DE68926361D1 - Verfahren und Vorrichtung zur Aufbringung einer dünnen Schicht auf ein Substrat unter Druck - Google Patents

Verfahren und Vorrichtung zur Aufbringung einer dünnen Schicht auf ein Substrat unter Druck

Info

Publication number
DE68926361D1
DE68926361D1 DE68926361T DE68926361T DE68926361D1 DE 68926361 D1 DE68926361 D1 DE 68926361D1 DE 68926361 T DE68926361 T DE 68926361T DE 68926361 T DE68926361 T DE 68926361T DE 68926361 D1 DE68926361 D1 DE 68926361D1
Authority
DE
Germany
Prior art keywords
applying
under pressure
thin layer
substrate under
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68926361T
Other languages
English (en)
Other versions
DE68926361T2 (de
Inventor
Fumio Hamamura
Yukio Oka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Somar Corp
Hitachi Plant Technologies Ltd
Original Assignee
Somar Corp
Hitachi Techno Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63072959A external-priority patent/JPH0622199B2/ja
Priority claimed from JP63072960A external-priority patent/JPH0622200B2/ja
Application filed by Somar Corp, Hitachi Techno Engineering Co Ltd filed Critical Somar Corp
Application granted granted Critical
Publication of DE68926361D1 publication Critical patent/DE68926361D1/de
Publication of DE68926361T2 publication Critical patent/DE68926361T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0036—Heat treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0091—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor in particular atmospheres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/04—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by at least one layer folded at the edge, e.g. over another layer ; characterised by at least one layer enveloping or enclosing a material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223—One or more of the layers being plastic
    • B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B29C2043/561—Compression moulding under special conditions, e.g. vacuum under vacuum conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/108—Flash, trim or excess removal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y10T156/1093—All laminae planar and face to face with covering of discrete laminae with additional lamina
    • Y10T156/1095—Opposed laminae are running length webs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1712—Indefinite or running length work
    • Y10T156/1734—Means bringing articles into association with web

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Thermal Sciences (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
DE68926361T 1988-03-25 1989-03-28 Verfahren und Vorrichtung zur Aufbringung einer dünnen Schicht auf ein Substrat unter Druck Expired - Fee Related DE68926361T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63072959A JPH0622199B2 (ja) 1988-03-25 1988-03-25 薄膜圧着方法及び薄膜圧着装置
JP63072960A JPH0622200B2 (ja) 1988-03-25 1988-03-25 薄膜張付方法及びその実施装置

Publications (2)

Publication Number Publication Date
DE68926361D1 true DE68926361D1 (de) 1996-06-05
DE68926361T2 DE68926361T2 (de) 1996-11-28

Family

ID=26414091

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68926361T Expired - Fee Related DE68926361T2 (de) 1988-03-25 1989-03-28 Verfahren und Vorrichtung zur Aufbringung einer dünnen Schicht auf ein Substrat unter Druck

Country Status (3)

