DE60108043D1 - Zerstörungsfreies Inspektionsverfahren - Google Patents

Zerstörungsfreies Inspektionsverfahren

Info

Publication number
DE60108043D1
DE60108043D1 DE60108043T DE60108043T DE60108043D1 DE 60108043 D1 DE60108043 D1 DE 60108043D1 DE 60108043 T DE60108043 T DE 60108043T DE 60108043 T DE60108043 T DE 60108043T DE 60108043 D1 DE60108043 D1 DE 60108043D1
Authority
DE
Germany
Prior art keywords
destructive inspection
inspection procedure
procedure
destructive
inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60108043T
Other languages
English (en)
Other versions
DE60108043T2 (de
Inventor
Kiyoshi Nikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Electronics Corp
Original Assignee
NEC Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001081310A external-priority patent/JP2002313859A/ja
Application filed by NEC Electronics Corp filed Critical NEC Electronics Corp
Publication of DE60108043D1 publication Critical patent/DE60108043D1/de
Application granted granted Critical
Publication of DE60108043T2 publication Critical patent/DE60108043T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Or Analyzing Materials By The Use Of Magnetic Means (AREA)
  • Tests Of Electronic Circuits (AREA)
DE60108043T 2000-10-26 2001-10-24 Zerstörungsfreies Inspektionsverfahren Expired - Fee Related DE60108043T2 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2000326820 2000-10-26
JP2000326820 2000-10-26
JP2001033928 2001-02-09
JP2001033928 2001-02-09
JP2001081310A JP2002313859A (ja) 2001-02-09 2001-03-21 非破壊検査方法および装置ならびに半導体チップ
JP2001081310 2001-03-21

Publications (2)

Publication Number Publication Date
DE60108043D1 true DE60108043D1 (de) 2005-02-03
DE60108043T2 DE60108043T2 (de) 2005-12-08

Family

ID=27345031

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60108043T Expired - Fee Related DE60108043T2 (de) 2000-10-26 2001-10-24 Zerstörungsfreies Inspektionsverfahren

Country Status (6)

Country Link
US (1) US6593156B2 (de)
EP (1) EP1202069B1 (de)
KR (1) KR100402044B1 (de)
CN (1) CN1194396C (de)
DE (1) DE60108043T2 (de)
TW (1) TW528874B (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4429593B2 (ja) * 2002-11-22 2010-03-10 パナソニック株式会社 半導体装置のレイアウト検証方法
JP4334927B2 (ja) * 2003-06-27 2009-09-30 キヤノン株式会社 半導体レーザーダイオードチップの検査方法および検査装置
JP2005134196A (ja) * 2003-10-29 2005-05-26 Nec Electronics Corp 非破壊解析方法及び非破壊解析装置
JP2007127590A (ja) * 2005-11-07 2007-05-24 Nec Electronics Corp 半導体装置の検査方法および装置
JP2009008626A (ja) * 2007-06-29 2009-01-15 Nec Electronics Corp 故障解析方法及び故障解析装置
CN101382502B (zh) * 2007-09-07 2011-07-27 鸿富锦精密工业（深圳）有限公司 表面污点检测系统及其检测方法
US20090147255A1 (en) * 2007-12-07 2009-06-11 Erington Kent B Method for testing a semiconductor device and a semiconductor device testing system
KR101109302B1 (ko) * 2009-12-02 2012-01-31 삼성전기주식회사 회로패턴의 결함 검사장치 및 그 검사방법
JP2012043953A (ja) * 2010-08-18 2012-03-01 Renesas Electronics Corp 電子部品および電子部品の製造方法
DE102013217094B4 (de) * 2013-08-28 2021-11-04 Robert Bosch Gmbh Mikromechanisches Bauelement und entsprechendes Prüfverfahren für ein mikromechanisches Bauelement
US9523729B2 (en) * 2013-09-13 2016-12-20 Infineon Technologies Ag Apparatus and method for testing electric conductors
CN103698681A (zh) * 2013-12-19 2014-04-02 江苏瑞新科技股份有限公司 一种新型半导体p、n类型非接触测试装置
TW201704766A (zh) 2015-03-19 2017-02-01 帝喜科技股份有限公司 加熱粒子束以識別缺陷
US9995677B2 (en) 2016-09-06 2018-06-12 Sensors Unlimited, Inc. Silicon article inspection systems and methods
US10739397B2 (en) 2017-05-10 2020-08-11 International Business Machines Corporation Accelerated wafer testing using non-destructive and localized stress
US10514363B2 (en) 2018-02-23 2019-12-24 The Boeing Company Laser ultrasound scanning for visualizing damage or irregularities
KR102362879B1 (ko) 2018-07-04 2022-02-11 주식회사 엘지에너지솔루션 이차전지 내부단락 시험 방법과 장치 및 이에 이용되는 내부단락 시험용 이차전지
TWI712317B (zh) * 2019-02-22 2020-12-01 興城科技股份有限公司 用於檢查玻璃基板的開路/短路檢查機及其檢查方法
US11548161B2 (en) 2020-05-14 2023-01-10 The Boeing Company Methods of performing a plurality of operations within a region of a part utilizing an end effector of a robot and robots that perform the methods
TWI741791B (zh) * 2020-09-16 2021-10-01 南亞科技股份有限公司 晶圓檢驗方法及系統
US11639914B2 (en) 2020-12-16 2023-05-02 The Boeing Company Non-destructive test systems with infrared thermography assemblies and ultrasonic test assemblies, and associated methods

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2565354B3 (fr) * 1984-05-30 1986-10-24 Eurotechnique Sa Procede et dispositif de test de circuits integres sur tranches
JPS6489442A (en) * 1987-09-30 1989-04-03 Toshiba Corp Measuring method of semiconductor device
US5334540A (en) * 1991-11-14 1994-08-02 Mitsubishi Denki Kabushiki Kaisha OBIC observation method and apparatus therefor
JP2970194B2 (ja) * 1992-04-02 1999-11-02 日本電気株式会社 半導体集積回路
JPH0645418A (ja) * 1992-07-21 1994-02-18 Mitsubishi Denki Eng Kk 半導体テストシステム、半導体テスト方法、半導体集積回路の配線パターン作成方法および半導体集積回路
US5422498A (en) * 1993-04-13 1995-06-06 Nec Corporation Apparatus for diagnosing interconnections of semiconductor integrated circuits
JPH0714898A (ja) * 1993-06-23 1995-01-17 Mitsubishi Electric Corp 半導体ウエハの試験解析装置および解析方法
JP2718370B2 (ja) * 1994-07-29 1998-02-25 日本電気株式会社 配線ショート箇所検出方法および配線ショート箇所検出装置
US5708371A (en) * 1995-03-16 1998-01-13 Mitsubishi Denki Kabushiki Kaisha Scanning photoinduced current analyzer capable of detecting photoinduced current in nonbiased specimen
JPH10135413A (ja) 1996-10-31 1998-05-22 Matsushita Electric Works Ltd 半導体装置及びその評価方法
US6346821B1 (en) * 1998-03-27 2002-02-12 Infineon Technologies Ag Method for nondestructive measurement of minority carrier diffusion length and minority carrier lifetime in semiconductor devices
EP0990918B1 (de) * 1998-09-28 2009-01-21 NEC Electronics Corporation Vorrichtung und Verfahren zum zerstörungsfreien Prüfen einer Halbleiteranordnung

Also Published As

Publication number Publication date
CN1351263A (zh) 2002-05-29
KR20020032383A (ko) 2002-05-03
EP1202069A3 (de) 2003-04-23
TW528874B (en) 2003-04-21
US6593156B2 (en) 2003-07-15
CN1194396C (zh) 2005-03-23
EP1202069B1 (de) 2004-12-29
EP1202069A2 (de) 2002-05-02
KR100402044B1 (ko) 2003-10-17
DE60108043T2 (de) 2005-12-08
US20020052055A1 (en) 2002-05-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee