DE60034854D1 - Vakuumerzeugungssystem - Google Patents

Vakuumerzeugungssystem

Info

Publication number
DE60034854D1
DE60034854D1 DE60034854T DE60034854T DE60034854D1 DE 60034854 D1 DE60034854 D1 DE 60034854D1 DE 60034854 T DE60034854 T DE 60034854T DE 60034854 T DE60034854 T DE 60034854T DE 60034854 D1 DE60034854 D1 DE 60034854D1
Authority
DE
Germany
Prior art keywords
induction system
vacuum induction
vacuum
induction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60034854T
Other languages
English (en)
Other versions
DE60034854T2 (de
Inventor
Hiroyuki Kawasaki
Hiroshi Sobukawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=17664589&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE60034854(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of DE60034854D1 publication Critical patent/DE60034854D1/de
Application granted granted Critical
Publication of DE60034854T2 publication Critical patent/DE60034854T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D25/00—Pumping installations or systems
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
    • F04D17/08—Centrifugal pumps
    • F04D17/16—Centrifugal pumps for displacing without appreciable compression
    • F04D17/168—Pumps specially adapted to produce a vacuum
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D19/00—Axial-flow pumps
    • F04D19/02—Multi-stage pumps
    • F04D19/04—Multi-stage pumps specially adapted to the production of a high vacuum, e.g. molecular pumps
    • F04D19/046—Combinations of two or more different types of pumps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/85978—With pump
    • Y10T137/86131—Plural
    • Y10T137/86139—Serial
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/85978—With pump
    • Y10T137/86131—Plural
    • Y10T137/86163—Parallel

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Non-Positive Displacement Air Blowers (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
DE60034854T 1999-10-04 2000-10-04 Vakuumerzeugungssystem Expired - Fee Related DE60034854T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP28336799 1999-10-04
JP28336799 1999-10-04

Publications (2)

Publication Number Publication Date
DE60034854D1 true DE60034854D1 (de) 2007-06-28
DE60034854T2 DE60034854T2 (de) 2008-02-14

Family

ID=17664589

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60034854T Expired - Fee Related DE60034854T2 (de) 1999-10-04 2000-10-04 Vakuumerzeugungssystem

Country Status (6)

Country Link
US (1) US6382249B1 (de)
EP (1) EP1091019B1 (de)
KR (1) KR20010050844A (de)
DE (1) DE60034854T2 (de)
SG (1) SG97943A1 (de)
TW (1) TW477865B (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7077159B1 (en) * 1998-12-23 2006-07-18 Applied Materials, Inc. Processing apparatus having integrated pumping system
JP2002048088A (ja) * 2000-07-31 2002-02-15 Seiko Instruments Inc 真空ポンプ
US6896764B2 (en) * 2001-11-28 2005-05-24 Tokyo Electron Limited Vacuum processing apparatus and control method thereof
JP4156830B2 (ja) * 2001-12-13 2008-09-24 エドワーズ株式会社 真空ポンプ
US20030175112A1 (en) * 2002-03-13 2003-09-18 Hirotaka Namiki Vacuum pump system and vacuum pump RPM control method
GB0214273D0 (en) * 2002-06-20 2002-07-31 Boc Group Plc Apparatus for controlling the pressure in a process chamber and method of operating same
CN1671884A (zh) * 2002-07-31 2005-09-21 东京毅力科创株式会社 小体积、高流导的处理室
JP4825608B2 (ja) * 2005-08-12 2011-11-30 株式会社荏原製作所 真空排気装置および真空排気方法、基板の加工装置および基板の加工方法
JP4885000B2 (ja) * 2007-02-13 2012-02-29 株式会社ニューフレアテクノロジー 気相成長装置および気相成長方法
US20090242046A1 (en) * 2008-03-31 2009-10-01 Benjamin Riordon Valve module
JP2010174779A (ja) * 2009-01-30 2010-08-12 Hitachi High-Technologies Corp 真空処理装置
US8623141B2 (en) * 2009-05-18 2014-01-07 Taiwan Semiconductor Manufacturing Co., Ltd. Piping system and control for semiconductor processing
US9129778B2 (en) * 2011-03-18 2015-09-08 Lam Research Corporation Fluid distribution members and/or assemblies
DE202013003819U1 (de) * 2013-04-24 2014-07-25 Oerlikon Leybold Vacuum Gmbh Vakuumpumpen-System
JP6167673B2 (ja) * 2013-05-31 2017-07-26 東京エレクトロン株式会社 成膜装置、成膜方法及び記憶媒体
JP6586275B2 (ja) * 2015-01-30 2019-10-02 エドワーズ株式会社 真空ポンプ
JP6967954B2 (ja) * 2017-12-05 2021-11-17 東京エレクトロン株式会社 排気装置、処理装置及び排気方法
JP2020056373A (ja) * 2018-10-03 2020-04-09 株式会社荏原製作所 真空排気システム
JP7357564B2 (ja) * 2020-02-07 2023-10-06 エドワーズ株式会社 真空ポンプ、及び、真空ポンプ構成部品

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3247975A1 (de) * 1982-12-24 1984-06-28 Balzers Hochvakuum Gmbh, 6200 Wiesbaden Verfahren und vorrichtung zur auffindung von lecks in waenden
US5079031A (en) * 1988-03-22 1992-01-07 Semiconductor Energy Laboratory Co., Ltd. Apparatus and method for forming thin films
JPH03222895A (ja) 1990-01-26 1991-10-01 Hitachi Koki Co Ltd ねじ溝真空ポンプ
DE4314418A1 (de) 1993-05-03 1994-11-10 Leybold Ag Reibungsvakuumpumpe mit unterschiedlich gestalteten Pumpenabschnitten
JP3501524B2 (ja) * 1994-07-01 2004-03-02 東京エレクトロン株式会社 処理装置の真空排気システム
JP3699159B2 (ja) 1995-05-24 2005-09-28 日本原子力研究所 核融合装置の真空排気システム
JPH08321448A (ja) * 1995-05-25 1996-12-03 Tadahiro Omi 真空排気装置、半導体製造装置及び真空処理方法
JPH09221381A (ja) 1996-02-08 1997-08-26 Komatsu Electron Metals Co Ltd 単結晶引上装置の真空排気装置
JP3695865B2 (ja) 1996-10-16 2005-09-14 株式会社荏原製作所 真空排気装置

Also Published As

Publication number Publication date
EP1091019A1 (de) 2001-04-11
KR20010050844A (ko) 2001-06-25
TW477865B (en) 2002-03-01
EP1091019B1 (de) 2007-05-16
SG97943A1 (en) 2003-08-20
US6382249B1 (en) 2002-05-07
DE60034854T2 (de) 2008-02-14

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Legal Events

Date Code Title Description
8363 Opposition against the patent
8339 Ceased/non-payment of the annual fee