DE602005005872D1 - Herstellungsverfahren einer Klebefolie zum Lasersplaten mit einer kontrollierten Oberflächenrauhigkeit (Ra) - Google Patents

Herstellungsverfahren einer Klebefolie zum Lasersplaten mit einer kontrollierten Oberflächenrauhigkeit (Ra)

Info

Publication number
DE602005005872D1
DE602005005872D1 DE200560005872 DE602005005872T DE602005005872D1 DE 602005005872 D1 DE602005005872 D1 DE 602005005872D1 DE 200560005872 DE200560005872 DE 200560005872 DE 602005005872 T DE602005005872 T DE 602005005872T DE 602005005872 D1 DE602005005872 D1 DE 602005005872D1
Authority
DE
Germany
Prior art keywords
adhesive sheet
laser
workpiece
dicing
production method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE200560005872
Other languages
English (en)
Other versions
DE602005005872T2 (de
Inventor
Yuji Okawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of DE602005005872D1 publication Critical patent/DE602005005872D1/de
Application granted granted Critical
Publication of DE602005005872T2 publication Critical patent/DE602005005872T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • C09J7/24Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/245Vinyl resins, e.g. polyvinyl chloride [PVC]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/40Semiconductor devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31551Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE200560005872 2004-02-20 2005-02-10 Herstellungsverfahren einer Klebefolie zum Lasersplaten mit einer kontrollierten Oberflächenrauhigkeit (Ra) Active DE602005005872T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004044188A JP2005236082A (ja) 2004-02-20 2004-02-20 レーザーダイシング用粘着シート及びその製造方法
JP2004044188 2004-02-20

Publications (2)

Publication Number Publication Date
DE602005005872D1 true DE602005005872D1 (de) 2008-05-21
DE602005005872T2 DE602005005872T2 (de) 2009-06-10

Family

ID=34709138

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200560005872 Active DE602005005872T2 (de) 2004-02-20 2005-02-10 Herstellungsverfahren einer Klebefolie zum Lasersplaten mit einer kontrollierten Oberflächenrauhigkeit (Ra)

Country Status (7)