Country Link
US (1) US5078820A (de)
EP (1) EP0339275B1 (de)
DE (1) DE68926361T2 (de)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK8689A (da) * 1988-01-11 1989-07-12 Thiokol Morton Inc Fremgangsmaade og apparat til placering af polymere materialer paa trykte kredsloebskort
US5098498A (en) * 1989-10-10 1992-03-24 Manville Corporation Apparatus and method for encapsulating contoured articles
JP2637261B2 (ja) * 1990-05-22 1997-08-06 ソマール株式会社 ラミネータ
JP2983253B2 (ja) * 1990-06-04 1999-11-29 伯東株式会社 真空ラミネータ
JP2899825B2 (ja) * 1990-08-24 1999-06-02 株式会社新川 リードフレーム押え装置
JPH0753357B2 (ja) * 1990-12-20 1995-06-07 ソマール株式会社 薄膜切り抜き方法とその実施装置
DE69216658T2 (de) * 1991-02-25 1997-08-07 Canon Kk Vorrichtung und Verfahren zur Verbindung elektrischer Bauelemente
IT1250461B (it) * 1991-08-09 1995-04-07 Morton Int Inc Procedimento ed apparecchio per applicare in modo continuo in particolare maschere di saldatura su pannelli di circuiti stampati.
US5679610A (en) * 1994-12-15 1997-10-21 Kabushiki Kaisha Toshiba Method of planarizing a semiconductor workpiece surface
JPH09141743A (ja) * 1995-11-24 1997-06-03 N P C:Kk ラミネート装置
US5587043A (en) * 1995-06-05 1996-12-24 Brady Usa, Inc. Thin label applicator
US5967030A (en) 1995-11-17 1999-10-19 Micron Technology, Inc. Global planarization method and apparatus
US5972780A (en) * 1996-08-22 1999-10-26 Nippon Telegraph Telephone Corporation Thin film forming apparatus and method
US5788802A (en) * 1996-10-22 1998-08-04 Preco Industries, Inc. Vacuum drum feed and alignment apparatus for multiple layer laminator
AU6556598A (en) * 1997-03-28 1998-10-22 Preco Industries, Inc. Web or sheet-fed apparatus having high-speed positioning mechanism
US7640836B1 (en) 1997-03-28 2010-01-05 Preco Industries, Inc. Method for simultaneous x, y and θ registration of segment of continuous web with a processing station
US6331488B1 (en) * 1997-05-23 2001-12-18 Micron Technology, Inc. Planarization process for semiconductor substrates
US6316363B1 (en) 1999-09-02 2001-11-13 Micron Technology, Inc. Deadhesion method and mechanism for wafer processing
DE19812402A1 (de) * 1998-03-20 1999-09-23 Cww Gerko Akustik Gmbh & Co Kg Vorrichtung zum Anbringen einer Folie, insbesondere akustisch wirksamen Folie
US6218316B1 (en) 1998-10-22 2001-04-17 Micron Technology, Inc. Planarization of non-planar surfaces in device fabrication
US6050318A (en) * 1998-12-11 2000-04-18 Record Products Of America, Inc. Apparatus and method for protective layer application
JP3394215B2 (ja) * 1999-07-29 2003-04-07 株式会社 日立インダストリイズ フィルム減圧貼り合わせ装置
ATE246588T1 (de) 1999-11-02 2003-08-15 Richard Warrington George Verfahren und vorrichtung zum warmformen von kunststofffolien
GB2355958B (en) * 1999-11-02 2004-02-11 Richard Warrington George A method of and apparatus for forming plastics sheets
DE10026270C1 (de) * 2000-05-26 2001-12-20 Siemens Ag Verfahren zum Laminieren einer Leiterplatte auf eine Grundplatte und Laminiervorrichtung
US6518172B1 (en) 2000-08-29 2003-02-11 Micron Technology, Inc. Method for applying uniform pressurized film across wafer
US6499526B1 (en) * 2000-10-11 2002-12-31 The United States Of America As Represented By The Secretary Of The Navy Umbilical cable bonding tool
JP3883929B2 (ja) * 2001-09-25 2007-02-21 大日本スクリーン製造株式会社 薄膜形成装置および薄膜形成方法
EP1991417A4 (de) 2006-01-24 2011-06-08 Mycrolab Pty Ltd Verfahren zur kostengünstigen herstellung von komplexen mehrschichtigen materialien und vorrichtungen
JP4666519B2 (ja) * 2006-09-08 2011-04-06 リンテック株式会社 シート貼付装置
CN101262744B (zh) * 2007-03-08 2011-01-19 奈电软性科技电子(珠海)有限公司 假贴机
DE102007027999A1 (de) 2007-06-14 2008-12-18 Leonhard Kurz Gmbh & Co. Kg Heißprägen von Strukturen
DE102007027998A1 (de) 2007-06-14 2008-12-18 Leonhard Kurz Gmbh & Co. Kg Heißprägen von Leiterbahnen auf Photovoltaik-Silizium-Wafer
JP4773419B2 (ja) * 2007-12-20 2011-09-14 リンテック株式会社 シート貼付装置及び貼付方法
EP2189283A1 (de) * 2008-11-21 2010-05-26 komax Holding AG Vorrichtung zum Laminieren eines Solarmoduls
JP5334135B2 (ja) 2010-08-20 2013-11-06 ニチゴー・モートン株式会社 積層装置
TWI402171B (zh) * 2010-11-11 2013-07-21 C Sun Mfg Ltd 壓合裝置及其壓合方法
KR102050770B1 (ko) * 2012-02-01 2019-12-02 에이지씨 가부시키가이샤 적층체의 제조 방법 및 제조 장치
US20130312907A1 (en) * 2012-05-23 2013-11-28 Lg Display Co., Ltd. Substrate-bonding apparatus for display device and method for manufacturing bonded substrate
CN103144398B (zh) * 2013-03-06 2015-04-22 旭东机械(昆山)有限公司 贴膜机及其贴膜方法
CN105538902B (zh) * 2015-12-30 2018-05-18 浙江新嘉联电子科技有限公司 一种自动震膜装配机的盖膜组件
EP3363617A1 (de) * 2017-02-16 2018-08-22 3M Innovative Properties Company Vorrichtung zum aufbringen einer folie
CN107214971A (zh) * 2017-05-08 2017-09-29 安徽颍瑞源焊管科技有限公司 一种集成墙面板压平覆膜装置
CN108715026B (zh) * 2018-05-23 2020-06-19 湖北精洲铝业有限公司 一种铝合金生产加工用整平贴膜装置
JP7355809B2 (ja) * 2018-07-30 2023-10-03 コーニング インコーポレイテッド 流体の流れを用いた基板梱包装置及び方法
DE102018215939A1 (de) * 2018-09-19 2020-03-19 Profol GmbH Werkzeug zum Aufbringen einer Folie
CN110789768B (zh) * 2019-11-29 2021-09-28 航天科技控股集团股份有限公司 一种车载终端产品自动贴膜方法
CN111823695B (zh) * 2020-08-04 2022-06-07 郴州科宝新材料科技有限公司 一种强力上胶复合贴合设备

