the resulting composition becomes hard and poor in dispensation suitability although high in thermal conductivity, so that it is unfit for grease.
  • thermally conductive grease compositions each may further be added various agents, such as a thixotropy providing agent, an antioxidant, metallic powders, metallic fibers, a flame retardant, heat-resistant additives, pigments, a blowing agent, a cross-linking agent, a curing agent, a vulcanizing agent and a mold-releasing agent, if desired.
  • additives include reinforcing fillers (such as aerosol silica, precipitated silica, diatomaceous earth and non-conductive carbon black), aluminum oxide, mica, clay, zinc carbonate, glass beads, polydimethylsiloxane, alkenyl group-containing polysiloxanes, and polymethylsilsesquioxane.
  • additives can be properly chosen according to the necessity or usefulness, and mixed under heat or reduced pressure.
  • a closed kneader, a two-rod roll, a three-rod roll, or a colloid mill can be used to disperse them homogeneously.
  • the present thermally conductive material can be prepared with each in the following manner:
  • the foregoing Components (A), (B) and (C), e.g., liquid silicone, aluminum nitride powder and zinc oxide powder, are weighed out in proper amounts, admixed with additives such as an antioxidant, if needed, and then kneaded together using a planetary mixer or the like so that the gaps among aluminum nitride particles as Component (B) are filled up with zinc oxide particles as Component (C) to ensure the consistency of from 200 to 400 in the composition prepared.
  • it is desirable for the grease to have the consistency of from 200 to 400, particularly from 250 to 350.
  • the grease prepared in the foregoing manner to an electronic apparatus which generates heat during the operation, it is desirable to use an injector-like coating device which is fitted up with a means to push the grease charged therein towards the outlet.
  • the grease can be easily applied to an electronic apparatus by users if the foregoing coating device is in advance charged with the present grease.
  • liquid silicones represented by the following formula (III), having the viscosities set forth in Table 1, were each used as base oil (Component (A)) in the amount of 100 parts.
  • Component (A) Liquid Silicone Viscosity (cs) at 25°C Average Polymerization Degree m' q' r' A - 1 450 20 0 25 A - 2 1,000 80 0 100 A - 3 500 0 0 240 A - 4 400 0 3 9 A - 5 10,000 0 0 800
  • Thermally conductive silicone composition samples according to the present invention were each prepared as follows; A filler as Component (B), the species and average particle size of which are set forth in Table 2, and a filler as Component (C), the species and average particle size of which are also set forth in Table 2, were weighed out in their respective amounts as set forth in Table 2, and added to a base oil as specified above. Then, these three components were thoroughly mixed for 20 minutes by means of a planetary mixer, and further subjected to a kneading process for three times by means of a three-rod roll.
  • the silicone composition samples thus prepared were each examined for consistency and oil separation degree in accordance with JIS-K-2220 with the intention of using them as grease, and further the thermal conductivities thereof were measured with a hot-wire instrument for measuring thermal conductivity, Model TCW-1000, made by Shinku Riko Co., Ltd. The results obtained are shown in Table 2.
  • the symbols B-1 and B-2 used in Table 2 to represent Component (B) are pulverized AlN (average particle size: 0.1-15 ⁇ m) and a synthetic diamond powder (average particle size: 0.1-5 ⁇ m) respectively; while the symbols C-1 and C-2 used therein to represent Component (C) are a zinc oxide powder (average particle size: 0.05-5 ⁇ m) and a hexagonal boron nitride powder (average particle size: 0.1-5 ⁇ m).
  • thermally conductive silicone composition samples were prepared in the same manner as in the aforementioned Examples, except that the amounts of fillers used as Components (B) and (C) were each changed variously.
  • the consistency, oil separation degree and thermal conductivity of each composition prepared were measured in the same ways as in each Example, and the measurement results obtained are shown in Table 3.
  • the present thermally conductive silicone grease compositions had their thermal conductivity in the range of 2.72 to 3.97 W/m°K.
  • the present compositions underwent considerable improvement in thermal conductivity over conventional grease compositions and the comparative compositions.
  • the present compositions had the consistency on the practically optimum level for the use as grease and satisfactory dispensation suitability.
  • liquid hydrocarbons and fluorohydrocarbon oils having the structural formulae illustrated below and the viscosities set forth in Table 4 were each used as base oil (Component (A)) in the amount of 100 parts.
  • Thermally conductive grease compositions according to the present invention were each prepared as follows; A filler as Component (B), the species and average particle size of which are set forth in Table 5, and a filler as Component (C), the species and average particle size of which are also set forth in Table 5, were weighed out in their respective amounts as set forth in Table 5, and added to a base oil as specified above. Then, these three components were thoroughly mixed for 20 minutes by means of a planetary mixer, and further subjected to a kneading process for three times by means of a three-rod roll.
  • thermally conductive composition samples thus prepared were each examined for consistency and oil separation degree in accordance with JIS-K-2220 with the intention of using them as grease, and further the thermal conductivities thereof were measured with a hot-wire instrument for measuring thermal conductivity, Model TCW-1000, made by Shinku Riko Co., Ltd. The results obtained are shown in Table 5.
  • the symbols B-1 and B-2 used in Table 5 to represent Component (B) are pulverized AlN (average particle size: 0.1-5 ⁇ m) and a synthetic diamond powder (average particle size: 0.1-5 ⁇ m) respectively; while the symbols C-1 and C-2 used therein to represent Component (C) are a zinc oxide powder (average particle size: 0.05-5 ⁇ m) and a hexagonal boron nitride powder (average particle size: 0.1-5 ⁇ m).
  • thermally conductive grease composition samples were prepared in the same manner as in the aforementioned Examples 15-27, except that the amounts of fillers used as Components (B) and (C) were each changed variously.
  • the consistency, oil separation degree and thermal conductivity of each composition prepared were measured in the same ways as in each Example, and the measurement results obtained are shown in Table 6.
  • the present thermally conductive silicone grease compositions had their thermal conductivity in the range of 2.59 to 4.02 W/m°K.
  • the present compositions underwent considerable improvement in thermal conductivity over conventional grease compositions and the comparative compositions.
  • the present compositions had the consistency on the practically optimum level for the use as grease and satisfactory dispensation suitability.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • Lubricants (AREA)
EP98308489A 1998-02-27 1998-10-16 Wärmeleitende Schmierfettzusammensetzung Withdrawn EP0939115A1 (de)

Applications Claiming Priority (4)

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JP10064582A JP2938429B1 (ja) 1998-02-27 1998-02-27 熱伝導性シリコーン組成物
JP10064581A JP2938428B1 (ja) 1998-02-27 1998-02-27 熱伝導性グリース組成物
JP6458198 1998-02-27
JP6458298 1998-02-27

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Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0982392A1 (de) * 1998-08-21 2000-03-01 Shin-Etsu Chemical Co., Ltd. Wärmeleitende Schmiermittelzusammensetzung und damit ausgerüstete Halbleitervorrichtung
EP0982391A1 (de) * 1998-08-17 2000-03-01 Shin-Etsu Chemical Co., Ltd. Pulveriges Aluminiumnitrid und wärmeleitende dieses Pulver enthaltende Schmierfettzusammensetzung
US7135232B2 (en) * 2003-07-04 2006-11-14 Fuji Polymer Industries Co., Ltd. Thermal conductive composition, a heat dissipating putty sheet and heat dissipating structure using the same
CN100376655C (zh) * 2004-06-30 2008-03-26 鸿富锦精密工业（深圳）有限公司 热介面材料
US7695817B2 (en) 2003-11-05 2010-04-13 Dow Corning Corporation Thermally conductive grease and methods and devices in which said grease is used
US8313243B2 (en) 2007-10-26 2012-11-20 Ntn Corporation Rolling bearing and seal for rolling bearing
US8383005B2 (en) 2010-11-12 2013-02-26 Shin-Etsu Chemical Co., Ltd. Thermally conductive silicone grease composition
WO2013155078A1 (en) 2012-04-10 2013-10-17 Lubrication Technology Inc. Lubricant for oxygen - enriched enviironments
US8618211B2 (en) 2009-03-16 2013-12-31 Dow Corning Corporation Thermally conductive grease and methods and devices in which said grease is used
US9481851B2 (en) 2012-04-24 2016-11-01 Shin-Etsu Chemical Co., Ltd. Thermally-curable heat-conductive silicone grease composition
US9698077B2 (en) 2013-01-22 2017-07-04 Shin-Etsu Chemical Co., Ltd. Heat conductive silicone composition based on combination of components, heat conductive layer, and semiconductor device
US9777205B2 (en) 2014-09-22 2017-10-03 Dow Global Technologies Llc Thermal grease based on hyperbranched olefinic fluid
US9969919B2 (en) 2013-09-20 2018-05-15 Shin-Etsu Chemical Co., Ltd. Silicone composition and method for manufacturing heat-conductive silicone composition
US10023741B2 (en) 2013-05-24 2018-07-17 Shin-Etsu Chemical Co., Ltd. Heat-conductive silicone composition
US10704008B2 (en) 2015-04-30 2020-07-07 Shin-Etsu Chemical Co., Ltd. Heat-conductive silicone grease composition
CN111433312A (zh) * 2017-12-04 2020-07-17 积水保力马科技株式会社 热传导性组合物
CN112194899A (zh) * 2020-09-30 2021-01-08 深圳市飞荣达科技股份有限公司 一种导热硅脂及其制备方法
US11041072B2 (en) 2014-11-25 2021-06-22 Shin-Etsu Chemical Co., Ltd. One-pack addition curable silicone composition, method for storing same, and method for curing same
US11124727B2 (en) 2017-06-28 2021-09-21 Dow Global Technologies Llc Low VOC lubricant compositions
US11214651B2 (en) 2016-08-03 2022-01-04 Shin-Etsu Chemical Co., Ltd. Thermally conductive silicone composition
CN114106787A (zh) * 2021-12-02 2022-03-01 中国石油化工股份有限公司 一种冷却介质组合物及其制备方法
US11319412B2 (en) 2016-10-31 2022-05-03 Dow Toray Co., Ltd. Thermally conductive silicone compound
US11591470B2 (en) 2018-01-15 2023-02-28 Shin-Etsu Chemical Co., Ltd. Silicone composition

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EP0382188A1 (de) * 1989-02-08 1990-08-16 Dow Corning Corporation Thermisch leitfähige Organosiloxanzusammensetzungen
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Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0982391A1 (de) * 1998-08-17 2000-03-01 Shin-Etsu Chemical Co., Ltd. Pulveriges Aluminiumnitrid und wärmeleitende dieses Pulver enthaltende Schmierfettzusammensetzung
US6136758A (en) * 1998-08-17 2000-10-24 Shin-Etsu Chemical Co., Ltd. Aluminum nitride powder and thermally conductive grease composition using the same
