DE60232007D1 - Verfahren zur herstellung einer lichtempfindlichen keramischen zusammensetzung und mehrschichtiges substrat damit - Google Patents

Verfahren zur herstellung einer lichtempfindlichen keramischen zusammensetzung und mehrschichtiges substrat damit

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Publication number
DE60232007D1
DE60232007D1 DE60232007T DE60232007T DE60232007D1 DE 60232007 D1 DE60232007 D1 DE 60232007D1 DE 60232007 T DE60232007 T DE 60232007T DE 60232007 T DE60232007 T DE 60232007T DE 60232007 D1 DE60232007 D1 DE 60232007D1
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Germany
Prior art keywords
multilayer substrate
producing
light
ceramic composition
sensitive ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60232007T
Other languages
English (en)
Inventor
Tomoya Yamashiki
Takenori Ueoka
Mitsuyo Shimba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002121938A external-priority patent/JP4061958B2/ja
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Application granted granted Critical
Publication of DE60232007D1 publication Critical patent/DE60232007D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/102—Glass compositions containing silica with 40% to 90% silica, by weight containing lead
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    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
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    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G03F7/0043—Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof
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    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/44—Metal salt constituents or additives chosen for the nature of the anions, e.g. hydrides or acetylacetonate
    • C04B2235/446—Sulfides, tellurides or selenides
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
    • C04B2235/54—Particle size related information
    • C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
    • C04B2235/5436—Particle size related information expressed by the size of the particles or aggregates thereof micrometer sized, i.e. from 1 to 100 micron
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/56—Using constraining layers before or during sintering
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/56—Using constraining layers before or during sintering
    • C04B2237/562—Using constraining layers before or during sintering made of alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/56—Using constraining layers before or during sintering
    • C04B2237/565—Using constraining layers before or during sintering made of refractory metal oxides, e.g. zirconia
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Materials For Photolithography (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Glass Compositions (AREA)
DE60232007T 2001-11-01 2002-10-28 Verfahren zur herstellung einer lichtempfindlichen keramischen zusammensetzung und mehrschichtiges substrat damit Expired - Lifetime DE60232007D1 (de)

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JP2001336151 2001-11-01
JP2002121938A JP4061958B2 (ja) 2002-04-24 2002-04-24 感光性セラミックス組成物及びその現像方法
PCT/JP2002/011149 WO2003038524A1 (fr) 2001-11-01 2002-10-28 Procedes de production d'une composition ceramique photosensible et substrat multicouche utilisant cette composition

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US20060091534A1 (en) * 2002-12-13 2006-05-04 Matsushita Electric Industrial Co., Ltd. Chip part manufacturing method and chip parts
JP4151846B2 (ja) * 2004-03-03 2008-09-17 Ｔｄｋ株式会社 積層セラミック電子部品、回路基板等、および当該部品、基板等の製造に供せられるセラミックグリーンシートの製造方法
US20060027307A1 (en) * 2004-08-03 2006-02-09 Bidwell Larry A Method of application of a dielectric sheet and photosensitive dielectric composition(s) and tape(s) used therein
JP5014656B2 (ja) * 2006-03-27 2012-08-29 国立大学法人東北大学 プラズマ処理装置用部材およびその製造方法
KR100806755B1 (ko) * 2006-12-22 2008-02-27 요업기술원 감광성 저온 동시소성 세라믹 조성물 및 그 제조방법
JP2009302518A (ja) * 2008-05-13 2009-12-24 Toto Ltd 静電チャック
KR101060816B1 (ko) * 2008-08-05 2011-08-30 삼성전기주식회사 세라믹 프로브 카드의 제조 방법
US8020314B2 (en) * 2008-10-31 2011-09-20 Corning Incorporated Methods and apparatus for drying ceramic green bodies with microwaves
CN102076186A (zh) * 2009-11-20 2011-05-25 深圳富泰宏精密工业有限公司 电子装置外壳及其制作方法
WO2011111422A1 (ja) * 2010-03-08 2011-09-15 日本碍子株式会社 セラミックグリーン体、及びその製造方法
US20110319252A1 (en) * 2010-06-28 2011-12-29 Schmidt Wayde R Composite powders
US20110315046A1 (en) * 2010-06-28 2011-12-29 Paul Sheedy Method for fabricating composite powders
CN102769091B (zh) * 2012-05-25 2015-11-25 瑞声声学科技(深圳)有限公司 Led封装中的陶瓷挡墙制造方法
CN102910920A (zh) * 2012-10-25 2013-02-06 无锡中彩新材料股份有限公司 一种冶金炉装置
CN108285347A (zh) * 2018-02-12 2018-07-17 广东工业大学 一种3d打印光固化陶瓷颗粒及其制备方法
JP7348587B2 (ja) * 2018-03-07 2023-09-21 日本電気硝子株式会社 ガラスセラミック誘電体
JP7120195B2 (ja) 2019-09-30 2022-08-17 株式会社村田製作所 感光性絶縁ペーストおよび電子部品
CN115215661B (zh) * 2021-04-15 2023-06-20 南京航空航天大学 一种光固化3d打印碳化硅陶瓷部件及其近净成形制备方法
KR102676367B1 (ko) * 2021-08-20 2024-06-18 모션하이테크 주식회사 초극자외선용 펠리클 프레임 및 이를 포함하는 초극자외선용 펠리클

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ATE428956T1 (de) 2009-05-15
US20040249040A1 (en) 2004-12-09
EP1447712A4 (de) 2008-04-02
KR100861857B1 (ko) 2008-10-07
CN1297852C (zh) 2007-01-31
CN1582415A (zh) 2005-02-16
EP1447712A1 (de) 2004-08-18
TW593196B (en) 2004-06-21
EP1447712A8 (de) 2004-10-06
EP1447712B1 (de) 2009-04-15
US7291444B2 (en) 2007-11-06
KR20040060959A (ko) 2004-07-06
WO2003038524A1 (fr) 2003-05-08

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