DE60144460D1 - Akustische Oberflächenwellenanordnung und Verfahren zu ihrer Herstellung - Google Patents

Akustische Oberflächenwellenanordnung und Verfahren zu ihrer Herstellung

Info

Publication number
DE60144460D1
DE60144460D1 DE60144460T DE60144460T DE60144460D1 DE 60144460 D1 DE60144460 D1 DE 60144460D1 DE 60144460 T DE60144460 T DE 60144460T DE 60144460 T DE60144460 T DE 60144460T DE 60144460 D1 DE60144460 D1 DE 60144460D1
Authority
DE
Germany
Prior art keywords
manufacture
acoustic wave
surface acoustic
wave device
wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60144460T
Other languages
English (en)
Inventor
Takashi Iwamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Application granted granted Critical
Publication of DE60144460D1 publication Critical patent/DE60144460D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14538—Formation
    • H03H9/14541—Multilayer finger or busbar electrode
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/49798—Dividing sequentially from leading end, e.g., by cutting or breaking

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
DE60144460T 2000-07-31 2001-07-24 Akustische Oberflächenwellenanordnung und Verfahren zu ihrer Herstellung Expired - Lifetime DE60144460D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000231183A JP3414371B2 (ja) 2000-07-31 2000-07-31 弾性表面波装置及びその製造方法

Publications (1)

Publication Number Publication Date
DE60144460D1 true DE60144460D1 (de) 2011-06-01

Family

ID=18724052

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60144460T Expired - Lifetime DE60144460D1 (de) 2000-07-31 2001-07-24 Akustische Oberflächenwellenanordnung und Verfahren zu ihrer Herstellung

Country Status (4)

Country Link
US (2) US6545388B2 (de)
EP (1) EP1184978B1 (de)
JP (1) JP3414371B2 (de)
DE (1) DE60144460D1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3402311B2 (ja) * 2000-05-19 2003-05-06 株式会社村田製作所 弾性表面波装置
US7062488B1 (en) * 2000-08-30 2006-06-13 Richard Reisman Task/domain segmentation in applying feedback to command control
JP3724575B2 (ja) * 2001-08-09 2005-12-07 セイコーエプソン株式会社 弾性表面波装置
JP4060090B2 (ja) * 2002-02-15 2008-03-12 沖電気工業株式会社 弾性表面波素子
JP3841053B2 (ja) * 2002-07-24 2006-11-01 株式会社村田製作所 弾性表面波装置及びその製造方法
US20040256949A1 (en) * 2003-06-17 2004-12-23 Takuo Hada Surface acoustic wave device
US7141909B2 (en) 2003-06-17 2006-11-28 Murata Manufacturing Co., Ltd. Surface acoustic wave device
JP2005175927A (ja) * 2003-12-11 2005-06-30 Murata Mfg Co Ltd 弾性表面波素子の製造方法
US7589451B2 (en) * 2004-04-01 2009-09-15 Epson Toyocom Corporation Surface acoustic wave device
JP5039290B2 (ja) * 2005-08-25 2012-10-03 太陽誘電株式会社 フィルタおよびアンテナ分波器
US7522158B2 (en) * 2005-09-22 2009-04-21 International Business Machines Corporation Systems, methods, and media for determining the location of a stylus for a portable electronic device
JP2007166461A (ja) * 2005-12-16 2007-06-28 Epson Toyocom Corp 弾性表面波素子、及びこれを用いた弾性表面波デバイス
JP4811516B2 (ja) * 2007-03-06 2011-11-09 株式会社村田製作所 弾性境界波装置
CN101765971B (zh) 2007-07-30 2013-05-29 株式会社村田制作所 弹性波装置及其制造方法
WO2009066367A1 (ja) 2007-11-19 2009-05-28 Fujitsu Limited 弾性境界波デバイス、およびそれを用いた通信機
US20120181899A1 (en) * 2011-01-18 2012-07-19 Nihon Dempa Kogyo Co., Ltd. Piezoelectric resonator and elastic wave device
KR101953219B1 (ko) * 2016-11-24 2019-02-28 가부시키가이샤 무라타 세이사쿠쇼 탄성파 장치, 고주파 프론트 엔드 회로 및 통신 장치

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4098921A (en) * 1976-04-28 1978-07-04 Cutler-Hammer Tantalum-gallium arsenide schottky barrier semiconductor device
US4064621A (en) * 1976-09-16 1977-12-27 General Motors Corporation Cadmium diffused Pb1-x Snx Te diode laser
US4495431A (en) 1983-08-22 1985-01-22 United Technologies Corporation Low reflectivity surface-mounted electrodes on semiconductive saw devices
JPS62168410A (ja) 1986-01-20 1987-07-24 Victor Co Of Japan Ltd 弾性表面波共振子
JPH05267981A (ja) 1992-03-23 1993-10-15 Kokusai Electric Co Ltd 弾性表面波共振子
JP3278951B2 (ja) * 1992-10-23 2002-04-30 ソニー株式会社 オーミック電極の形成方法
JPH06350377A (ja) 1993-06-11 1994-12-22 Hitachi Ltd 弾性表面波素子
US5815900A (en) * 1995-03-06 1998-10-06 Matsushita Electric Industrial Co., Ltd. Method of manufacturing a surface acoustic wave module
JP3731611B2 (ja) 1995-03-10 2006-01-05 株式会社村田製作所 表面波デバイス
JP3609423B2 (ja) * 1995-09-21 2005-01-12 Ｔｄｋ株式会社 弾性表面波装置及びその製造方法
US5760423A (en) * 1996-11-08 1998-06-02 Kabushiki Kaisha Toshiba Semiconductor light emitting device, electrode of the same device and method of manufacturing the same device
JP2929987B2 (ja) 1996-01-12 1999-08-03 日本電気株式会社 弾性表面波装置の製造方法
JPH09199976A (ja) * 1996-01-18 1997-07-31 Hitachi Ltd 弾性表面波素子電極
JP3339350B2 (ja) 1997-02-20 2002-10-28 株式会社村田製作所 弾性表面波装置
JPH10247835A (ja) 1997-03-03 1998-09-14 Kokusai Electric Co Ltd ラブ波型弾性表面波デバイス
KR100644470B1 (ko) 1997-07-28 2006-11-13 가부시끼가이샤 도시바 탄성표면파 필터 및 그의 제조방법
JPH1174751A (ja) 1997-08-28 1999-03-16 Murata Mfg Co Ltd 弾性表面波装置
JPH11234082A (ja) 1998-02-13 1999-08-27 Toko Inc 表面弾性波装置
JP3317273B2 (ja) 1998-08-25 2002-08-26 株式会社村田製作所 表面波共振子、フィルタ、共用器、通信機装置
US6259185B1 (en) * 1998-12-02 2001-07-10 Cts Corporation Metallization for high power handling in a surface acoustic wave device and method for providing same
JP3376969B2 (ja) * 1999-09-02 2003-02-17 株式会社村田製作所 弾性表面波装置及びその製造方法

Also Published As

Publication number Publication date
US20020038985A1 (en) 2002-04-04
EP1184978A3 (de) 2008-03-26
JP3414371B2 (ja) 2003-06-09
EP1184978B1 (de) 2011-04-20
US20030011278A1 (en) 2003-01-16
US6898831B2 (en) 2005-05-31
JP2002043888A (ja) 2002-02-08
EP1184978A2 (de) 2002-03-06
US6545388B2 (en) 2003-04-08

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