DE68915523D1 - Verfahren zur Herstellung eines Silicium-auf-Isolator-Bauelementes unter Verwendung einer verbesserten Verkapselungsschicht. - Google Patents
Verfahren zur Herstellung eines Silicium-auf-Isolator-Bauelementes unter Verwendung einer verbesserten Verkapselungsschicht.Info
- Publication number
- DE68915523D1 DE68915523D1 DE68915523T DE68915523T DE68915523D1 DE 68915523 D1 DE68915523 D1 DE 68915523D1 DE 68915523 T DE68915523 T DE 68915523T DE 68915523 T DE68915523 T DE 68915523T DE 68915523 D1 DE68915523 D1 DE 68915523D1
- Authority
- DE
- Germany
- Prior art keywords
- silicon
- manufacturing
- encapsulation layer
- insulator device
- improved encapsulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H01L21/02683—Continuous wave laser beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
- H01L21/02129—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material being boron or phosphorus doped silicon oxides, e.g. BPSG, BSG or PSG
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02598—Microstructure monocrystalline
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02689—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using particle beams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02691—Scanning of a beam
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10S117/903—Dendrite or web or cage technique
- Y10S117/904—Laser beam
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/152—Single crystal on amorphous substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/154—Solid phase epitaxy
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Optics & Photonics (AREA)
- Recrystallisation Techniques (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/292,606 US4990464A (en) | 1988-12-30 | 1988-12-30 | Method of forming improved encapsulation layer |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68915523D1 true DE68915523D1 (de) | 1994-06-30 |
DE68915523T2 DE68915523T2 (de) | 1994-12-22 |
Family
ID=23125404
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68915523T Expired - Fee Related DE68915523T2 (de) | 1988-12-30 | 1989-12-21 | Verfahren zur Herstellung eines Silicium-auf-Isolator-Bauelementes unter Verwendung einer verbesserten Verkapselungsschicht. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4990464A (de) |
EP (1) | EP0376400B1 (de) |
JP (1) | JP2554180B2 (de) |
KR (1) | KR900010953A (de) |
DE (1) | DE68915523T2 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5459346A (en) * | 1988-06-28 | 1995-10-17 | Ricoh Co., Ltd. | Semiconductor substrate with electrical contact in groove |
US5310446A (en) * | 1990-01-10 | 1994-05-10 | Ricoh Company, Ltd. | Method for producing semiconductor film |
US5747389A (en) * | 1991-04-30 | 1998-05-05 | Intel Corporation | Crack resistant passivation layer |
JP3416163B2 (ja) * | 1992-01-31 | 2003-06-16 | キヤノン株式会社 | 半導体基板及びその作製方法 |
JP2669333B2 (ja) * | 1993-12-13 | 1997-10-27 | 日本電気株式会社 | 半導体装置の製造方法 |
JPH0851103A (ja) * | 1994-08-08 | 1996-02-20 | Fuji Electric Co Ltd | 薄膜の生成方法 |
US5895228A (en) * | 1996-11-14 | 1999-04-20 | International Business Machines Corporation | Encapsulation of organic light emitting devices using Siloxane or Siloxane derivatives |
US6259592B1 (en) | 1998-11-19 | 2001-07-10 | Applied Materials, Inc. | Apparatus for retaining a workpiece upon a workpiece support and method of manufacturing same |
US6696360B2 (en) | 2001-03-15 | 2004-02-24 | Micron Technology, Inc. | Barrier-metal-free copper damascene technology using atomic hydrogen enhanced reflow |
US7096581B2 (en) * | 2002-03-06 | 2006-08-29 | Stmicroelectronics, Inc. | Method for providing a redistribution metal layer in an integrated circuit |
US20040121146A1 (en) * | 2002-12-20 | 2004-06-24 | Xiao-Ming He | Composite barrier films and method |
JP2005079122A (ja) * | 2003-08-29 | 2005-03-24 | Rikogaku Shinkokai | 結晶性薄膜の作製方法 |
US20090142875A1 (en) * | 2007-11-30 | 2009-06-04 | Applied Materials, Inc. | Method of making an improved selective emitter for silicon solar cells |
CN104008961A (zh) * | 2014-05-27 | 2014-08-27 | 复旦大学 | 一种改善硅晶片机械性能的方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4461670A (en) * | 1982-05-03 | 1984-07-24 | At&T Bell Laboratories | Process for producing silicon devices |
JPS59129418A (ja) * | 1983-01-13 | 1984-07-25 | Fujitsu Ltd | 半導体装置の製造方法 |
JPS59158514A (ja) * | 1983-02-28 | 1984-09-08 | Hitachi Ltd | 半導体装置の製造方法 |
JPS59205712A (ja) * | 1983-04-30 | 1984-11-21 | Fujitsu Ltd | 半導体装置の製造方法 |
US4590130A (en) * | 1984-03-26 | 1986-05-20 | General Electric Company | Solid state zone recrystallization of semiconductor material on an insulator |
JPS6119116A (ja) * | 1984-07-05 | 1986-01-28 | Matsushita Electronics Corp | 半導体装置の製造方法 |
JPS61270812A (ja) * | 1985-05-22 | 1986-12-01 | エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン | 半導体装置の製造方法 |
US4743567A (en) * | 1987-08-11 | 1988-05-10 | North American Philips Corp. | Method of forming thin, defect-free, monocrystalline layers of semiconductor materials on insulators |
-
1988
- 1988-12-30 US US07/292,606 patent/US4990464A/en not_active Expired - Fee Related
-
1989
- 1989-12-21 EP EP89203281A patent/EP0376400B1/de not_active Expired - Lifetime
- 1989-12-21 DE DE68915523T patent/DE68915523T2/de not_active Expired - Fee Related
- 1989-12-27 JP JP1336832A patent/JP2554180B2/ja not_active Expired - Lifetime
- 1989-12-28 KR KR1019890019824A patent/KR900010953A/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
DE68915523T2 (de) | 1994-12-22 |
KR900010953A (ko) | 1990-07-11 |
EP0376400A1 (de) | 1990-07-04 |
US4990464A (en) | 1991-02-05 |
EP0376400B1 (de) | 1994-05-25 |
JPH02228023A (ja) | 1990-09-11 |
JP2554180B2 (ja) | 1996-11-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8327 | Change in the person/name/address of the patent owner |
Owner name: PHILIPS ELECTRONICS N.V., EINDHOVEN, NL |
|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |