DE68926072D1 - Verfahren zum Ausbilden eines Musters und Verfahren zur Herstellung einer Halbleitervorrichtung - Google Patents

Verfahren zum Ausbilden eines Musters und Verfahren zur Herstellung einer Halbleitervorrichtung

Info

Publication number
DE68926072D1
DE68926072D1 DE68926072T DE68926072T DE68926072D1 DE 68926072 D1 DE68926072 D1 DE 68926072D1 DE 68926072 T DE68926072 T DE 68926072T DE 68926072 T DE68926072 T DE 68926072T DE 68926072 D1 DE68926072 D1 DE 68926072D1
Authority
DE
Germany
Prior art keywords
pattern
manufacturing
forming
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68926072T
Other languages
English (en)
Other versions
DE68926072T2 (de
Inventor
Hiroshi Shiraishi
Takumi Ueno
Fumio Murai
Hajime Hayakawa
Asao Isobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Hitachi Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of DE68926072D1 publication Critical patent/DE68926072D1/de
Publication of DE68926072T2 publication Critical patent/DE68926072T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/145—Infrared
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/167—X-ray
    • Y10S430/168—X-ray exposure process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/948—Radiation resist
    • Y10S438/95—Multilayer mask including nonradiation sensitive layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
DE68926072T 1988-07-11 1989-07-11 Verfahren zum Ausbilden eines Musters und Verfahren zur Herstellung einer Halbleitervorrichtung Expired - Fee Related DE68926072T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63170953A JP2551632B2 (ja) 1988-07-11 1988-07-11 パターン形成方法および半導体装置製造方法

Publications (2)

Publication Number Publication Date
DE68926072D1 true DE68926072D1 (de) 1996-05-02
DE68926072T2 DE68926072T2 (de) 1996-11-21

Family

ID=15914440

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68926072T Expired - Fee Related DE68926072T2 (de) 1988-07-11 1989-07-11 Verfahren zum Ausbilden eines Musters und Verfahren zur Herstellung einer Halbleitervorrichtung

Country Status (4)

Country Link
US (1) US5441849A (de)
EP (1) EP0350873B1 (de)
JP (1) JP2551632B2 (de)
DE (1) DE68926072T2 (de)

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JPH05343308A (ja) * 1992-06-09 1993-12-24 Mitsubishi Electric Corp 半導体装置の製造方法
US5376227A (en) * 1992-11-12 1994-12-27 Goldstar Electron Co., Ltd. Multilevel resist process
US6476387B1 (en) * 1998-05-15 2002-11-05 Hitachi, Ltd. Method and apparatus for observing or processing and analyzing using a charged beam
DE19907621B4 (de) * 1999-02-23 2005-12-15 Robert Bosch Gmbh Ätzmaskierung
US6277691B1 (en) 2000-04-04 2001-08-21 Chartered Semiconductor Manufacturing Ltd. Method to fabricate a robust and reliable memory device
JP4729803B2 (ja) * 2001-03-29 2011-07-20 Ｊｓｒ株式会社 多層レジストプロセス用下層膜形成組成物
US6613666B2 (en) 2001-12-07 2003-09-02 Applied Materials Inc. Method of reducing plasma charging damage during dielectric etch process for dual damascene interconnect structures
US7125645B2 (en) * 2002-04-10 2006-10-24 United Microelectronics Corp. Composite photoresist for pattern transferring
CN1316564C (zh) * 2002-04-11 2007-05-16 联华电子股份有限公司 复合光致抗蚀剂层结构
US7607227B2 (en) * 2006-02-08 2009-10-27 Eastman Kodak Company Method of forming a printhead
US7897008B2 (en) * 2006-10-27 2011-03-01 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for regional plasma control
US8387674B2 (en) 2007-11-30 2013-03-05 Taiwan Semiconductor Manufacturing Comany, Ltd. Chip on wafer bonder
CN102803324B (zh) 2009-06-19 2015-09-16 日产化学工业株式会社 咔唑酚醛清漆树脂
US8178280B2 (en) * 2010-02-05 2012-05-15 Taiwan Semiconductor Manufacturing Company, Ltd. Self-contained proximity effect correction inspiration for advanced lithography (special)
WO2012077640A1 (ja) 2010-12-09 2012-06-14 日産化学工業株式会社 水酸基含有カルバゾールノボラック樹脂を含むレジスト下層膜形成組成物
JP6066092B2 (ja) 2011-09-29 2017-01-25 日産化学工業株式会社 ジアリールアミンノボラック樹脂
JP6137486B2 (ja) 2012-02-01 2017-05-31 日産化学工業株式会社 複素環を含む共重合樹脂を含むレジスト下層膜形成組成物
KR102072490B1 (ko) 2012-03-27 2020-02-03 닛산 가가쿠 가부시키가이샤 페닐인돌 함유 노볼락 수지를 포함하는 레지스트 하층막 형성 조성물
KR102076528B1 (ko) 2012-08-21 2020-02-13 닛산 가가쿠 가부시키가이샤 다핵 페놀류를 갖는 노볼락 수지를 포함하는 레지스트 하층막 형성 조성물
KR102357731B1 (ko) 2012-12-18 2022-02-08 닛산 가가쿠 가부시키가이샤 다환방향족 비닐화합물을 포함하는 자기조직화막의 하층막 형성조성물
JP6332645B2 (ja) 2013-05-13 2018-05-30 日産化学工業株式会社 ビスフェノールアルデヒドを用いたノボラック樹脂含有レジスト下層膜形成組成物
US20170097568A1 (en) 2014-03-31 2017-04-06 Nissan Chemical Industries, Ltd. Resist underlayer film-forming composition containing novolac resin to which aromatic vinyl compound is added
CN106662819B (zh) 2014-08-08 2021-06-25 日产化学工业株式会社 包含芳香族羟甲基化合物反应而得的酚醛清漆树脂的抗蚀剂下层膜形成用组合物

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5315153A (en) * 1976-07-27 1978-02-10 Canon Inc Hologram
JPS5796333A (en) * 1980-12-09 1982-06-15 Fujitsu Ltd Production of substrate for exposure of charged beam
US4463265A (en) * 1982-06-17 1984-07-31 Hewlett-Packard Company Electron beam proximity effect correction by reverse field pattern exposure
JPS59116745A (ja) * 1982-12-24 1984-07-05 Fujitsu Ltd パタ−ン形成方法
JPS60103342A (ja) * 1983-11-11 1985-06-07 Toshiba Corp カラ−フイルタ用レジスト組成物
JPS60117241A (ja) * 1983-11-29 1985-06-24 Fujitsu Ltd ネガ型レジスト組成物
JPS60185037A (ja) * 1984-03-03 1985-09-20 Matsushita Electric Works Ltd 熱交換装置
JPS60258555A (ja) * 1984-05-11 1985-12-20 Fuji Xerox Co Ltd 電子写真用感光体
US4702993A (en) * 1985-11-25 1987-10-27 Rca Corporation Treatment of planarizing layer in multilayer electron beam resist
JPS6356655A (ja) * 1986-08-27 1988-03-11 Fujitsu Ltd パタ−ン形成方法
JPS63113445A (ja) * 1986-10-30 1988-05-18 Fujitsu Ltd 二層構造レジストにおける平坦化層の形成方法
JPS63160225A (ja) * 1986-12-23 1988-07-04 Fujitsu Ltd 半導体装置の製造方法
JPS63160224A (ja) * 1986-12-23 1988-07-04 Fujitsu Ltd 半導体装置の製造方法
JP2555657B2 (ja) * 1987-12-24 1996-11-20 富士通株式会社 二層構造電子線レジスト用下層レジスト

Also Published As

Publication number Publication date
EP0350873A3 (de) 1991-05-08
JP2551632B2 (ja) 1996-11-06
EP0350873B1 (de) 1996-03-27
JPH0222657A (ja) 1990-01-25
EP0350873A2 (de) 1990-01-17
DE68926072T2 (de) 1996-11-21
US5441849A (en) 1995-08-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee