DE602005023679D1 - Flexibles Substrat, mehrschichtiges flexibles Substrat und sein Herstellungsverfahren - Google Patents

Flexibles Substrat, mehrschichtiges flexibles Substrat und sein Herstellungsverfahren

Info

Publication number
DE602005023679D1
DE602005023679D1 DE602005023679T DE602005023679T DE602005023679D1 DE 602005023679 D1 DE602005023679 D1 DE 602005023679D1 DE 602005023679 T DE602005023679 T DE 602005023679T DE 602005023679 T DE602005023679 T DE 602005023679T DE 602005023679 D1 DE602005023679 D1 DE 602005023679D1
Authority
DE
Germany
Prior art keywords
flexible substrate
manufacturing process
multilayer
multilayer flexible
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005023679T
Other languages
English (en)
Inventor
Yoshihisa Yamashita
Toshio Fujii
Seiichi Nakatani
Takashi Ichiryu
Satoru Tomekawa
Hiroki Yabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of DE602005023679D1 publication Critical patent/DE602005023679D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/20—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising organic-organic junctions, e.g. donor-acceptor junctions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/50—Photovoltaic [PV] devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE602005023679T 2004-03-19 2005-03-16 Flexibles Substrat, mehrschichtiges flexibles Substrat und sein Herstellungsverfahren Active DE602005023679D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004079847 2004-03-19

Publications (1)

Publication Number Publication Date
DE602005023679D1 true DE602005023679D1 (de) 2010-11-04

Family

ID=34836592

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005023679T Active DE602005023679D1 (de) 2004-03-19 2005-03-16 Flexibles Substrat, mehrschichtiges flexibles Substrat und sein Herstellungsverfahren

Country Status (4)

Country Link
US (2) US7321496B2 (de)
EP (1) EP1578178B1 (de)
CN (1) CN100376126C (de)
DE (1) DE602005023679D1 (de)

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US7877866B1 (en) 2005-10-26 2011-02-01 Second Sight Medical Products, Inc. Flexible circuit electrode array and method of manufacturing the same
US20070216050A1 (en) * 2006-03-17 2007-09-20 Kim Sang M Optical member fabricating apparatus and method and forming mold used for the same
US20080001700A1 (en) * 2006-06-30 2008-01-03 Flavio Pardo High inductance, out-of-plane inductors
KR100829385B1 (ko) * 2006-11-27 2008-05-13 동부일렉트로닉스 주식회사 반도체 소자 및 그 제조 방법
JP5003874B2 (ja) * 2007-02-27 2012-08-15 ブラザー工業株式会社 回路素子実装フレキシブル配線材
US9117602B2 (en) 2008-01-17 2015-08-25 Harris Corporation Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods
US8778124B2 (en) * 2008-01-17 2014-07-15 Harris Corporation Method for making three-dimensional liquid crystal polymer multilayer circuit boards
FI20085468A0 (fi) * 2008-05-16 2008-05-16 Polar Electro Oy Sähköpiirijärjestely
US20100012354A1 (en) * 2008-07-14 2010-01-21 Logan Brook Hedin Thermally conductive polymer based printed circuit board
TWI402003B (zh) 2009-10-16 2013-07-11 Princo Corp 軟性多層基板之金屬層結構及其製造方法
CN102045939B (zh) * 2009-10-19 2014-04-30 巨擘科技股份有限公司 柔性多层基板的金属层结构及其制造方法
TWI431740B (zh) * 2010-10-21 2014-03-21 E Ink Holdings Inc 電極陣列
JP5757083B2 (ja) * 2010-12-01 2015-07-29 セイコーエプソン株式会社 薄膜トランジスタ形成用基板、半導体装置、電気装置
TWI458110B (zh) * 2011-04-15 2014-10-21 E Ink Holdings Inc 光電二極體、光感測元件及其製備方法
JP2014531742A (ja) * 2011-08-16 2014-11-27 ジョージア テック リサーチ コーポレーション 接着剤を用いて積層したナノコンポジット膜を使用する磁気装置
WO2014033859A1 (ja) * 2012-08-29 2014-03-06 日立化成株式会社 コネクタ及びフレキシブル配線板
WO2014148016A1 (ja) * 2013-03-22 2014-09-25 パナソニック株式会社 光電変換素子
JP5999122B2 (ja) * 2014-02-20 2016-09-28 株式会社村田製作所 インダクタの製造方法
KR102458686B1 (ko) * 2015-04-30 2022-10-26 삼성디스플레이 주식회사 플렉서블 디스플레이 장치 및 그 제조방법
JP6834121B2 (ja) * 2015-09-17 2021-02-24 味の素株式会社 配線板の製造方法
CN105609484B (zh) * 2015-12-24 2019-03-22 通富微电子股份有限公司 半导体器件扇出封装结构
CN108369980B (zh) 2015-12-28 2020-07-21 东芝北斗电子株式会社 发光模块
US10849222B2 (en) * 2016-11-14 2020-11-24 Pioneer Circuits, Inc. High temperature resistant fabric and its use in flexible circuits
CN106971671B (zh) * 2017-04-28 2020-07-03 京东方科技集团股份有限公司 走线结构、显示基板及显示装置
CN107087355A (zh) * 2017-06-16 2017-08-22 东莞职业技术学院 一种采用丝网印刷技术实现pcb内层互联的方法
JP6950747B2 (ja) * 2017-11-16 2021-10-13 株式会社村田製作所 樹脂多層基板、電子部品およびその実装構造
WO2019098011A1 (ja) * 2017-11-16 2019-05-23 株式会社村田製作所 樹脂多層基板、電子部品およびその実装構造
KR102197471B1 (ko) * 2017-12-18 2021-01-04 주식회사 잉크테크 전자파 차폐필름, 인쇄회로기판 제조방법 및 전자파 차폐필름 제조방법
CN109987571A (zh) * 2019-04-29 2019-07-09 宁波石墨烯创新中心有限公司 传感器阵列系统及制造方法
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Also Published As

Publication number Publication date
CN100376126C (zh) 2008-03-19
US7773386B2 (en) 2010-08-10
CN1671268A (zh) 2005-09-21
US20080210458A1 (en) 2008-09-04
US20050205294A1 (en) 2005-09-22
EP1578178B1 (de) 2010-09-22
EP1578178A1 (de) 2005-09-21
US7321496B2 (en) 2008-01-22

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