DE602007004153D1 - Reinigungszusammensetzung, Reinigungsverfahren und Herstellungsverfahren für ein Halbleiterbauelement - Google Patents

Reinigungszusammensetzung, Reinigungsverfahren und Herstellungsverfahren für ein Halbleiterbauelement

Info

Publication number
DE602007004153D1
DE602007004153D1 DE602007004153T DE602007004153T DE602007004153D1 DE 602007004153 D1 DE602007004153 D1 DE 602007004153D1 DE 602007004153 T DE602007004153 T DE 602007004153T DE 602007004153 T DE602007004153 T DE 602007004153T DE 602007004153 D1 DE602007004153 D1 DE 602007004153D1
Authority
DE
Germany
Prior art keywords
cleaning
semiconductor device
device manufacturing
cleaning composition
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007004153T
Other languages
English (en)
Inventor
Michiaki Andou
Tomohisa Konno
Hirotaka Shida
Kazuhito Uchikura
Nobuyuki Kurashima
Gaku Minamihaba
Yoshikuni Tateyama
Hiroyuki Yano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Publication of DE602007004153D1 publication Critical patent/DE602007004153D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D17/00—Detergent materials or soaps characterised by their shape or physical properties
    • C11D17/06—Powder; Flakes; Free-flowing mixtures; Sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE602007004153T 2006-08-21 2007-08-16 Reinigungszusammensetzung, Reinigungsverfahren und Herstellungsverfahren für ein Halbleiterbauelement Active DE602007004153D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006224759A JP4912791B2 (ja) 2006-08-21 2006-08-21 洗浄用組成物、洗浄方法及び半導体装置の製造方法

Publications (1)

Publication Number Publication Date
DE602007004153D1 true DE602007004153D1 (de) 2010-02-25

Family

ID=38802919

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007004153T Active DE602007004153D1 (de) 2006-08-21 2007-08-16 Reinigungszusammensetzung, Reinigungsverfahren und Herstellungsverfahren für ein Halbleiterbauelement

Country Status (5)

Country Link
US (1) US20080045016A1 (de)
EP (1) EP1892285B1 (de)
JP (1) JP4912791B2 (de)
DE (1) DE602007004153D1 (de)
TW (1) TWI411679B (de)

