DE602004028380D1 - Temperaturregeleinrichtung und temperaturregelverfahren - Google Patents

Temperaturregeleinrichtung und temperaturregelverfahren

Info

Publication number
DE602004028380D1
DE602004028380D1 DE602004028380T DE602004028380T DE602004028380D1 DE 602004028380 D1 DE602004028380 D1 DE 602004028380D1 DE 602004028380 T DE602004028380 T DE 602004028380T DE 602004028380 T DE602004028380 T DE 602004028380T DE 602004028380 D1 DE602004028380 D1 DE 602004028380D1
Authority
DE
Germany
Prior art keywords
temperature control
control device
control method
temperature
control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004028380T
Other languages
English (en)
Inventor
Masakazu Ando
Hiroyuki Takahashi
Tsuyoshi Yamashita
Takashi Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of DE602004028380D1 publication Critical patent/DE602004028380D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE602004028380T 2003-08-18 2004-08-18 Temperaturregeleinrichtung und temperaturregelverfahren Active DE602004028380D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003294615 2003-08-18
PCT/JP2004/011843 WO2005017543A1 (ja) 2003-08-18 2004-08-18 温度制御装置及び温度制御方法

Publications (1)

Publication Number Publication Date
DE602004028380D1 true DE602004028380D1 (de) 2010-09-09

Family

ID=34191052

Family Applications (2)

Application Number Title Priority Date Filing Date
DE602004031311T Active DE602004031311D1 (de) 2003-08-18 2004-08-18 Temperatursteuerungsvorrichtung
DE602004028380T Active DE602004028380D1 (de) 2003-08-18 2004-08-18 Temperaturregeleinrichtung und temperaturregelverfahren

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE602004031311T Active DE602004031311D1 (de) 2003-08-18 2004-08-18 Temperatursteuerungsvorrichtung

Country Status (7)

Country Link
US (3) US7619427B2 (de)
EP (2) EP2154541B1 (de)
JP (1) JP4275669B2 (de)
KR (2) KR100875527B1 (de)
CN (1) CN1853111B (de)
DE (2) DE602004031311D1 (de)
WO (1) WO2005017543A1 (de)

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KR101316208B1 (ko) * 2011-10-18 2013-10-08 현대자동차주식회사 전기차량의 전동식 워터펌프 제어방법
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JP6160433B2 (ja) * 2013-10-18 2017-07-12 株式会社デンソー 制御装置
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JP7316798B2 (ja) * 2019-01-30 2023-07-28 株式会社アドバンテスト 電子部品ハンドリング装置及び電子部品試験装置
CN110850259B (zh) * 2018-07-26 2022-07-08 株式会社爱德万测试 电子部件处理装置及电子部件测试装置
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CN110794277B (zh) * 2018-07-26 2022-06-03 株式会社爱德万测试 电子部件处理装置及电子部件测试装置
KR102131954B1 (ko) * 2019-02-15 2020-07-09 유피이(주) 집적 회로 디바이스에 대한 테스트를 수행하기 위한 장치 및 방법
US10890614B2 (en) * 2019-04-15 2021-01-12 Star Technologies, Inc. Method for determining a junction temperature of a device under test and method for controlling a junction temperature of a device under test
CN110261695A (zh) * 2019-06-12 2019-09-20 深圳市江波龙电子股份有限公司 一种测试装置
KR102231793B1 (ko) * 2019-08-27 2021-03-25 주식회사 유니테스트 챔버형 검사장치
TWI744840B (zh) * 2020-03-25 2021-11-01 鴻勁精密股份有限公司 預冷器以及其應用之測試分類設備
US11714132B2 (en) 2020-03-31 2023-08-01 Advantest Corporation Test equipment diagnostics systems and methods
KR102384409B1 (ko) * 2020-04-07 2022-04-08 최병규 온도 시험장치
US11493551B2 (en) 2020-06-22 2022-11-08 Advantest Test Solutions, Inc. Integrated test cell using active thermal interposer (ATI) with parallel socket actuation
US20220155364A1 (en) * 2020-11-19 2022-05-19 Advantest Test Solutions, Inc. Wafer scale active thermal interposer for device testing
US11567119B2 (en) 2020-12-04 2023-01-31 Advantest Test Solutions, Inc. Testing system including active thermal interposer device
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Also Published As

Publication number Publication date
CN1853111A (zh) 2006-10-25
US20080164899A1 (en) 2008-07-10
KR20060034730A (ko) 2006-04-24
EP1666895A4 (de) 2009-05-13
US7619427B2 (en) 2009-11-17
US8653843B2 (en) 2014-02-18
US20120025856A1 (en) 2012-02-02
US8063653B2 (en) 2011-11-22
JPWO2005017543A1 (ja) 2007-11-01
JP4275669B2 (ja) 2009-06-10
KR100777023B1 (ko) 2007-11-16
EP2154541B1 (de) 2011-02-02
EP1666895B1 (de) 2010-07-28
CN1853111B (zh) 2010-04-28
EP1666895A1 (de) 2006-06-07
KR20070086952A (ko) 2007-08-27
WO2005017543A1 (ja) 2005-02-24
DE602004031311D1 (de) 2011-03-17
EP2154541A1 (de) 2010-02-17
US20100066398A1 (en) 2010-03-18
KR100875527B1 (ko) 2008-12-23

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