DE60101695D1 - Esterverbindungen, Polymere, Photoresistcompositionen und Mustererzeugungsverfahren - Google Patents
Esterverbindungen, Polymere, Photoresistcompositionen und MustererzeugungsverfahrenInfo
- Publication number
- DE60101695D1 DE60101695D1 DE60101695T DE60101695T DE60101695D1 DE 60101695 D1 DE60101695 D1 DE 60101695D1 DE 60101695 T DE60101695 T DE 60101695T DE 60101695 T DE60101695 T DE 60101695T DE 60101695 D1 DE60101695 D1 DE 60101695D1
- Authority
- DE
- Germany
- Prior art keywords
- polymers
- pattern generation
- ester compounds
- photoresist compositions
- generation processes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/013—Esters of alcohols having the esterified hydroxy group bound to a carbon atom of a ring other than a six-membered aromatic ring
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/52—Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
- C07C69/533—Monocarboxylic acid esters having only one carbon-to-carbon double bond
- C07C69/54—Acrylic acid esters; Methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/52—Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
- C07C69/533—Monocarboxylic acid esters having only one carbon-to-carbon double bond
- C07C69/56—Crotonic acid esters; Vinyl acetic acid esters
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/74—Esters of carboxylic acids having an esterified carboxyl group bound to a carbon atom of a ring other than a six-membered aromatic ring
- C07C69/753—Esters of carboxylic acids having an esterified carboxyl group bound to a carbon atom of a ring other than a six-membered aromatic ring of polycyclic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1811—C10or C11-(Meth)acrylate, e.g. isodecyl (meth)acrylate, isobornyl (meth)acrylate or 2-naphthyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/04—Anhydrides, e.g. cyclic anhydrides
- C08F222/06—Maleic anhydride
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F232/00—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
- C08F232/08—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having condensed rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F32/00—Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
- C08F32/08—Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having two condensed rings
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000119410 | 2000-04-20 | ||
JP2000119410 | 2000-04-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60101695D1 true DE60101695D1 (de) | 2004-02-12 |
DE60101695T2 DE60101695T2 (de) | 2004-12-09 |
Family
ID=18630387
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60101695T Expired - Lifetime DE60101695T2 (de) | 2000-04-20 | 2001-04-19 | Esterverbindungen, Polymere, Photoresistcompositionen und Mustererzeugnisse |
DE60100721T Expired - Lifetime DE60100721T2 (de) | 2000-04-20 | 2001-04-19 | Esterverbindungen, Polymere, Photoresistcompositionen und Mustererzeugungsverfahren |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60100721T Expired - Lifetime DE60100721T2 (de) | 2000-04-20 | 2001-04-19 | Esterverbindungen, Polymere, Photoresistcompositionen und Mustererzeugungsverfahren |
