DE602006011679D1 - Lithografischer Apparat und Herstellungsverfahren einer Vorrichtung - Google Patents

Lithografischer Apparat und Herstellungsverfahren einer Vorrichtung

Info

Publication number
DE602006011679D1
DE602006011679D1 DE602006011679T DE602006011679T DE602006011679D1 DE 602006011679 D1 DE602006011679 D1 DE 602006011679D1 DE 602006011679 T DE602006011679 T DE 602006011679T DE 602006011679 T DE602006011679 T DE 602006011679T DE 602006011679 D1 DE602006011679 D1 DE 602006011679D1
Authority
DE
Germany
Prior art keywords
manufacturing
lithographic apparatus
lithographic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006011679T
Other languages
English (en)
Inventor
Dirk-Jan Bijvoet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Netherlands BV
Original Assignee
ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Netherlands BV filed Critical ASML Netherlands BV
Publication of DE602006011679D1 publication Critical patent/DE602006011679D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE602006011679T 2005-06-24 2006-06-09 Lithografischer Apparat und Herstellungsverfahren einer Vorrichtung Active DE602006011679D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/165,574 US7372549B2 (en) 2005-06-24 2005-06-24 Lithographic apparatus and device manufacturing method

Publications (1)

Publication Number Publication Date
DE602006011679D1 true DE602006011679D1 (de) 2010-03-04

Family

ID=36699332

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006011679T Active DE602006011679D1 (de) 2005-06-24 2006-06-09 Lithografischer Apparat und Herstellungsverfahren einer Vorrichtung

Country Status (8)

Country Link
US (1) US7372549B2 (de)
EP (1) EP1736830B1 (de)
JP (1) JP4580900B2 (de)
KR (1) KR100743200B1 (de)
CN (1) CN1885169B (de)
DE (1) DE602006011679D1 (de)
SG (1) SG128586A1 (de)
TW (1) TWI300519B (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7791708B2 (en) * 2006-12-27 2010-09-07 Asml Netherlands B.V. Lithographic apparatus, substrate table, and method for enhancing substrate release properties
NL1036215A1 (nl) * 2007-12-11 2009-06-15 Asml Netherlands Bv Lithographic method and carrier substrate.
NL1036735A1 (nl) 2008-04-10 2009-10-13 Asml Holding Nv Shear-layer chuck for lithographic apparatus.
NL2003207A1 (nl) * 2008-07-21 2010-01-22 Asml Netherlands Bv Optical element mount for lithographic apparatus.
KR101539153B1 (ko) 2010-12-14 2015-07-23 가부시키가이샤 니콘 노광 방법 및 노광 장치, 그리고 디바이스 제조 방법
US9880462B2 (en) 2014-11-28 2018-01-30 Samsung Electronics Co., Ltd. Pellicle and exposure mask including the same
JP6851382B2 (ja) 2016-01-13 2021-03-31 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板を保持するための保持構成、基板を支持するためのキャリア、真空処理システム、基板を保持するための方法、及び基板を解放するための方法
KR101983674B1 (ko) 2016-11-10 2019-05-30 어플라이드 머티어리얼스, 인코포레이티드 기판을 홀딩하기 위한 홀딩 어레인지먼트, 홀딩 어레인지먼트를 포함하는 캐리어, 캐리어를 이용하는 프로세싱 시스템, 및 홀딩 어레인지먼트로부터 기판을 릴리스하기 위한 방법
KR102395754B1 (ko) * 2017-11-20 2022-05-06 어플라이드 머티어리얼스, 인코포레이티드 기판을 프로세싱하기 위한 기판 지지부, 진공 프로세싱 장치 및 기판 프로세싱 시스템
CN211929431U (zh) * 2017-11-20 2020-11-13 应用材料公司 基板支撑件、真空处理设备及基板处理系统
EP4220302A1 (de) * 2022-01-27 2023-08-02 ASML Netherlands B.V. System zum halten eines objekts in einem halbleiterherstellungsverfahren, lithographiegerät mit diesem system und verfahren

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57204547A (en) * 1981-06-12 1982-12-15 Hitachi Ltd Exposing method
US4842136A (en) * 1987-02-13 1989-06-27 Canon Kabushiki Kaisha Dust-proof container having improved construction for holding a reticle therein
DE69505448T2 (de) * 1994-03-15 1999-04-22 Canon Kk Maske und Maskenträger
US5923408A (en) * 1996-01-31 1999-07-13 Canon Kabushiki Kaisha Substrate holding system and exposure apparatus using the same
JPH10116886A (ja) * 1996-10-11 1998-05-06 Nikon Corp 試料保持方法及び露光装置
JP2000311933A (ja) * 1999-04-27 2000-11-07 Canon Inc 基板保持装置、基板搬送システム、露光装置、塗布装置およびデバイス製造方法ならびに基板保持部クリーニング方法
EP1291910B1 (de) * 2000-01-28 2007-01-10 Hitachi Tokyo Electronics Co., Ltd. Wafer-spannfutter, belichtungssystem und verfahren zur herstellung eines halbleiterbauelements
KR100478556B1 (ko) * 2000-02-17 2005-03-23 마츠시타 덴끼 산교 가부시키가이샤 부품장착장치와 부품장착방법, 및 부품장착 패널용인식장치, 액정 패널용 부품장착장치 및 액정 패널용부품장착방법
DE10043315C1 (de) 2000-09-02 2002-06-20 Zeiss Carl Projektionsbelichtungsanlage
US6628503B2 (en) 2001-03-13 2003-09-30 Nikon Corporation Gas cooled electrostatic pin chuck for vacuum applications
JP4288694B2 (ja) * 2001-12-20 2009-07-01 株式会社ニコン 基板保持装置、露光装置及びデバイス製造方法
US6872439B2 (en) * 2002-05-13 2005-03-29 The Regents Of The University Of California Adhesive microstructure and method of forming same
EP1369745B1 (de) 2002-06-07 2013-02-27 ASML Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
US6906786B2 (en) 2002-06-07 2005-06-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4340046B2 (ja) * 2002-07-25 2009-10-07 株式会社日立ハイテクノロジーズ 露光装置のマスク板固定方法およびマスク板支持装置
EP1486828B1 (de) 2003-06-09 2013-10-09 ASML Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
EP1491953A1 (de) 2003-06-23 2004-12-29 ASML Netherlands B.V. Lithographischer Apparat, Verfahren zur Herstellung eines Artikels und damit erzeugter Artikel
JP2005311084A (ja) * 2004-04-21 2005-11-04 Canon Inc 露光装置、デバイス製造方法、パターン生成装置及びメンテナンス方法
JP2005150759A (ja) * 2004-12-15 2005-06-09 Nikon Corp 走査型露光装置

Also Published As

Publication number Publication date
JP4580900B2 (ja) 2010-11-17
US7372549B2 (en) 2008-05-13
EP1736830B1 (de) 2010-01-13
KR100743200B1 (ko) 2007-07-27
EP1736830A1 (de) 2006-12-27
CN1885169A (zh) 2006-12-27
JP2007005789A (ja) 2007-01-11
SG128586A1 (en) 2007-01-30
TW200705137A (en) 2007-02-01
CN1885169B (zh) 2010-07-07
TWI300519B (en) 2008-09-01
US20060290915A1 (en) 2006-12-28
KR20060135508A (ko) 2006-12-29

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