DE60045260D1 - Übergangsfeldeffekttransistor und seine herstellungsmethode - Google Patents

Übergangsfeldeffekttransistor und seine herstellungsmethode

Info

Publication number
DE60045260D1
DE60045260D1 DE60045260T DE60045260T DE60045260D1 DE 60045260 D1 DE60045260 D1 DE 60045260D1 DE 60045260 T DE60045260 T DE 60045260T DE 60045260 T DE60045260 T DE 60045260T DE 60045260 D1 DE60045260 D1 DE 60045260D1
Authority
DE
Germany
Prior art keywords
manufacturing
field effect
effect transistor
transition field
transition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60045260T
Other languages
English (en)
Inventor
Shin Harada
Kenichi Hirotsu
Hiroyuki Matsunami
Tsunenobu Kimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP11366799A external-priority patent/JP2000299475A/ja
Priority claimed from JP2000008969A external-priority patent/JP4876297B2/ja
Priority claimed from JP2000194464A external-priority patent/JP4830179B2/ja
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Application granted granted Critical
Publication of DE60045260D1 publication Critical patent/DE60045260D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/0843—Source or drain regions of field-effect devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1025—Channel region of field-effect devices
    • H01L29/1029—Channel region of field-effect devices of field-effect transistors
    • H01L29/1058—Channel region of field-effect devices of field-effect transistors with PN junction gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1066—Gate region of field-effect devices with PN junction gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
    • H01L29/1608—Silicon carbide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66893—Unipolar field-effect transistors with a PN junction gate, i.e. JFET
    • H01L29/66901—Unipolar field-effect transistors with a PN junction gate, i.e. JFET with a PN homojunction gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66893—Unipolar field-effect transistors with a PN junction gate, i.e. JFET
    • H01L29/66901—Unipolar field-effect transistors with a PN junction gate, i.e. JFET with a PN homojunction gate
    • H01L29/66909—Vertical transistors, e.g. tecnetrons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/7722—Field effect transistors using static field induced regions, e.g. SIT, PBT
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/80—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
    • H01L29/808—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with a PN junction gate, e.g. PN homojunction gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/80—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
    • H01L29/808—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with a PN junction gate, e.g. PN homojunction gate
    • H01L29/8083—Vertical transistors
DE60045260T 1999-12-24 2000-09-11 Übergangsfeldeffekttransistor und seine herstellungsmethode Expired - Lifetime DE60045260D1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP11366799A JP2000299475A (ja) 1999-02-12 1999-12-24 電界効果トランジスタおよびその製造方法
JP2000008969A JP4876297B2 (ja) 2000-01-18 2000-01-18 電力用半導体素子
JP2000194464A JP4830179B2 (ja) 2000-06-28 2000-06-28 接合型電界効果トランジスタ
PCT/JP2000/006211 WO2001048809A1 (fr) 1999-12-24 2000-09-11 Transistor a effet de champ a jonction et procede de fabrication correspondant

Publications (1)

Publication Number Publication Date
DE60045260D1 true DE60045260D1 (de) 2010-12-30

Family

ID=27341738

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60045260T Expired - Lifetime DE60045260D1 (de) 1999-12-24 2000-09-11 Übergangsfeldeffekttransistor und seine herstellungsmethode
DE60045497T Expired - Lifetime DE60045497D1 (de) 1999-12-24 2000-09-11 Feldeffekttransistor mit PN-Übergang

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE60045497T Expired - Lifetime DE60045497D1 (de) 1999-12-24 2000-09-11 Feldeffekttransistor mit PN-Übergang

Country Status (8)

