ATE476003T1 - Herstellungsverfahren einer laserdiodenbarrenanordnung - Google Patents

Herstellungsverfahren einer laserdiodenbarrenanordnung

Info

Publication number
ATE476003T1
ATE476003T1 AT07114048T AT07114048T ATE476003T1 AT E476003 T1 ATE476003 T1 AT E476003T1 AT 07114048 T AT07114048 T AT 07114048T AT 07114048 T AT07114048 T AT 07114048T AT E476003 T1 ATE476003 T1 AT E476003T1
Authority
AT
Austria
Prior art keywords
laser diode
production method
bar arrangement
diode bar
heat sink
Prior art date
Application number
AT07114048T
Other languages
English (en)
Inventor
Prabhu Thiagarajan
Mark Mcelhinney
Jason Helmrich
Feliks Lapinski
Original Assignee
Lasertel Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lasertel Inc filed Critical Lasertel Inc
Application granted granted Critical
Publication of ATE476003T1 publication Critical patent/ATE476003T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
    • H01S5/02484—Sapphire or diamond heat spreaders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4018—Lasers electrically in series

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
AT07114048T 2006-08-10 2007-08-09 Herstellungsverfahren einer laserdiodenbarrenanordnung ATE476003T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US82207106P 2006-08-10 2006-08-10
US11/829,030 US7864825B2 (en) 2006-08-10 2007-07-26 Method and system for a laser diode bar array assembly

Publications (1)

Publication Number Publication Date
ATE476003T1 true ATE476003T1 (de) 2010-08-15

Family

ID=38686826

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07114048T ATE476003T1 (de) 2006-08-10 2007-08-09 Herstellungsverfahren einer laserdiodenbarrenanordnung

Country Status (4)

Country Link
US (1) US7864825B2 (de)
EP (1) EP1887666B1 (de)
AT (1) ATE476003T1 (de)
DE (1) DE602007008018D1 (de)

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US9008147B2 (en) * 2008-08-25 2015-04-14 Gerald Ho Kim Silicon-based lens support structure and cooling package with passive alignment for compact heat-generating devices
US9042424B2 (en) * 2008-08-25 2015-05-26 Gerald Ho Kim Silicon-based lens support structure and cooling package with passive alignment for compact heat-generating devices
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CN103633549B (zh) * 2012-08-30 2016-01-20 苏州长光华芯光电技术有限公司 一种半导体激光器阵列单芯片的封装方法
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US11025031B2 (en) 2016-11-29 2021-06-01 Leonardo Electronics Us Inc. Dual junction fiber-coupled laser diode and related methods
CN209029679U (zh) * 2017-06-23 2019-06-25 业纳激光有限公司 具有壳体的二极管激光器以及一种用于对表面进行均匀照明的装置
DE202017007096U1 (de) 2017-06-23 2019-07-04 Jenoptik Optical Systems Gmbh Diodenlaser mit Einhausung
CA3109659C (en) 2018-08-13 2023-10-31 Leonardo Electronics Us Inc. Use of metal-core printed circuit board (pcb) for generation of ultra-narrow, high-current pulse driver
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CN112840514A (zh) 2018-10-15 2021-05-25 松下知识产权经营株式会社 用于解决高功率激光系统中热界面材料泵送的系统和方法
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DE102019113714A1 (de) * 2019-05-23 2020-11-26 Rogers Germany Gmbh Adapterelement zum Anbinden eines Elektronikbauteils an ein Kühlkörperelement, System mit einem solchen Adapterelement und Verfahren zum Herstellen eines solchen Adapterelements
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Also Published As

Publication number Publication date
EP1887666A2 (de) 2008-02-13
EP1887666A3 (de) 2008-12-24
US20080037602A1 (en) 2008-02-14
US7864825B2 (en) 2011-01-04
DE602007008018D1 (de) 2010-09-09
EP1887666B1 (de) 2010-07-28

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