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1206656A (en) * 1912-08-01 1916-11-28 Edouard Benedictus Press-plate.
NL302012A (de) * 1963-08-14
US3322598A (en) * 1963-10-02 1967-05-30 Alvin M Marks Laminator for securing continuous flexible film to a base
US3860473A (en) * 1969-07-03 1975-01-14 Glen L Wesen Method for making pressure sensitive label records
US3658629A (en) * 1970-02-27 1972-04-25 Ibm Photopolymer resist sheet laminator
US4544619A (en) * 1970-03-03 1985-10-01 Shipley Company Inc. Photosensitive laminate
US3870582A (en) * 1972-10-05 1975-03-11 Polaroid Corp Novel laminating system
US4152188A (en) * 1973-05-25 1979-05-01 Saint-Gobain Industries Method and apparatus for manufacture of laminated glazing
DE2544553C2 (de) * 1974-10-08 1983-08-04 E.I. du Pont de Nemours and Co., 19898 Wilmington, Del. Verfahren zum Aufbringen einer photopolymerisierbaren festen Resistschicht auf ein Substrat
US4127436A (en) * 1975-04-17 1978-11-28 E. I. Du Pont De Nemours And Company Vacuum laminating process
FR2447819A1 (fr) * 1979-01-30 1980-08-29 Essilor Int Procede et dispositif pour la decoration d'un quelconque substrat, en particulier monture de lunettes
DE2932845C2 (de) * 1979-08-14 1981-04-09 G. Siempelkamp Gmbh & Co, 4150 Krefeld Vorrichtung zum Zusammenlegen von Pressgutpaketen bei der Herstellung von Laminatplatten
US4316757A (en) * 1980-03-03 1982-02-23 Monsanto Company Method and apparatus for wax mounting of thin wafers for polishing
US4373846A (en) * 1980-10-24 1983-02-15 Charbonnet Carl D Panel transferring apparatus
US4338152A (en) * 1981-02-17 1982-07-06 E. I. Du Pont De Nemours And Company Gripping arrangement for an apparatus for automatically laminating circuit boards
FR2530186A1 (fr) * 1982-07-19 1984-01-20 Saint Gobain Vitrage Procede pour recouvrir d'une pellicule de protection en matiere plastique une ebauche de verre de lunettes et dispositif pour la realisation de ce procede
JPS59206200A (ja) * 1983-05-06 1984-11-21 Mitsubishi Monsanto Chem Co 積層体製造用金型及び積層体の製造方法
FR2546635B1 (fr) * 1983-05-25 1986-07-04 Saint Gobain Vitrage Procede et dispositif pour recouvrir une ebauche d'un verre de lunettes par une feuille de protection
US4511425A (en) * 1983-06-13 1985-04-16 Dennison Manufacturing Company Heated pad decorator
FR2561169B1 (fr) * 1984-03-14 1987-02-27 Perus Rene Procede et dispositif de fabrication de verre feuillete de securite
US4680079A (en) * 1984-03-16 1987-07-14 Fujitsu Limited Printed circuit board laminating apparatus
JPS6252552A (ja) * 1985-08-30 1987-03-07 Hitachi Chem Co Ltd 減圧貼り合わせ方法及び装置
JPS62117389A (ja) * 1985-11-15 1987-05-28 日立化成工業株式会社 フレキシブル配線板の製造法
DK8689A (da) * 1988-01-11 1989-07-12 Thiokol Morton Inc Fremgangsmaade og apparat til placering af polymere materialer paa trykte kredsloebskort
US4834821A (en) * 1988-01-11 1989-05-30 Morton Thiokol, Inc. Process for preparing polymeric materials for application to printed circuits

Also Published As

Publication number Publication date
EP0339275B1 (de) 1996-05-01
US5078820A (en) 1992-01-07
DE68926361T2 (de) 1996-11-28
EP0339275A3 (en) 1990-10-10
EP0339275A2 (de) 1989-11-02

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