Country Link
US (2) US7564119B2 (de)
EP (1) EP1566236B1 (de)
JP (1) JP2005236082A (de)
KR (1) KR101116484B1 (de)
CN (1) CN100523107C (de)
DE (1) DE602005005872T2 (de)
TW (1) TW200533450A (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4107417B2 (ja) * 2002-10-15 2008-06-25 日東電工株式会社 チップ状ワークの固定方法
TWI387631B (zh) * 2004-05-18 2013-03-01 Hitachi Chemical Co Ltd 黏著片與使用此黏著片之半導體裝置以及其製造方法
JP4165467B2 (ja) * 2004-07-12 2008-10-15 セイコーエプソン株式会社 ダイシングシート、半導体装置の製造方法
TWI408203B (zh) 2005-06-27 2013-09-11 Nitto Denko Corp 雷射加工用表面保護片材
JP4762671B2 (ja) * 2005-10-26 2011-08-31 古河電気工業株式会社 ダイシングテープ、および半導体ウェハダイシング方法
US20070111480A1 (en) * 2005-11-16 2007-05-17 Denso Corporation Wafer product and processing method therefor
JP4927393B2 (ja) * 2005-11-30 2012-05-09 古河電気工業株式会社 ダイシングテープ
JP4777761B2 (ja) * 2005-12-02 2011-09-21 株式会社ディスコ ウエーハの分割方法
TW200800584A (en) * 2006-04-03 2008-01-01 Gunze Kk Surface protective tape used for back grinding of semiconductor wafer and base film for the surface protective tape
JP2008279597A (ja) 2006-05-10 2008-11-20 Oji Paper Co Ltd 凹凸パターン形成シートおよびその製造方法、反射防止体、位相差板、工程シート原版ならびに光学素子の製造方法
JP4438961B2 (ja) * 2006-06-20 2010-03-24 電気化学工業株式会社 多層フィルム
JP2008060170A (ja) * 2006-08-29 2008-03-13 Nitto Denko Corp ウォータージェットレーザダイシング用粘着シート
JP4767144B2 (ja) * 2006-10-04 2011-09-07 日東電工株式会社 レーザ加工用粘着シート
JP5059559B2 (ja) * 2006-12-05 2012-10-24 リンテック株式会社 レーザーダイシングシートおよびチップ体の製造方法
US8114520B2 (en) * 2006-12-05 2012-02-14 Lintec Corporation Laser dicing sheet and process for producing chip body
US20090261084A1 (en) * 2006-12-05 2009-10-22 Lintec Corporation Laser Dicing Sheet and Manufacturing Method For Chip Body
JP5727688B2 (ja) * 2008-03-31 2015-06-03 リンテック株式会社 エネルギー線硬化型重合体、エネルギー線硬化型粘着剤組成物、粘着シートおよび半導体ウエハの加工方法
JP5456642B2 (ja) * 2009-12-24 2014-04-02 日東電工株式会社 フリップチップ型半導体裏面用フィルム
WO2012077471A1 (ja) 2010-12-06 2012-06-14 株式会社きもと レーザーダイシング用補助シート
DE102011100608B4 (de) * 2011-03-03 2024-03-28 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Suspension zum Schutz eines Halbleitermaterials und Verfahren zur Herstellung eines Halbleiterkörpers
JP5978051B2 (ja) * 2011-10-17 2016-08-24 日東電工株式会社 粘着テープ用フィルムおよび粘着テープ
JP6091488B2 (ja) * 2012-03-28 2017-03-08 株式会社きもと 機能性粘着シート
KR102030212B1 (ko) 2012-03-30 2019-10-08 키모토 컴파니 리미티드 이박리성 점착 필름 및 금속판의 가공방법
JP6071712B2 (ja) * 2013-04-05 2017-02-01 日東電工株式会社 粘着テープ
US20150037915A1 (en) * 2013-07-31 2015-02-05 Wei-Sheng Lei Method and system for laser focus plane determination in a laser scribing process
US10147630B2 (en) * 2014-06-11 2018-12-04 John Cleaon Moore Sectional porous carrier forming a temporary impervious support
JP6399923B2 (ja) * 2014-12-24 2018-10-03 株式会社ディスコ 板状物のレーザー加工方法
KR102447761B1 (ko) * 2016-11-02 2022-09-27 린텍 가부시키가이샤 다이싱 시트
JP6286014B2 (ja) * 2016-12-19 2018-02-28 パナック株式会社 工程用保護フィルム
CN110128958A (zh) * 2018-02-09 2019-08-16 日东电工株式会社 切割带
JP7141924B2 (ja) * 2018-02-09 2022-09-26 日東電工株式会社 ダイシングテープ
KR20210043557A (ko) * 2018-08-10 2021-04-21 린텍 가부시키가이샤 점착 시트용 기재 및 전자 부품 가공용 점착 시트
JP7319044B2 (ja) * 2018-12-14 2023-08-01 Tdk株式会社 素子アレイの製造装置と特定素子の除去装置
CN112620973B (zh) * 2020-12-18 2023-04-07 西安晟光硅研半导体科技有限公司 一种碳化硅晶片单向三层双向六级台阶切割工艺

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63310132A (ja) * 1987-06-12 1988-12-19 F S K Kk ウエハ貼着用粘着シ−ト
JP3520996B2 (ja) 1991-12-24 2004-04-19 三菱化学ポリエステルフィルム株式会社 半導体ウエハ貼着用粘着シート
JP3299601B2 (ja) * 1993-07-27 2002-07-08 リンテック株式会社 ウェハ貼着用粘着シート
JPH07221052A (ja) * 1994-02-04 1995-08-18 Furukawa Electric Co Ltd:The 半導体ウエハ固定用粘着テープ
JP2601131Y2 (ja) * 1994-12-15 1999-11-08 日東電工株式会社 セパレータ付粘着シート
TW340967B (en) * 1996-02-19 1998-09-21 Toray Industries An adhesive sheet for a semiconductor to connect with a substrate, and adhesive sticking tape for tab, an adhesive sticking tape for wire bonding connection, a substrate for connecting with a semiconductor and a semiconductor device
JPH1083975A (ja) * 1996-09-06 1998-03-31 Omron Corp 導体ウエハの粘着テープおよび貼着方法
KR100402999B1 (ko) * 1996-10-03 2004-05-24 데이진 가부시키가이샤 이형필름
US5994205A (en) * 1997-02-03 1999-11-30 Kabushiki Kaisha Toshiba Method of separating semiconductor devices
JP3886225B2 (ja) * 1997-09-24 2007-02-28 日東電工株式会社 両面粘着シ―ト類
JP3763710B2 (ja) * 1999-09-29 2006-04-05 信越化学工業株式会社 防塵用カバーフィルム付きウエハ支持台及びその製造方法
JP4438973B2 (ja) * 2000-05-23 2010-03-24 アムコア テクノロジー,インコーポレイテッド シート状樹脂組成物及びそれを用いた半導体装置の製造方法
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
JP2003033887A (ja) 2000-09-13 2003-02-04 Hamamatsu Photonics Kk レーザ加工方法
JP4109823B2 (ja) * 2000-10-10 2008-07-02 株式会社東芝 半導体装置の製造方法
JP2002173649A (ja) * 2000-12-04 2002-06-21 Asahi Rubber Kk 巻回テープ
JP4087144B2 (ja) 2001-04-23 2008-05-21 古河電気工業株式会社 レーザーダイシング用粘着テープ
JP4886937B2 (ja) 2001-05-17 2012-02-29 リンテック株式会社 ダイシングシート及びダイシング方法
JP4780855B2 (ja) * 2001-05-24 2011-09-28 株式会社きもと 印刷用シート
US20030026932A1 (en) * 2001-07-30 2003-02-06 Johnson John R. Multilayer laminate
US20030107807A1 (en) * 2001-12-06 2003-06-12 Yuuji Saiki Optical member and liquid crystal display
JP3838637B2 (ja) * 2002-06-10 2006-10-25 日東電工株式会社 ガラス基板ダイシング用粘着シートおよびガラス基板ダイシング方法
JP2004051914A (ja) * 2002-07-24 2004-02-19 Lintec Corp 積層シートおよびその製造方法
JP2005032903A (ja) * 2003-07-10 2005-02-03 Oki Electric Ind Co Ltd 半導体装置及びその製造方法