Country Status (5)
Country | Link |
---|---|
US (3) | US6596463B2 (de) |
EP (2) | EP1148045B1 (de) |
KR (2) | KR100582158B1 (de) |
DE (2) | DE60101695T2 (de) |
TW (2) | TW520357B (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW534911B (en) * | 1999-11-15 | 2003-06-01 | Shinetsu Chemical Co | Polymer, resist composition and patterning process |
KR100498440B1 (ko) * | 1999-11-23 | 2005-07-01 | 삼성전자주식회사 | 백본이 환상 구조를 가지는 감광성 폴리머와 이를포함하는 레지스트 조성물 |
US6777157B1 (en) * | 2000-02-26 | 2004-08-17 | Shipley Company, L.L.C. | Copolymers and photoresist compositions comprising same |
US6509135B2 (en) * | 2000-03-06 | 2003-01-21 | Shin-Etsu Chemical Co., Ltd. | Polymer, resist composition and patterning process |
US6596463B2 (en) * | 2000-04-20 | 2003-07-22 | Shin-Etsu Chemical, Co., Ltd. | Ester compounds, polymers, resist compositions and patterning process |
JP3589160B2 (ja) * | 2000-07-07 | 2004-11-17 | 日本電気株式会社 | レジスト用材料、化学増幅型レジスト及びそれを用いたパターン形成方法 |
JP4371206B2 (ja) * | 2002-09-30 | 2009-11-25 | 信越化学工業株式会社 | エステル化合物、高分子化合物、レジスト材料、及びパターン形成方法 |
JP2004219989A (ja) * | 2002-12-25 | 2004-08-05 | Tokyo Ohka Kogyo Co Ltd | ポジ型レジスト組成物及びそれを用いたレジストパターンの形成方法 |
US6878504B2 (en) * | 2003-05-28 | 2005-04-12 | Everlight Usa, Inc. | Chemically-amplified resist compositions |
JP4300420B2 (ja) * | 2004-06-21 | 2009-07-22 | 信越化学工業株式会社 | 高分子化合物、レジスト材料及びパターン形成方法 |
DE102004046405A1 (de) * | 2004-09-24 | 2006-04-06 | Infineon Technologies Ag | Copolymer, Zusammensetzung enthaltend das Copolymer und Verfahren zur Strukturierung eines Substrats unter Verwendung der Zusammensetzung |
US7476492B2 (en) | 2006-05-26 | 2009-01-13 | International Business Machines Corporation | Low activation energy photoresist composition and process for its use |
JP4910662B2 (ja) * | 2006-11-29 | 2012-04-04 | 信越化学工業株式会社 | ポジ型レジスト材料及びパターン形成方法 |
US20110039206A1 (en) * | 2009-05-20 | 2011-02-17 | Rohm And Haas Electronic Materials Llc | Novel resins and photoresist compositions comprising same |
US20110039210A1 (en) | 2009-05-20 | 2011-02-17 | Rohm And Haas Electronic Materials Llc | Novel resins and photoresist compositions comprising same |
US8790861B2 (en) * | 2011-12-31 | 2014-07-29 | Rohm And Haas Electronic Materials Llc | Cycloaliphatic monomer, polymer comprising the same, and photoresist composition comprising the polymer |
US20130171429A1 (en) * | 2011-12-31 | 2013-07-04 | Rohm And Haas Electronic Materials Llc | Cycloaliphatic monomer, polymer comprising the same, and photoresist composition comprising the polymer |
JP5772760B2 (ja) * | 2012-08-13 | 2015-09-02 | 信越化学工業株式会社 | ポジ型レジスト材料並びにこれを用いたパターン形成方法 |
JP6904245B2 (ja) * | 2017-12-27 | 2021-07-14 | 信越化学工業株式会社 | 感光性樹脂組成物、パターン形成方法、及び光半導体素子の製造方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4491628A (en) | 1982-08-23 | 1985-01-01 | International Business Machines Corporation | Positive- and negative-working resist compositions with acid generating photoinitiator and polymer with acid labile groups pendant from polymer backbone |
US4603101A (en) | 1985-09-27 | 1986-07-29 | General Electric Company | Photoresist compositions containing t-substituted organomethyl vinylaryl ether materials |