Country Link
US (1) US6870189B1 (de)
EP (3) EP2081218B1 (de)
KR (1) KR100661691B1 (de)
CN (1) CN1243373C (de)
CA (1) CA2395608C (de)
DE (2) DE60045260D1 (de)
TW (1) TW456042B (de)
WO (1) WO2001048809A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE535010T1 (de) * 2001-07-12 2011-12-15 Univ Mississippi State Verfahren zur herstllung selbstausgerichteten transistortopologien in siliziumkarbid durch verwendung selektiver epitaxie
KR100477396B1 (ko) * 2002-09-04 2005-03-28 한국전기연구원 금속 게이트 전극을 갖는 탄화규소 모스펫 소자 및 그제조방법
US7417270B2 (en) * 2004-06-23 2008-08-26 Texas Instruments Incorporated Distributed high voltage JFET
US7119380B2 (en) * 2004-12-01 2006-10-10 Semisouth Laboratories, Inc. Lateral trench field-effect transistors in wide bandgap semiconductor materials, methods of making, and integrated circuits incorporating the transistors
US7569873B2 (en) * 2005-10-28 2009-08-04 Dsm Solutions, Inc. Integrated circuit using complementary junction field effect transistor and MOS transistor in silicon and silicon alloys
US7863656B2 (en) * 2006-05-12 2011-01-04 Cree Sweden Ab Semiconductor device
US7763506B2 (en) * 2007-09-10 2010-07-27 Infineon Technologies Austria Ag Method for making an integrated circuit including vertical junction field effect transistors
US7977713B2 (en) * 2008-05-08 2011-07-12 Semisouth Laboratories, Inc. Semiconductor devices with non-punch-through semiconductor channels having enhanced conduction and methods of making
US7994548B2 (en) * 2008-05-08 2011-08-09 Semisouth Laboratories, Inc. Semiconductor devices with non-punch-through semiconductor channels having enhanced conduction and methods of making
JP5452062B2 (ja) * 2009-04-08 2014-03-26 三菱電機株式会社 炭化珪素半導体装置の製造方法
TWI405332B (zh) * 2010-03-10 2013-08-11 Macronix Int Co Ltd 接面場效應電晶體元件
US8969912B2 (en) * 2011-08-04 2015-03-03 Avogy, Inc. Method and system for a GaN vertical JFET utilizing a regrown channel
US9184305B2 (en) * 2011-08-04 2015-11-10 Avogy, Inc. Method and system for a GAN vertical JFET utilizing a regrown gate
WO2013026035A1 (en) * 2011-08-17 2013-02-21 Ramgoss, Inc. Vertical field effect transistor on oxide semiconductor substrate and method of manufacturing the same
US9006800B2 (en) 2011-12-14 2015-04-14 Avogy, Inc. Ingan ohmic source contacts for vertical power devices
CN103730517A (zh) * 2012-10-15 2014-04-16 上海华虹宏力半导体制造有限公司 面结型场效应晶体管及其制造方法
CN109791951B (zh) * 2016-09-09 2023-08-01 美国联合碳化硅公司 具有改进的阈值电压控制的沟槽垂直jfet
JP6787367B2 (ja) 2017-07-26 2020-11-18 株式会社デンソー 半導体装置
US10361127B1 (en) 2017-12-28 2019-07-23 International Business Machines Corporation Vertical transport FET with two or more gate lengths
JP2019175908A (ja) * 2018-03-27 2019-10-10 トヨタ自動車株式会社 半導体装置とその製造方法
JP6973422B2 (ja) 2019-01-21 2021-11-24 株式会社デンソー 半導体装置の製造方法
JP6950714B2 (ja) 2019-01-21 2021-10-13 株式会社デンソー 半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5378177A (en) 1976-12-22 1978-07-11 Toshiba Corp Field effect transistor
JPS5846874B2 (ja) * 1977-04-27 1983-10-19 三菱電機株式会社 接合型電界効果トランジスタ
JPH04273169A (ja) 1991-02-28 1992-09-29 Fuji Electric Co Ltd 静電誘導トランジスタ
JP2689057B2 (ja) 1992-09-16 1997-12-10 本田技研工業株式会社 静電誘導型半導体装置
US5396085A (en) * 1993-12-28 1995-03-07 North Carolina State University Silicon carbide switching device with rectifying-gate
US5903020A (en) * 1997-06-18 1999-05-11 Northrop Grumman Corporation Silicon carbide static induction transistor structure
US5945701A (en) * 1997-12-19 1999-08-31 Northrop Grumman Corporation Static induction transistor
US6313482B1 (en) * 1999-05-17 2001-11-06 North Carolina State University Silicon carbide power devices having trench-based silicon carbide charge coupling regions therein

Also Published As

Publication number Publication date
CN1243373C (zh) 2006-02-22
EP1284496A1 (de) 2003-02-19
TW456042B (en) 2001-09-21
CA2395608C (en) 2010-06-22
EP1284496A4 (de) 2007-06-27
EP2081218B1 (de) 2011-11-09
CA2395608A1 (en) 2001-07-05
EP2081219A1 (de) 2009-07-22
KR100661691B1 (ko) 2006-12-26
WO2001048809A1 (fr) 2001-07-05
CN1423836A (zh) 2003-06-11
DE60045497D1 (de) 2011-02-17
EP1284496B1 (de) 2010-11-17
EP2081218A1 (de) 2009-07-22
KR20020062989A (ko) 2002-07-31
EP2081219B1 (de) 2011-01-05
US6870189B1 (en) 2005-03-22

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