DE602006000742D1 - Herstellungsverfahren für piezoelektrisches Bauelement - Google Patents

Herstellungsverfahren für piezoelektrisches Bauelement

Info

Publication number
DE602006000742D1
DE602006000742D1 DE200660000742 DE602006000742T DE602006000742D1 DE 602006000742 D1 DE602006000742 D1 DE 602006000742D1 DE 200660000742 DE200660000742 DE 200660000742 DE 602006000742 T DE602006000742 T DE 602006000742T DE 602006000742 D1 DE602006000742 D1 DE 602006000742D1
Authority
DE
Germany
Prior art keywords
manufacturing
piezoelectric component
piezoelectric
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE200660000742
Other languages
English (en)
Other versions
DE602006000742T2 (de
Inventor
Shinya Aoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of DE602006000742D1 publication Critical patent/DE602006000742D1/de
Application granted granted Critical
Publication of DE602006000742T2 publication Critical patent/DE602006000742T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/03—Assembling devices that include piezoelectric or electrostrictive parts
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02992—Details of bus bars, contact pads or other electrical connections for finger electrodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/49798—Dividing sequentially from leading end, e.g., by cutting or breaking

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
DE200660000742 2005-07-06 2006-07-05 Herstellungsverfahren für piezoelektrisches Bauelement Active DE602006000742T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005197081 2005-07-06
JP2005197081A JP2007019132A (ja) 2005-07-06 2005-07-06 圧電振動装置の製造方法

Publications (2)

Publication Number Publication Date
DE602006000742D1 true DE602006000742D1 (de) 2008-04-30
DE602006000742T2 DE602006000742T2 (de) 2009-04-30

Family

ID=37396019

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200660000742 Active DE602006000742T2 (de) 2005-07-06 2006-07-05 Herstellungsverfahren für piezoelektrisches Bauelement

Country Status (6)

Country Link
US (1) US7421767B2 (de)
EP (1) EP1742353B1 (de)
JP (1) JP2007019132A (de)
KR (1) KR100822096B1 (de)
CN (1) CN100525091C (de)
DE (1) DE602006000742T2 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100653089B1 (ko) * 2005-10-31 2006-12-04 삼성전자주식회사 탄성 표면파 디바이스 웨이퍼 레벨 패키지 및 그 패키징방법
JP2007335468A (ja) * 2006-06-12 2007-12-27 Hitachi Media Electoronics Co Ltd 中空封止素子およびその製造方法
US8299678B2 (en) * 2007-06-28 2012-10-30 Kyocera Corporation Surface acoustic wave device and method for production of same
WO2009104328A1 (ja) * 2008-02-18 2009-08-27 セイコーインスツル株式会社 圧電振動子の製造方法、圧電振動子、発振器、電子機器及び電波時計
US8476809B2 (en) * 2008-04-29 2013-07-02 Sand 9, Inc. Microelectromechanical systems (MEMS) resonators and related apparatus and methods
US8410868B2 (en) 2009-06-04 2013-04-02 Sand 9, Inc. Methods and apparatus for temperature control of devices and mechanical resonating structures
JP4567775B2 (ja) * 2008-08-26 2010-10-20 富士通メディアデバイス株式会社 弾性表面波デバイスおよびその製造方法
JP4851549B2 (ja) * 2009-02-10 2012-01-11 日本電波工業株式会社 圧電デバイス
US9048811B2 (en) 2009-03-31 2015-06-02 Sand 9, Inc. Integration of piezoelectric materials with substrates
FR3003246B1 (fr) 2013-03-13 2017-12-22 Commissariat Energie Atomique Procede d'encapsulation de micro-dispositif par scellement anodique
TWI661494B (zh) 2014-07-31 2019-06-01 美商西凱渥資訊處理科技公司 多層暫態液相接合
US10541152B2 (en) 2014-07-31 2020-01-21 Skyworks Solutions, Inc. Transient liquid phase material bonding and sealing structures and methods of forming same
US9862592B2 (en) 2015-03-13 2018-01-09 Taiwan Semiconductor Manufacturing Co., Ltd. MEMS transducer and method for manufacturing the same
US10432168B2 (en) * 2015-08-31 2019-10-01 General Electric Company Systems and methods for quartz wafer bonding
CN107786929B (zh) * 2016-08-26 2023-12-26 华景科技无锡有限公司 硅麦克风
JP6465097B2 (ja) * 2016-11-21 2019-02-06 横河電機株式会社 振動式トランスデューサ
JP6338071B2 (ja) * 2016-11-29 2018-06-06 国立大学法人 東京大学 振動発電デバイス
US20180159502A1 (en) 2016-12-02 2018-06-07 Skyworks Solutions, Inc. Methods of manufacturing electronic devices to prevent water ingress during manufacture
DE102019120844A1 (de) * 2019-08-01 2021-02-04 Horst Siedle Gmbh & Co. Kg Verfahren zur Herstellung von abgedichteten Funktionselementen

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57155821A (en) * 1981-03-20 1982-09-27 Fujitsu General Ltd Unidirectional saw exciter
US4639631A (en) 1985-07-01 1987-01-27 Motorola, Inc. Electrostatically sealed piezoelectric device
JP3265889B2 (ja) 1995-02-03 2002-03-18 松下電器産業株式会社 表面弾性波装置及びその製造方法
JPH1187052A (ja) * 1997-09-09 1999-03-30 Futaba Corp 有機エレクトロルミネッセンス素子
GB0016861D0 (en) 2000-07-11 2000-08-30 Univ Cranfield Improvements in or relating to filters
JP3975430B2 (ja) 2001-09-28 2007-09-12 セイコーエプソン株式会社 弾性表面波装置の製造方法
JP2003163567A (ja) * 2001-11-22 2003-06-06 Nippon Dempa Kogyo Co Ltd 水晶振動子
CN1742430B (zh) * 2002-02-12 2010-04-28 松下电器产业株式会社 弹性表面波装置
JP2005125447A (ja) 2003-10-23 2005-05-19 Hitachi Ltd 電子部品およびその製造方法
JP2006197554A (ja) * 2004-12-17 2006-07-27 Seiko Epson Corp 弾性表面波デバイス及びその製造方法、ｉｃカード、携帯用電子機器

Also Published As

Publication number Publication date
EP1742353A1 (de) 2007-01-10
US7421767B2 (en) 2008-09-09
CN100525091C (zh) 2009-08-05
KR20070005524A (ko) 2007-01-10
KR100822096B1 (ko) 2008-04-15
CN1893266A (zh) 2007-01-10
EP1742353B1 (de) 2008-03-19
DE602006000742T2 (de) 2009-04-30
JP2007019132A (ja) 2007-01-25
US20070006434A1 (en) 2007-01-11

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