DE3817012A1 (de) | 1988-05-19 | 1989-11-30 | Basf Ag | Positiv und negativ arbeitende strahlungsempfindliche gemische sowie verfahren zur herstellung von reliefmustern |
JP2578646B2 (ja) | 1988-07-18 | 1997-02-05 | 三洋電機株式会社 | 非水系二次電池 |
JPH04215661A (ja) | 1990-12-14 | 1992-08-06 | Fujitsu Ltd | レジストパターンの形成方法 |
JP3000745B2 (ja) | 1991-09-19 | 2000-01-17 | 富士通株式会社 | レジスト組成物とレジストパターンの形成方法 |
JPH0588367A (ja) | 1991-09-30 | 1993-04-09 | Fujitsu Ltd | レジスト組成物とレジストパターンの形成方法 |
JP3772249B2 (ja) * | 1998-05-11 | 2006-05-10 | 信越化学工業株式会社 | 新規なエステル化合物、高分子化合物、レジスト材料、及びパターン形成方法 |
TW457277B (en) * | 1998-05-11 | 2001-10-01 | Shinetsu Chemical Co | Ester compounds, polymers, resist composition and patterning process |
DE19822968A1 (de) | 1998-05-25 | 1999-12-02 | Rwe Dea Ag | Verfahren zur katalytischen Hydroformylierung von Olefinen |
KR100573659B1 (ko) | 1998-05-25 | 2006-04-26 | 다이셀 가가꾸 고교 가부시끼가이샤 | 산감응성 화합물 및 포토레지스트용 수지 조성물 |
KR20000015014A (ko) * | 1998-08-26 | 2000-03-15 | 김영환 | 신규의 포토레지스트용 단량체, 중합체 및 이를 이용한 포토레지스트 조성물 |
KR100441734B1 (ko) * | 1998-11-02 | 2004-08-04 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 신규한 에스테르 화합물, 고분자 화합물, 레지스트 재료및 패턴 형성 방법 |
US6596463B2 (en) * | 2000-04-20 | 2003-07-22 | Shin-Etsu Chemical, Co., Ltd. | Ester compounds, polymers, resist compositions and patterning process |
JP3997382B2 (ja) * | 2000-04-28 | 2007-10-24 | 信越化学工業株式会社 | 脂環構造を有する新規エステル化合物及びその製造方法 |
KR100497091B1 (ko) * | 2000-10-02 | 2005-06-27 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 환상 아세탈 화합물, 고분자 화합물, 레지스트 재료 및패턴 형성 방법 |
-
2001
- 2001-04-19 US US09/837,219 patent/US6596463B2/en not_active Expired - Lifetime
- 2001-04-19 DE DE60101695T patent/DE60101695T2/de not_active Expired - Lifetime
- 2001-04-19 KR KR1020010021007A patent/KR100582158B1/ko active IP Right Grant
- 2001-04-19 US US09/837,378 patent/US6586157B2/en not_active Expired - Lifetime
- 2001-04-19 TW TW090109383A patent/TW520357B/zh not_active IP Right Cessation
- 2001-04-19 DE DE60100721T patent/DE60100721T2/de not_active Expired - Lifetime
- 2001-04-19 EP EP01303555A patent/EP1148045B1/de not_active Expired - Lifetime
- 2001-04-19 TW TW090109382A patent/TW507117B/zh not_active IP Right Cessation
- 2001-04-19 EP EP01303574A patent/EP1148044B1/de not_active Expired - Lifetime
- 2001-04-19 KR KR1020010021086A patent/KR100582630B1/ko active IP Right Grant
-
2003
- 2003-03-19 US US10/390,795 patent/US20030198891A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
KR20010098725A (ko) | 2001-11-08 |
KR100582630B1 (ko) | 2006-05-23 |
EP1148044A1 (de) | 2001-10-24 |
DE60100721T2 (de) | 2004-07-15 |
US20010044071A1 (en) | 2001-11-22 |
EP1148045A1 (de) | 2001-10-24 |
DE60101695T2 (de) | 2004-12-09 |
TW520357B (en) | 2003-02-11 |
DE60100721D1 (de) | 2003-10-16 |
US6586157B2 (en) | 2003-07-01 |
TW507117B (en) | 2002-10-21 |
US20020004178A1 (en) | 2002-01-10 |
EP1148045B1 (de) | 2003-09-10 |
KR100582158B1 (ko) | 2006-05-23 |
EP1148044B1 (de) | 2004-01-07 |
US6596463B2 (en) | 2003-07-22 |
KR20010098739A (ko) | 2001-11-08 |
US20030198891A1 (en) | 2003-10-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |