DE68920944D1 - Packungsstrukturen für integrierte Mehrschichtschaltungen. - Google Patents

Packungsstrukturen für integrierte Mehrschichtschaltungen.

Info

Publication number
DE68920944D1
DE68920944D1 DE68920944T DE68920944T DE68920944D1 DE 68920944 D1 DE68920944 D1 DE 68920944D1 DE 68920944 T DE68920944 T DE 68920944T DE 68920944 T DE68920944 T DE 68920944T DE 68920944 D1 DE68920944 D1 DE 68920944D1
Authority
DE
Germany
Prior art keywords
integrated multilayer
multilayer circuits
packing structures
packing
structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68920944T
Other languages
English (en)
Other versions
DE68920944T2 (de
Inventor
Harry Randall Bickford
Mark Fielding Bregman
Thomas Mario Cipolla
John Gow
Peter Gerard Ledermann
Ekkehard Fritz Miersch
Leonard Theodore Olson
David Peter Pagnini
Timothy Clark Reiley
Uh-Po Eric Tsou
Walter Valerian Vilkelis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE68920944D1 publication Critical patent/DE68920944D1/de
Application granted granted Critical
Publication of DE68920944T2 publication Critical patent/DE68920944T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
DE68920944T 1988-10-28 1989-08-24 Packungsstrukturen für integrierte Mehrschichtschaltungen. Expired - Fee Related DE68920944T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/263,835 US5028983A (en) 1988-10-28 1988-10-28 Multilevel integrated circuit packaging structures

Publications (2)

Publication Number Publication Date
DE68920944D1 true DE68920944D1 (de) 1995-03-16
DE68920944T2 DE68920944T2 (de) 1995-08-10

Family

ID=23003430

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68920944T Expired - Fee Related DE68920944T2 (de) 1988-10-28 1989-08-24 Packungsstrukturen für integrierte Mehrschichtschaltungen.

Country Status (4)

Country Link
US (1) US5028983A (de)
EP (1) EP0365783B1 (de)
JP (1) JPH0612782B2 (de)
DE (1) DE68920944T2 (de)

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US5164888A (en) * 1988-12-29 1992-11-17 International Business Machines Method and structure for implementing dynamic chip burn-in
US5135155A (en) * 1989-08-25 1992-08-04 International Business Machines Corporation Thermocompression bonding in integrated circuit packaging
US5242569A (en) * 1989-08-25 1993-09-07 International Business Machines Corporation Thermocompression bonding in integrated circuit packaging
KR910020869A (ko) * 1990-05-10 1991-12-20 원본 미기재 무통로 2-금속 테이프 자동 접착시스템
KR940008342B1 (ko) * 1990-06-01 1994-09-12 가부시키가이샤 도시바 필름캐리어를 이용한 반도체장치
JP2848682B2 (ja) * 1990-06-01 1999-01-20 株式会社東芝 高速動作用半導体装置及びこの半導体装置に用いるフィルムキャリア
GB9018763D0 (en) * 1990-08-28 1990-10-10 Lsi Logic Europ Mounting of electronic devices
GB9018764D0 (en) * 1990-08-28 1990-10-10 Lsi Logic Europ Packaging of electronic devices
US5229328A (en) * 1990-10-24 1993-07-20 International Business Machines Corporation Method for bonding dielectric mounted conductors to semiconductor chip contact pads
US5233221A (en) * 1990-10-24 1993-08-03 International Business Machines Corporation Electronic substrate multiple location conductor attachment technology
US5117275A (en) * 1990-10-24 1992-05-26 International Business Machines Corporation Electronic substrate multiple location conductor attachment technology
US5173763A (en) * 1991-02-11 1992-12-22 International Business Machines Corporation Electronic packaging with varying height connectors
US5144228A (en) * 1991-04-23 1992-09-01 International Business Machines Corporation Probe interface assembly
US5550323A (en) * 1991-08-28 1996-08-27 Lsi Logic Corporation Mounting of electronic devices
US5239448A (en) * 1991-10-28 1993-08-24 International Business Machines Corporation Formulation of multichip modules
JPH05136327A (ja) * 1991-11-12 1993-06-01 Toshiba Corp 半導体パツケージ
JP2661442B2 (ja) * 1991-12-03 1997-10-08 日本電気株式会社 樹脂封止型半導体装置及びその製造方法
US5221858A (en) * 1992-02-14 1993-06-22 Motorola, Inc. Tape automated bonding (TAB) semiconductor device with ground plane and method for making the same
US5854085A (en) * 1992-06-04 1998-12-29 Lsi Logic Corporation Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same
US5285018A (en) * 1992-10-02 1994-02-08 International Business Machines Corporation Power and signal distribution in electronic packaging
JP2500785B2 (ja) * 1993-09-20 1996-05-29 日本電気株式会社 半導体パッケ―ジ用フィルムキャリアテ−プ及びこれを用いた半導体装置
US5343074A (en) * 1993-10-04 1994-08-30 Motorola, Inc. Semiconductor device having voltage distribution ring(s) and method for making the same
JPH08222657A (ja) * 1995-02-17 1996-08-30 Hitachi Ltd 半導体集積回路装置
US6909179B2 (en) * 1996-03-18 2005-06-21 Renesas Technology Corp. Lead frame and semiconductor device using the lead frame and method of manufacturing the same
JPH09293283A (ja) * 1996-04-25 1997-11-11 Hewlett Packard Co <Hp> プローブ装置およびその製造方法、ならびにメディア移動型メモリ装置
JP3717660B2 (ja) * 1998-04-28 2005-11-16 株式会社ルネサステクノロジ フィルムキャリア及びバーンイン方法
US6549821B1 (en) * 1999-02-26 2003-04-15 Micron Technology, Inc. Stereolithographic method and apparatus for packaging electronic components and resulting structures
US6794743B1 (en) * 1999-08-06 2004-09-21 Texas Instruments Incorporated Structure and method of high performance two layer ball grid array substrate
EP1089261B1 (de) * 1999-10-01 2006-05-17 STMicroelectronics S.r.l. Verfahren zur Herstellung eines aufgehängten Elements für elektrische Verbindungen zwischen zwei Teilen eines Micromechanismus, welche relativ zueinander beweglich sind
US6926818B1 (en) 2001-09-24 2005-08-09 Taiwan Semiconductor Manufacturing Co., Ltd. Method to enhance the adhesion between dry film and seed metal
US6693384B1 (en) * 2002-02-01 2004-02-17 Alien Technology Corporation Interconnect structure for electronic devices
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US20070197030A1 (en) * 2002-10-10 2007-08-23 Samsung Electronics Co., Ltd. Center pad type ic chip with jumpers, method of processing the same and multi chip package
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JP4311376B2 (ja) 2005-06-08 2009-08-12 セイコーエプソン株式会社 半導体装置、半導体装置の製造方法、電子部品、回路基板及び電子機器
US9177770B2 (en) * 2007-07-11 2015-11-03 Excellims Corporation Ion gate method and apparatus
US8004798B1 (en) 2008-03-31 2011-08-23 Magnecomp Corporation High bandwidth flexure for hard disk drives
US8102668B2 (en) * 2008-05-06 2012-01-24 International Rectifier Corporation Semiconductor device package with internal device protection
US7994871B2 (en) * 2008-06-30 2011-08-09 Himax Technologies Limited Chip on film trace routing method for electrical magnetic interference reduction
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KR100950511B1 (ko) 2009-09-22 2010-03-30 테세라 리써치 엘엘씨 와이어 본딩 및 도전성 기준 소자에 의해 제어되는 임피던스를 포함하는 마이크로전자 어셈블리
KR101457939B1 (ko) * 2009-11-02 2014-11-10 엘지이노텍 주식회사 탭 테이프 및 그 제조방법
JP5341717B2 (ja) 2009-11-10 2013-11-13 ルネサスエレクトロニクス株式会社 半導体パッケージ及びシステム
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US9136197B2 (en) 2010-09-16 2015-09-15 Tessera, Inc. Impedence controlled packages with metal sheet or 2-layer RDL
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Also Published As

Publication number Publication date
JPH0612782B2 (ja) 1994-02-16
EP0365783B1 (de) 1995-02-01
EP0365783A3 (en) 1990-11-22
EP0365783A2 (de) 1990-05-02
US5028983A (en) 1991-07-02
DE68920944T2 (de) 1995-08-10
JPH02165647A (ja) 1990-06-26

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