DE60210879D1 - Verfahren zur Aufzeichnng einer Kennung und Photomaskensatz - Google Patents

Verfahren zur Aufzeichnng einer Kennung und Photomaskensatz

Info

Publication number
DE60210879D1
DE60210879D1 DE60210879T DE60210879T DE60210879D1 DE 60210879 D1 DE60210879 D1 DE 60210879D1 DE 60210879 T DE60210879 T DE 60210879T DE 60210879 T DE60210879 T DE 60210879T DE 60210879 D1 DE60210879 D1 DE 60210879D1
Authority
DE
Germany
Prior art keywords
identifier
recording
photomask set
photomask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60210879T
Other languages
English (en)
Inventor
Taisuke Hirooka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Metals Ltd
Original Assignee
Neomax Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Neomax Co Ltd filed Critical Neomax Co Ltd
Application granted granted Critical
Publication of DE60210879D1 publication Critical patent/DE60210879D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/42—Alignment or registration features, e.g. alignment marks on the mask substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Magnetic Heads (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
DE60210879T 2001-09-05 2002-09-05 Verfahren zur Aufzeichnng einer Kennung und Photomaskensatz Expired - Lifetime DE60210879D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001269291A JP2003076026A (ja) 2001-09-05 2001-09-05 識別情報記録方法およびフォトマスクセット

Publications (1)

Publication Number Publication Date
DE60210879D1 true DE60210879D1 (de) 2006-06-01

Family

ID=19095140

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60210879T Expired - Lifetime DE60210879D1 (de) 2001-09-05 2002-09-05 Verfahren zur Aufzeichnng einer Kennung und Photomaskensatz

Country Status (4)

Country Link
US (1) US6897010B2 (de)
EP (1) EP1291722B1 (de)
JP (1) JP2003076026A (de)
DE (1) DE60210879D1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3614418B2 (ja) * 2002-10-04 2005-01-26 株式会社Ｎｅｏｍａｘ 薄膜磁気ヘッド用基板およびその製造方法
JP4694102B2 (ja) * 2003-03-27 2011-06-08 大日本印刷株式会社 露光方法
JP2005310230A (ja) * 2004-04-20 2005-11-04 Alps Electric Co Ltd 薄膜磁気ヘッド及びその個体識別方法
JP4268951B2 (ja) * 2005-04-06 2009-05-27 Ｔｄｋ株式会社 ウェハにおける識別情報記入方法
DE102006028818A1 (de) 2006-06-21 2007-12-27 Evonik Degussa Gmbh Verfahren zur Herstellung enantiomerenangereicherter Amine und Amide durch enzymatische Racematspaltung
US7919231B2 (en) 2007-09-04 2011-04-05 Hitachi Global Storage Technologies Netherlands B.V. Photolithographic method and mask devices utilized for multiple exposures in the field of a feature
US20090211785A1 (en) * 2008-02-21 2009-08-27 Lovskog J Thomas Printed circuit board with edge markings
JP5547594B2 (ja) * 2010-09-28 2014-07-16 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
DE102010062965A1 (de) * 2010-12-13 2012-06-14 Solarworld Innovations Gmbh Markierung eines Substrats einer Solarzelle
WO2015094205A1 (en) * 2013-12-18 2015-06-25 Thomson Licencing Mechanisms for distinguishing numbers from letters
JP2019066750A (ja) * 2017-10-04 2019-04-25 株式会社ジャパンディスプレイ 表示装置
JP2019153706A (ja) * 2018-03-05 2019-09-12 富士ゼロックス株式会社 面発光型半導体レーザ、および面発光型半導体レーザの製造方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US31732A (en) * 1861-03-19 X m machine foe
JPS5522134A (en) * 1978-08-02 1980-02-16 Ntn Toyo Bearing Co Ltd Length measurement and selection of conical work
JPH0655617B2 (ja) * 1985-12-20 1994-07-27 株式会社イシダ カツト肉計量印字装置
JPS62296422A (ja) * 1986-06-17 1987-12-23 Fujitsu Ltd 露光方法
JPS62298422A (ja) 1986-06-18 1987-12-25 Matsushita Electric Works Ltd 除湿機
JPS63118229A (ja) * 1986-11-07 1988-05-23 Idemitsu Petrochem Co Ltd 熱可塑性樹脂シ−ト類の製造方法
JPH01166049A (ja) * 1987-12-22 1989-06-29 Seiko Epson Corp ナンバリング露光装置
JPH01166048A (ja) * 1987-12-22 1989-06-29 Seiko Epson Corp ナンバリング露光装置
JPH0215888A (ja) * 1988-06-30 1990-01-19 Toshiba Corp レーザマーキング方法
JP2663554B2 (ja) * 1988-09-28 1997-10-15 日本電気株式会社 レーザ捺印用マスク
US5302491A (en) * 1989-12-20 1994-04-12 North American Philips Corporation Method of encoding identification information on circuit dice using step and repeat lithography
JPH04102214A (ja) * 1990-08-17 1992-04-03 Yamaha Corp 薄膜磁気ヘッドの製造法
US5175774A (en) * 1990-10-16 1992-12-29 Micron Technology, Inc. Semiconductor wafer marking for identification during processing
JP2950211B2 (ja) 1995-08-02 1999-09-20 ティーディーケイ株式会社 薄膜磁気ヘッドの製造方法
JPH0981922A (ja) 1995-09-11 1997-03-28 Sony Corp 磁気ヘッド
JPH10134317A (ja) 1996-10-30 1998-05-22 Sumitomo Special Metals Co Ltd 薄膜磁気ヘッド用基板とその製造方法
JPH10261559A (ja) * 1997-03-17 1998-09-29 Hitachi Ltd 半導体装置の製造方法および露光装置
JPH11126311A (ja) 1997-10-22 1999-05-11 Kyocera Corp 薄膜磁気ヘッド用基板
US6312876B1 (en) * 1999-07-08 2001-11-06 Taiwan Semiconductor Manufacturing Company Method for placing identifying mark on semiconductor wafer
US6449123B1 (en) 1999-08-16 2002-09-10 Sumitomo Special Metals Co., Ltd. Methods for marking a sintered product and for fabricating magnetic head substrate
JP4667559B2 (ja) 2000-05-30 2011-04-13 ルネサスエレクトロニクス株式会社 半導体装置、フォトマスクおよび半導体装置の製造方法
JP2002075817A (ja) 2000-08-24 2002-03-15 Tdk Corp ウエハ識別情報記入方法ならびにウエハ識別情報記入用露光方法および装置
CA2320612A1 (en) 2000-09-21 2002-03-21 David R. Seniuk Compact chip labelling using stepper technology
US6924090B2 (en) 2001-08-09 2005-08-02 Neomax Co., Ltd. Method of recording identifier and set of photomasks
JP3461823B2 (ja) * 2001-08-09 2003-10-27 住友特殊金属株式会社 識別情報記録方法およびフォトマスクセット
JP4325206B2 (ja) * 2003-02-06 2009-09-02 日立金属株式会社 識別情報記録方法

Also Published As

Publication number Publication date
EP1291722A2 (de) 2003-03-12
EP1291722B1 (de) 2006-04-26
EP1291722A3 (de) 2003-11-19
US20030059726A1 (en) 2003-03-27
US6897010B2 (en) 2005-05-24
JP2003076026A (ja) 2003-03-14

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Legal Events

Date Code Title Description
8332 No legal effect for de