SG97943A1 - Vacuum exhaust system - Google Patents
Vacuum exhaust systemInfo
- Publication number
- SG97943A1 SG97943A1 SG200005614A SG200005614A SG97943A1 SG 97943 A1 SG97943 A1 SG 97943A1 SG 200005614 A SG200005614 A SG 200005614A SG 200005614 A SG200005614 A SG 200005614A SG 97943 A1 SG97943 A1 SG 97943A1
- Authority
- SG
- Singapore
- Prior art keywords
- exhaust system
- vacuum exhaust
- vacuum
- exhaust
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D25/00—Pumping installations or systems
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
- F04D17/08—Centrifugal pumps
- F04D17/16—Centrifugal pumps for displacing without appreciable compression
- F04D17/168—Pumps specially adapted to produce a vacuum
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D19/00—Axial-flow pumps
- F04D19/02—Multi-stage pumps
- F04D19/04—Multi-stage pumps specially adapted to the production of a high vacuum, e.g. molecular pumps
- F04D19/046—Combinations of two or more different types of pumps
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/85978—With pump
- Y10T137/86131—Plural
- Y10T137/86139—Serial
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/85978—With pump
- Y10T137/86131—Plural
- Y10T137/86163—Parallel
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Non-Positive Displacement Air Blowers (AREA)
- Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28336799 | 1999-10-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG97943A1 true SG97943A1 (en) | 2003-08-20 |
Family
ID=17664589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200005614A SG97943A1 (en) | 1999-10-04 | 2000-09-29 | Vacuum exhaust system |
Country Status (6)
Country | Link |
---|---|
US (1) | US6382249B1 (de) |
EP (1) | EP1091019B1 (de) |
KR (1) | KR20010050844A (de) |
DE (1) | DE60034854T2 (de) |
SG (1) | SG97943A1 (de) |
TW (1) | TW477865B (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7077159B1 (en) * | 1998-12-23 | 2006-07-18 | Applied Materials, Inc. | Processing apparatus having integrated pumping system |
JP2002048088A (ja) * | 2000-07-31 | 2002-02-15 | Seiko Instruments Inc | 真空ポンプ |
US6896764B2 (en) * | 2001-11-28 | 2005-05-24 | Tokyo Electron Limited | Vacuum processing apparatus and control method thereof |
JP4156830B2 (ja) * | 2001-12-13 | 2008-09-24 | エドワーズ株式会社 | 真空ポンプ |
US20030175112A1 (en) * | 2002-03-13 | 2003-09-18 | Hirotaka Namiki | Vacuum pump system and vacuum pump RPM control method |
GB0214273D0 (en) * | 2002-06-20 | 2002-07-31 | Boc Group Plc | Apparatus for controlling the pressure in a process chamber and method of operating same |
US20060162656A1 (en) * | 2002-07-31 | 2006-07-27 | Tokyo Electron Limited | Reduced volume, high conductance process chamber |
JP4825608B2 (ja) * | 2005-08-12 | 2011-11-30 | 株式会社荏原製作所 | 真空排気装置および真空排気方法、基板の加工装置および基板の加工方法 |
JP4885000B2 (ja) * | 2007-02-13 | 2012-02-29 | 株式会社ニューフレアテクノロジー | 気相成長装置および気相成長方法 |
US20090242046A1 (en) * | 2008-03-31 | 2009-10-01 | Benjamin Riordon | Valve module |
JP2010174779A (ja) * | 2009-01-30 | 2010-08-12 | Hitachi High-Technologies Corp | 真空処理装置 |
