DE602006012571D1 - Vorrichtung zum Schutz einer elektronischen Schaltung - Google Patents
Vorrichtung zum Schutz einer elektronischen SchaltungInfo
- Publication number
- DE602006012571D1 DE602006012571D1 DE602006012571T DE602006012571T DE602006012571D1 DE 602006012571 D1 DE602006012571 D1 DE 602006012571D1 DE 602006012571 T DE602006012571 T DE 602006012571T DE 602006012571 T DE602006012571 T DE 602006012571T DE 602006012571 D1 DE602006012571 D1 DE 602006012571D1
- Authority
- DE
- Germany
- Prior art keywords
- protecting
- electronic circuit
- electronic
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
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- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
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- H05K1/00—Printed circuits
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- H05K9/00—Screening of apparatus or components against electric or magnetic fields
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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FR0551018 | 2005-04-21 |
Publications (1)
Publication Number | Publication Date |
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DE602006012571D1 true DE602006012571D1 (de) | 2010-04-15 |
Family
ID=35266762
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602006012571T Active DE602006012571D1 (de) | 2005-04-21 | 2006-04-20 | Vorrichtung zum Schutz einer elektronischen Schaltung |
Country Status (3)
Country | Link |
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US (1) | US7643311B2 (de) |
EP (1) | EP1715520B1 (de) |
DE (1) | DE602006012571D1 (de) |
Families Citing this family (73)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090000815A1 (en) * | 2007-06-27 | 2009-01-01 | Rf Micro Devices, Inc. | Conformal shielding employing segment buildup |
US8053872B1 (en) | 2007-06-25 | 2011-11-08 | Rf Micro Devices, Inc. | Integrated shield for a no-lead semiconductor device package |
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- 2006-04-20 EP EP06112855A patent/EP1715520B1/de active Active
- 2006-04-20 US US11/407,854 patent/US7643311B2/en active Active
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EP1715520B1 (de) | 2010-03-03 |
EP1715520A1 (de) | 2006-10-25 |
US20060274517A1 (en) | 2006-12-07 |
US7643311B2 (en) | 2010-01-05 |
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