EP0982392A1 (de) * 1998-08-21 2000-03-01 Shin-Etsu Chemical Co., Ltd. Wärmeleitende Schmiermittelzusammensetzung und damit ausgerüstete Halbleitervorrichtung
US6372337B2 (en) 1998-08-21 2002-04-16 Shin-Etsu Chemical Co., Ltd. Thermally conductive grease composition and semiconductor device using the same
US7135232B2 (en) * 2003-07-04 2006-11-14 Fuji Polymer Industries Co., Ltd. Thermal conductive composition, a heat dissipating putty sheet and heat dissipating structure using the same
CN100402626C (zh) * 2003-07-04 2008-07-16 富士高分子工业株式会社 导热性组合物及使用其的腻子状散热片和散热结构体
US7695817B2 (en) 2003-11-05 2010-04-13 Dow Corning Corporation Thermally conductive grease and methods and devices in which said grease is used
CN100376655C (zh) * 2004-06-30 2008-03-26 鸿富锦精密工业（深圳）有限公司 热介面材料
US8313243B2 (en) 2007-10-26 2012-11-20 Ntn Corporation Rolling bearing and seal for rolling bearing
US8618211B2 (en) 2009-03-16 2013-12-31 Dow Corning Corporation Thermally conductive grease and methods and devices in which said grease is used
US8383005B2 (en) 2010-11-12 2013-02-26 Shin-Etsu Chemical Co., Ltd. Thermally conductive silicone grease composition
WO2013155078A1 (en) 2012-04-10 2013-10-17 Lubrication Technology Inc. Lubricant for oxygen - enriched enviironments
US9481851B2 (en) 2012-04-24 2016-11-01 Shin-Etsu Chemical Co., Ltd. Thermally-curable heat-conductive silicone grease composition
US9698077B2 (en) 2013-01-22 2017-07-04 Shin-Etsu Chemical Co., Ltd. Heat conductive silicone composition based on combination of components, heat conductive layer, and semiconductor device
US10023741B2 (en) 2013-05-24 2018-07-17 Shin-Etsu Chemical Co., Ltd. Heat-conductive silicone composition
US10202529B2 (en) 2013-09-20 2019-02-12 Shin-Etsu Chemical Co., Ltd. Silicone composition and method for manufacturing heat-conductive silicone composition
US9969919B2 (en) 2013-09-20 2018-05-15 Shin-Etsu Chemical Co., Ltd. Silicone composition and method for manufacturing heat-conductive silicone composition
US9777205B2 (en) 2014-09-22 2017-10-03 Dow Global Technologies Llc Thermal grease based on hyperbranched olefinic fluid
RU2672247C2 (ru) * 2014-09-22 2018-11-13 Дау Глоубл Текнолоджиз Ллк Теплопроводная паста на основе сверхразветвленной олефиновой текучей среды
US11041072B2 (en) 2014-11-25 2021-06-22 Shin-Etsu Chemical Co., Ltd. One-pack addition curable silicone composition, method for storing same, and method for curing same
US10704008B2 (en) 2015-04-30 2020-07-07 Shin-Etsu Chemical Co., Ltd. Heat-conductive silicone grease composition
US11214651B2 (en) 2016-08-03 2022-01-04 Shin-Etsu Chemical Co., Ltd. Thermally conductive silicone composition
US11319412B2 (en) 2016-10-31 2022-05-03 Dow Toray Co., Ltd. Thermally conductive silicone compound
US11124727B2 (en) 2017-06-28 2021-09-21 Dow Global Technologies Llc Low VOC lubricant compositions
US11236259B2 (en) * 2017-12-04 2022-02-01 Sekisui Polymatech Co., Ltd. Thermally conductive composition
CN111433312A (zh) * 2017-12-04 2020-07-17 积水保力马科技株式会社 热传导性组合物
US11591470B2 (en) 2018-01-15 2023-02-28 Shin-Etsu Chemical Co., Ltd. Silicone composition
CN112194899A (zh) * 2020-09-30 2021-01-08 深圳市飞荣达科技股份有限公司 一种导热硅脂及其制备方法
CN112194899B (zh) * 2020-09-30 2022-06-03 深圳市飞荣达科技股份有限公司 一种导热硅脂及其制备方法
CN114106787A (zh) * 2021-12-02 2022-03-01 中国石油化工股份有限公司 一种冷却介质组合物及其制备方法
CN114106787B (zh) * 2021-12-02 2024-01-23 中国石油化工股份有限公司 一种冷却介质组合物及其制备方法

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