US8623141B2 (en) * | 2009-05-18 | 2014-01-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Piping system and control for semiconductor processing |
US9129778B2 (en) * | 2011-03-18 | 2015-09-08 | Lam Research Corporation | Fluid distribution members and/or assemblies |
DE202013003819U1 (de) * | 2013-04-24 | 2014-07-25 | Oerlikon Leybold Vacuum Gmbh | Vakuumpumpen-System |
JP6167673B2 (ja) * | 2013-05-31 | 2017-07-26 | 東京エレクトロン株式会社 | 成膜装置、成膜方法及び記憶媒体 |
JP6586275B2 (ja) * | 2015-01-30 | 2019-10-02 | エドワーズ株式会社 | 真空ポンプ |
JP6967954B2 (ja) * | 2017-12-05 | 2021-11-17 | 東京エレクトロン株式会社 | 排気装置、処理装置及び排気方法 |
JP2020056373A (ja) * | 2018-10-03 | 2020-04-09 | 株式会社荏原製作所 | 真空排気システム |
JP7357564B2 (ja) * | 2020-02-07 | 2023-10-06 | エドワーズ株式会社 | 真空ポンプ、及び、真空ポンプ構成部品 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4487058A (en) * | 1982-12-24 | 1984-12-11 | Balzers Aktiengesellschaft | Method and apparatus for detecting gas leaks |
US5079031A (en) * | 1988-03-22 | 1992-01-07 | Semiconductor Energy Laboratory Co., Ltd. | Apparatus and method for forming thin films |
US5863842A (en) * | 1995-05-25 | 1999-01-26 | Ohmi; Tadahiro | Vacuum exhausting apparatus, semiconductor manufacturing apparatus, and vacuum processing method |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03222895A (ja) | 1990-01-26 | 1991-10-01 | Hitachi Koki Co Ltd | ねじ溝真空ポンプ |
DE4314418A1 (de) | 1993-05-03 | 1994-11-10 | Leybold Ag | Reibungsvakuumpumpe mit unterschiedlich gestalteten Pumpenabschnitten |
JP3501524B2 (ja) * | 1994-07-01 | 2004-03-02 | 東京エレクトロン株式会社 | 処理装置の真空排気システム |
JP3699159B2 (ja) | 1995-05-24 | 2005-09-28 | 日本原子力研究所 | 核融合装置の真空排気システム |
JPH09221381A (ja) | 1996-02-08 | 1997-08-26 | Komatsu Electron Metals Co Ltd | 単結晶引上装置の真空排気装置 |
JP3695865B2 (ja) | 1996-10-16 | 2005-09-14 | 株式会社荏原製作所 | 真空排気装置 |
-
2000
- 2000-09-29 US US09/671,745 patent/US6382249B1/en not_active Expired - Fee Related
- 2000-09-29 SG SG200005614A patent/SG97943A1/en unknown
- 2000-10-04 KR KR1020000058255A patent/KR20010050844A/ko not_active Application Discontinuation
- 2000-10-04 DE DE60034854T patent/DE60034854T2/de not_active Expired - Fee Related
- 2000-10-04 EP EP00121683A patent/EP1091019B1/de not_active Expired - Lifetime
- 2000-10-04 TW TW089120621A patent/TW477865B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4487058A (en) * | 1982-12-24 | 1984-12-11 | Balzers Aktiengesellschaft | Method and apparatus for detecting gas leaks |
US5079031A (en) * | 1988-03-22 | 1992-01-07 | Semiconductor Energy Laboratory Co., Ltd. | Apparatus and method for forming thin films |
US5863842A (en) * | 1995-05-25 | 1999-01-26 | Ohmi; Tadahiro | Vacuum exhausting apparatus, semiconductor manufacturing apparatus, and vacuum processing method |
Also Published As
Publication number | Publication date |
---|---|
EP1091019A1 (de) | 2001-04-11 |
DE60034854T2 (de) | 2008-02-14 |
TW477865B (en) | 2002-03-01 |
US6382249B1 (en) | 2002-05-07 |
KR20010050844A (ko) | 2001-06-25 |
DE60034854D1 (de) | 2007-06-28 |
EP1091019B1 (de) | 2007-05-16 |
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