DE60012847D1 - Niedrigprofil-Induktivkomponente - Google Patents

Niedrigprofil-Induktivkomponente

Info

Publication number
DE60012847D1
DE60012847D1 DE60012847T DE60012847T DE60012847D1 DE 60012847 D1 DE60012847 D1 DE 60012847D1 DE 60012847 T DE60012847 T DE 60012847T DE 60012847 T DE60012847 T DE 60012847T DE 60012847 D1 DE60012847 D1 DE 60012847D1
Authority
DE
Germany
Prior art keywords
low profile
inductive component
core
soldering pads
aperture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60012847T
Other languages
English (en)
Other versions
DE60012847T2 (de
Inventor
James G Boytor
Catalin C Girbaci
Helen O Gogny
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coilcraft Inc
Original Assignee
Coilcraft Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23700904&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE60012847(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Coilcraft Inc filed Critical Coilcraft Inc
Publication of DE60012847D1 publication Critical patent/DE60012847D1/de
Application granted granted Critical
Publication of DE60012847T2 publication Critical patent/DE60012847T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/29Terminals; Tapping arrangements for signal inductances
    • H01F27/292Surface mounted devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/02Casings
    • H01F27/027Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/04Fixed inductances of the signal type  with magnetic core
    • H01F17/045Fixed inductances of the signal type  with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Magnetically Actuated Valves (AREA)
  • Magnetic Heads (AREA)
DE60012847T 1999-10-28 2000-10-20 Niedrigprofil-Induktivkomponente Expired - Lifetime DE60012847T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US428904 1999-10-28
US09/428,904 US6285272B1 (en) 1999-10-28 1999-10-28 Low profile inductive component

Publications (2)

Publication Number Publication Date
DE60012847D1 true DE60012847D1 (de) 2004-09-16
DE60012847T2 DE60012847T2 (de) 2005-08-18

Family

ID=23700904

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60012847T Expired - Lifetime DE60012847T2 (de) 1999-10-28 2000-10-20 Niedrigprofil-Induktivkomponente

Country Status (6)

Country Link
US (2) US6285272B1 (de)
EP (2) EP1473744A3 (de)
JP (1) JP2001185422A (de)
KR (1) KR100785445B1 (de)
AT (1) ATE273558T1 (de)
DE (1) DE60012847T2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6717500B2 (en) 2001-04-26 2004-04-06 Coilcraft, Incorporated Surface mountable electronic component
TW482319U (en) * 2001-06-18 2002-04-01 Delta Electronics Inc Surface mounted device and the base structure thereof
US6690255B2 (en) 2002-02-21 2004-02-10 Coilcraft, Incorporated Electronic component
US20030184423A1 (en) * 2002-03-27 2003-10-02 Holdahl Jimmy D. Low profile high current multiple gap inductor assembly
US7002074B2 (en) 2002-03-27 2006-02-21 Tyco Electronics Corporation Self-leaded surface mount component holder
US6847280B2 (en) * 2002-06-04 2005-01-25 Bi Technologies Corporation Shielded inductors
US6914506B2 (en) * 2003-01-21 2005-07-05 Coilcraft, Incorporated Inductive component and method of manufacturing same
JP2006013054A (ja) * 2004-06-24 2006-01-12 Citizen Electronics Co Ltd Smd型コイルパッケージの製造方法
CN101325122B (zh) * 2007-06-15 2013-06-26 库帕技术公司 微型屏蔽磁性部件
US8102237B2 (en) * 2008-06-12 2012-01-24 Power Integrations, Inc. Low profile coil-wound bobbin
JP5126244B2 (ja) * 2010-02-12 2013-01-23 株式会社村田製作所 回路モジュール
DE102011112826B4 (de) * 2011-05-23 2020-06-18 Micro-Epsilon Messtechnik Gmbh & Co. Kg Sensor und Verfahren zur Herstellung des Sensors
US9253910B2 (en) * 2013-01-30 2016-02-02 Texas Instruments Incorporated Circuit assembly
US9576721B2 (en) 2013-03-14 2017-02-21 Sumida Corporation Electronic component and method for manufacturing electronic component
US9087634B2 (en) * 2013-03-14 2015-07-21 Sumida Corporation Method for manufacturing electronic component with coil
DE102014105370A1 (de) * 2014-04-15 2015-10-15 Epcos Ag Kernbauteil
CN105931820A (zh) * 2016-06-15 2016-09-07 无锡东洋电器有限公司 组装式变压器

