DE602006021215D1 - Oberflächenwellenelement und oberflächenwellenanordnung - Google Patents

Oberflächenwellenelement und oberflächenwellenanordnung

Info

Publication number
DE602006021215D1
DE602006021215D1 DE602006021215T DE602006021215T DE602006021215D1 DE 602006021215 D1 DE602006021215 D1 DE 602006021215D1 DE 602006021215 T DE602006021215 T DE 602006021215T DE 602006021215 T DE602006021215 T DE 602006021215T DE 602006021215 D1 DE602006021215 D1 DE 602006021215D1
Authority
DE
Germany
Prior art keywords
surface wave
assembly
wave element
wave assembly
wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006021215T
Other languages
English (en)
Inventor
Yuriko Nishimura
Shigehiko Nagamine
Kiyohiro Iioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of DE602006021215D1 publication Critical patent/DE602006021215D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02834—Means for compensation or elimination of undesirable effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14538—Formation
    • H03H9/14541—Multilayer finger or busbar electrode

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
DE602006021215T 2005-09-20 2006-09-20 Oberflächenwellenelement und oberflächenwellenanordnung Active DE602006021215D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005272451 2005-09-20
PCT/JP2006/318632 WO2007034832A1 (ja) 2005-09-20 2006-09-20 弾性表面波素子及び弾性表面波装置

Publications (1)

Publication Number Publication Date
DE602006021215D1 true DE602006021215D1 (de) 2011-05-19

Family

ID=37888875

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006021215T Active DE602006021215D1 (de) 2005-09-20 2006-09-20 Oberflächenwellenelement und oberflächenwellenanordnung

Country Status (6)

Country Link
US (1) US7893597B2 (de)
EP (1) EP1947764B1 (de)
JP (3) JP4043045B2 (de)
CN (1) CN101268611B (de)
DE (1) DE602006021215D1 (de)
WO (1) WO2007034832A1 (de)

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* Cited by examiner, † Cited by third party
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JP2009147914A (ja) * 2007-11-22 2009-07-02 Panasonic Corp 弾性波フィルタ及び弾性波デュプレクサ
JP5244703B2 (ja) * 2009-05-22 2013-07-24 昭和電工株式会社 発光ダイオード及び発光ダイオードランプ、並びに照明装置
JP5611615B2 (ja) * 2010-02-18 2014-10-22 セイコーインスツル株式会社 パッケージ及びパッケージの製造方法
JP2013145932A (ja) * 2010-05-07 2013-07-25 Murata Mfg Co Ltd 弾性表面波装置及びその製造方法
JPWO2011145449A1 (ja) 2010-05-19 2013-07-22 株式会社村田製作所 弾性表面波装置
US9503049B2 (en) * 2010-12-28 2016-11-22 Kyocera Corporation Acoustic wave element and acoustic wave device using same
JPWO2012102131A1 (ja) * 2011-01-27 2014-06-30 京セラ株式会社 弾性波素子およびそれを用いた弾性波装置
JP6029829B2 (ja) * 2012-01-11 2016-11-24 太陽誘電株式会社 弾性波デバイス
WO2014192614A1 (ja) * 2013-05-27 2014-12-04 株式会社村田製作所 弾性表面波装置
JP6385690B2 (ja) 2014-03-05 2018-09-05 太陽誘電株式会社 弾性波デバイス及びその製造方法
JP6341274B2 (ja) * 2014-05-07 2018-06-13 株式会社村田製作所 弾性表面波装置
WO2016063738A1 (ja) * 2014-10-20 2016-04-28 株式会社村田製作所 弾性波装置及びその製造方法
US10536132B2 (en) * 2014-11-18 2020-01-14 Kyocera Corporation Elastic wave element, filter element, and communication device
JP6589983B2 (ja) 2015-07-02 2019-10-16 株式会社村田製作所 弾性波装置
WO2017013945A1 (ja) 2015-07-17 2017-01-26 株式会社村田製作所 弾性波装置及びその製造方法
JP6620813B2 (ja) 2015-07-17 2019-12-18 株式会社村田製作所 弾性波装置
JP2017157944A (ja) 2016-02-29 2017-09-07 株式会社村田製作所 弾性表面波装置およびそれを用いた送受信フィルタを有するデュプレクサ
WO2017212787A1 (ja) * 2016-06-07 2017-12-14 株式会社村田製作所 弾性波装置
JP2018014715A (ja) * 2016-07-06 2018-01-25 京セラ株式会社 弾性波素子、フィルタ素子および通信装置
JP6836867B2 (ja) * 2016-09-20 2021-03-03 太陽誘電株式会社 弾性波デバイスの製造方法
US10615772B2 (en) * 2017-06-30 2020-04-07 Texas Instruments Incorporated Acoustic wave resonators having Fresnel surfaces
US10686425B2 (en) 2017-06-30 2020-06-16 Texas Instruments Incorporated Bulk acoustic wave resonators having convex surfaces, and methods of forming the same
US10622966B2 (en) 2017-07-26 2020-04-14 Texas Instruments Incorporated Bulk acoustic wave resonators having a phononic crystal acoustic mirror
US10855251B2 (en) 2017-08-08 2020-12-01 Texas Instruments Incorporated Unreleased plane acoustic wave resonators
US11070193B2 (en) 2017-11-24 2021-07-20 Murata Manufacturing Co., Ltd. Elastic wave device, radio-frequency front-end circuit, and communication device
JP2019114986A (ja) 2017-12-25 2019-07-11 株式会社村田製作所 弾性波装置
CN108768333B (zh) * 2018-05-30 2021-08-06 扬州大学 一种浮置复合叉指结构及其制备方法
JP7033010B2 (ja) * 2018-06-04 2022-03-09 太陽誘電株式会社 弾性波デバイス、フィルタおよびマルチプレクサ
JP7070988B2 (ja) 2018-07-30 2022-05-18 旭化成株式会社 導電性フィルム、並びに、それを用いた導電性フィルムロール、電子ペーパー、タッチパネル、及びフラットパネルディスプレイ
CN112868177B (zh) * 2018-10-19 2024-03-05 株式会社村田制作所 弹性波装置
US20230101271A1 (en) * 2020-01-29 2023-03-30 Asahi Kasei Kabushiki Kaisha Transparent heater
US20210376814A1 (en) * 2020-05-28 2021-12-02 Resonant Inc. Transversely-excited film bulk acoustic resonators with two-layer electrodes
WO2024014167A1 (ja) * 2022-07-15 2024-01-18 株式会社村田製作所 弾性波装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US991186A (en) * 1911-02-18 1911-05-02 Samuel B Adams Valve-motion.
US1212909A (en) * 1914-11-14 1917-01-16 James Witherspoon Cooper Fruit and potato gatherer.
JPH01212909A (ja) * 1988-02-19 1989-08-25 Sanyo Electric Co Ltd 電極形成方法
JPH03217109A (ja) 1990-01-23 1991-09-24 Sanyo Electric Co Ltd 弾性表面波共振子
CN1190892C (zh) * 1998-04-21 2005-02-23 松下电器产业株式会社 弹性表面波器件及其制法及使用该器件的移动通信装置
JP3317273B2 (ja) * 1998-08-25 2002-08-26 株式会社村田製作所 表面波共振子、フィルタ、共用器、通信機装置
JP2000278085A (ja) * 1999-03-24 2000-10-06 Yamaha Corp 弾性表面波素子
JP2001217672A (ja) * 1999-11-26 2001-08-10 Murata Mfg Co Ltd 弾性表面波素子およびその製造方法
JP2001168671A (ja) 1999-12-07 2001-06-22 Matsushita Electric Ind Co Ltd 弾性表面波デバイスとその製造方法
JP3912976B2 (ja) 2000-06-20 2007-05-09 三菱重工業株式会社 光触媒膜を有するチタン基材の製造方法及びチタン基材表面の親水化方法
JP3926633B2 (ja) * 2001-06-22 2007-06-06 沖電気工業株式会社 Ｓａｗデバイス及びその製造方法
US6937114B2 (en) * 2001-12-28 2005-08-30 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device, electronic component using the device, and composite module
US7148610B2 (en) * 2002-02-01 2006-12-12 Oc Oerlikon Balzers Ag Surface acoustic wave device having improved performance and method of making the device
US7141909B2 (en) * 2003-06-17 2006-11-28 Murata Manufacturing Co., Ltd. Surface acoustic wave device

Also Published As

Publication number Publication date
CN101268611A (zh) 2008-09-17
EP1947764B1 (de) 2011-04-06
JP4043045B2 (ja) 2008-02-06
EP1947764A1 (de) 2008-07-23
JP4903647B2 (ja) 2012-03-28
WO2007034832A1 (ja) 2007-03-29
US20090121584A1 (en) 2009-05-14
EP1947764A4 (de) 2009-09-02
JP2007282294A (ja) 2007-10-25
JP5300958B2 (ja) 2013-09-25
US7893597B2 (en) 2011-02-22
JPWO2007034832A1 (ja) 2009-03-26
JP2012034418A (ja) 2012-02-16
CN101268611B (zh) 2012-05-30

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