Also Published As

Publication number Publication date
EP1566236A1 (de) 2005-08-24
TW200533450A (en) 2005-10-16
US7767556B2 (en) 2010-08-03
CN100523107C (zh) 2009-08-05
CN1657584A (zh) 2005-08-24
DE602005005872T2 (de) 2009-06-10
KR101116484B1 (ko) 2012-03-07
US20090253231A1 (en) 2009-10-08
US7564119B2 (en) 2009-07-21
JP2005236082A (ja) 2005-09-02
US20050186709A1 (en) 2005-08-25
KR20060042991A (ko) 2006-05-15
EP1566236B1 (de) 2008-04-09
TWI350781B (de) 2011-10-21

Similar Documents

Publication Publication Date Title
DE602005005872D1 (de) Herstellungsverfahren einer Klebefolie zum Lasersplaten mit einer kontrollierten Oberflächenrauhigkeit (Ra)
TW200501251A (en) Manufacturing method of laser-processed products and adhesive sheet for laser processing in the manufacturing method
JP5221007B2 (ja) 発光ダイオードチップ及びウェハ分割加工方法
EP1742253A4 (de) Laserverarbeitungsverfahren und halbleiterchip
EP1721695A4 (de) Laserbearbeitungseinrichtung
WO2007149208A3 (en) Direct engraving of flexographic printing plates
TW200602144A (en) Laser processing method and semiconductor chip
EP1983557A4 (de) Laserstrahl-bearbeitungsverfahren und halbleiterchip
WO2008114470A1 (ja) プラスチック基板の切断方法、及びプラスチック基板の切断装置
WO2004033959A3 (en) Transparent light emitting members and method of manufacture
TW200721285A (en) Laser processing method for wafer
ATE516598T1 (de) Verfahren zur steuerung des herstellungsprozesses einer photoelektrischen wandlervorrichtung
HK1067235A1 (en) Semiconductor light emitting device comprising uneven substrate
ATE521848T1 (de) Austauschbare led lampenfassung
JP2007142000A (ja) レーザ加工装置およびレーザ加工方法
ATE476003T1 (de) Herstellungsverfahren einer laserdiodenbarrenanordnung
JP2003334812A5 (de)
EP2260967A3 (de) Einrichtung und Verfahren zum Formen eines oder mehrerer getrennten Ritze in einer Oberfläche eines Substrats
TW200642126A (en) Electroluminescent light source
EP1648023A4 (de) Prozess zur herstellung eines halbleiterbauelements
CN108705208A (zh) 带树脂层的脆性材料基板的切割方法及切割装置
GB2454056A (en) Labeling an optical medium having a prelabeled or unlabelable region
TW200619759A (en) Light guide plate and method of manufacturing the same
JP2009301919A (ja) 面発光装置用導光板
RU2011101719A (ru) Способ изготовления подложки для головки для выбрасывания жидкости и способ обработки подложки

Legal Events

Date Code Title Description
8364 No opposition during term of opposition