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JP4777197B2 (ja) * 2006-09-11 2011-09-21 富士フイルム株式会社 洗浄液及びそれを用いた洗浄方法
KR20090076938A (ko) * 2006-09-25 2009-07-13 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 웨이퍼 재작업 적용을 위한 포토레지스트의 제거를 위한 조성물 및 방법
JP5428200B2 (ja) * 2007-05-18 2014-02-26 三菱化学株式会社 半導体デバイス用基板洗浄液、半導体デバイス用基板の洗浄方法及び半導体デバイス用基板の製造方法
US8084406B2 (en) * 2007-12-14 2011-12-27 Lam Research Corporation Apparatus for particle removal by single-phase and two-phase media
KR101202720B1 (ko) * 2008-02-29 2012-11-19 주식회사 엘지화학 화학적 기계적 연마용 수계 슬러리 조성물 및 화학적 기계적 연마 방법
JP5412661B2 (ja) 2008-03-28 2014-02-12 富士フイルム株式会社 半導体デバイス用洗浄剤及びそれを用いた半導体デバイスの洗浄方法
CN101561641A (zh) * 2008-04-14 2009-10-21 安集微电子（上海）有限公司 一种等离子刻蚀残留物清洗液
JP5086893B2 (ja) * 2008-05-26 2012-11-28 花王株式会社 半導体デバイス用基板用の洗浄液
JP5518392B2 (ja) * 2008-10-02 2014-06-11 ライオン株式会社 電子デバイス基板用洗浄剤組成物、および電子デバイス基板の洗浄方法
NL2003421A (en) * 2008-10-21 2010-04-22 Asml Netherlands Bv Lithographic apparatus and a method of removing contamination.
GB2478250B (en) * 2008-12-22 2014-09-03 Kao Corp Polishing liquid composition for magnetic-disk substrate
US8754021B2 (en) * 2009-02-27 2014-06-17 Advanced Technology Materials, Inc. Non-amine post-CMP composition and method of use
TWI410481B (zh) 2009-04-22 2013-10-01 Lg Chemical Ltd 化學機械研磨用漿料
US8367594B2 (en) * 2009-06-24 2013-02-05 Lam Research Corporation Damage free, high-efficiency, particle removal cleaner comprising polyvinyl alcohol particles
US8765653B2 (en) * 2009-07-07 2014-07-01 Air Products And Chemicals, Inc. Formulations and method for post-CMP cleaning
TWI447224B (zh) * 2009-12-25 2014-08-01 Uwiz Technology Co Ltd 使用於半導體晶圓製造之清洗組成物
US8883701B2 (en) * 2010-07-09 2014-11-11 Air Products And Chemicals, Inc. Method for wafer dicing and composition useful thereof
WO2012027667A2 (en) * 2010-08-27 2012-03-01 Advanced Technology Materials, Inc. Method for preventing the collapse of high aspect ratio structures during drying
KR101846597B1 (ko) * 2010-10-01 2018-04-06 미쯔비시 케미컬 주식회사 반도체 디바이스용 기판의 세정액 및 세정 방법
JP6123334B2 (ja) * 2012-02-17 2017-05-10 三菱化学株式会社 半導体デバイス用洗浄液及び半導体デバイス用基板の洗浄方法
US20140011362A1 (en) * 2012-07-06 2014-01-09 Basf Se Chemical mechanical polishing (cmp) composition comprising a non-ionic surfactant and an aromatic compound comprising at least one acid group
CN105378901B (zh) * 2013-07-05 2020-09-15 富士胶片电子材料有限公司 蚀刻剂、蚀刻方法和蚀刻剂制备液
US9957469B2 (en) 2014-07-14 2018-05-01 Versum Materials Us, Llc Copper corrosion inhibition system
KR102296739B1 (ko) 2014-10-27 2021-09-01 삼성전자 주식회사 포토마스크용 세정 조성물을 이용한 집적회로 소자 제조 방법
WO2017130749A1 (ja) * 2016-01-28 2017-08-03 株式会社フジミインコーポレーテッド 研磨用組成物
JP6112329B1 (ja) * 2016-05-10 2017-04-12 Jsr株式会社 半導体洗浄用組成物および洗浄方法
KR102498010B1 (ko) * 2016-09-28 2023-02-10 가부시키가이샤 후지미인코퍼레이티드 표면 처리 조성물
KR102626655B1 (ko) * 2017-02-08 2024-01-17 제이에스알 가부시끼가이샤 반도체 처리용 조성물 및 처리 방법
KR102491463B1 (ko) * 2017-03-06 2023-01-26 가부시키가이샤 후지미인코퍼레이티드 표면 처리 조성물 및 그 제조 방법, 그리고 표면 처리 조성물을 사용한 표면 처리 방법 및 반도체 기판의 제조 방법
US11060051B2 (en) 2018-10-12 2021-07-13 Fujimi Incorporated Composition for rinsing or cleaning a surface with ceria particles adhered
CN113412324B (zh) * 2018-12-03 2022-12-02 富士胶片电子材料美国有限公司 蚀刻组合物
KR102659845B1 (ko) * 2019-02-08 2024-04-24 엔테그리스, 아이엔씨. 세리아 제거 조성물
US20220169956A1 (en) * 2019-04-09 2022-06-02 Basf Se Composition comprising an ammonia-activated siloxane for avoiding pattern collapse when treating patterned materials with line-space dimensions of 50 nm or below
CN113150878B (zh) * 2021-03-25 2022-03-18 深圳市点石源水处理技术有限公司 一种ic载板去膜剂及其应用

Family Cites Families (7)

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Publication number Priority date Publication date Assignee Title
JP3057163B2 (ja) * 1993-12-08 2000-06-26 東京エレクトロン株式会社 洗浄方法及び洗浄装置
US20020173243A1 (en) * 2001-04-05 2002-11-21 Costas Wesley D. Polishing composition having organic polymer particles
ATE440938T1 (de) * 2001-07-11 2009-09-15 Procter & Gamble Verfahren zur oberflächenreinigung mittels eines dispergierten polymers
US7416680B2 (en) * 2001-10-12 2008-08-26 International Business Machines Corporation Self-cleaning colloidal slurry composition and process for finishing a surface of a substrate
JP4101032B2 (ja) * 2002-11-14 2008-06-11 触媒化成工業株式会社 半導体基板洗浄用粒子および該洗浄用粒子を含む洗浄材ならびに該洗浄材を用いた基材の洗浄方法
CN1654617A (zh) * 2004-02-10 2005-08-17 捷时雅株式会社 清洗用组合物和半导体基板的清洗方法及半导体装置的制造方法
JP4821122B2 (ja) * 2004-02-10 2011-11-24 Ｊｓｒ株式会社 洗浄用組成物、半導体基板の洗浄方法および半導体装置の製造方法

Also Published As

Publication number Publication date
TWI411679B (zh) 2013-10-11
TW200811282A (en) 2008-03-01
JP4912791B2 (ja) 2012-04-11
US20080045016A1 (en) 2008-02-21
JP2008047842A (ja) 2008-02-28
EP1892285A2 (de) 2008-02-27
EP1892285A3 (de) 2008-03-05
EP1892285B1 (de) 2010-01-06

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