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US2850707A (en) 1954-04-15 1958-09-02 Sylvania Electric Prod Electromagnetic coils
US2962679A (en) 1955-07-25 1960-11-29 Gen Electric Coaxial core inductive structures
US2976502A (en) 1958-03-13 1961-03-21 Aladdin Ind Inc Inductive devices
US3663913A (en) 1967-12-22 1972-05-16 Tohoku Metal Ind Ltd Core coil having a improved temperature characteristic
US3735214A (en) 1972-01-27 1973-05-22 Coilcraft Inc A header for mounting circuit elements for incorporation in an electric circuit
JPS57170519U (de) * 1981-04-20 1982-10-27
JPS58184815A (ja) 1982-04-22 1983-10-28 Toshiba Corp シユミツト回路
GB2154374A (en) * 1984-02-15 1985-09-04 Standard Telephones Cables Ltd Miniature transformers and inductors
DE3477438D1 (en) 1984-03-23 1989-04-27 Siemens Ag Electronic component, in particular a chip inductance
US4934048A (en) 1985-06-07 1990-06-19 American Precision Industries Inc. Method of making surface mountable electronic device
US4801912A (en) 1985-06-07 1989-01-31 American Precision Industries Inc. Surface mountable electronic device
US4757610A (en) 1986-02-21 1988-07-19 American Precision Industries, Inc. Surface mount network and method of making
US4725806A (en) * 1987-05-21 1988-02-16 Standex International Corporation Contact elements for miniature inductor
JPH0197519U (de) * 1987-12-21 1989-06-29
JP2615151B2 (ja) 1988-08-19 1997-05-28 株式会社村田製作所 チップ型コイル及びその製造方法
US4914804A (en) 1989-03-29 1990-04-10 American Precision Industries Inc. Method of making a surface mountable electronic device
FR2661675B1 (fr) 1990-05-03 1992-07-17 Norsolor Sa Nouveau procede de fabrication du methacrylate de benzyle.
WO1992005568A1 (en) 1990-09-21 1992-04-02 Coilcraft, Inc. Inductive device and method of manufacture
JPH058914U (ja) * 1991-07-16 1993-02-05 テイーデイーケイ株式会社 コイル部品
US5301030A (en) 1991-08-13 1994-04-05 Samsung Electronics Co., Ltd. Optical illumination apparatus for a display unit with efficient light source polarization
US5359313A (en) * 1991-12-10 1994-10-25 Toko, Inc. Step-up transformer
US5363080A (en) 1991-12-27 1994-11-08 Avx Corporation High accuracy surface mount inductor
JP3180262B2 (ja) 1993-08-31 2001-06-25 株式会社トーキン 薄型インダクタ
JPH0794342A (ja) 1993-09-21 1995-04-07 Taiyo Yuden Co Ltd 面実装型コイル
JP3117348B2 (ja) * 1993-12-06 2000-12-11 長野日本無線株式会社 トランス
JPH07288210A (ja) * 1994-04-18 1995-10-31 Tdk Corp 表面実装用インダクタ
JP3497276B2 (ja) * 1994-07-20 2004-02-16 松下電器産業株式会社 インダクタンス素子とその製造方法
US5541567A (en) * 1994-10-17 1996-07-30 International Business Machines Corporation Coaxial vias in an electronic substrate
JP3152088B2 (ja) 1994-11-28 2001-04-03 株式会社村田製作所 コイル部品の製造方法
GB2296387B (en) * 1994-12-02 1999-10-13 Dale Electronics Low profile inductor/transformer component
JPH08167531A (ja) * 1994-12-12 1996-06-25 Tdk Corp 薄型巻線部品
JPH09153418A (ja) * 1995-09-29 1997-06-10 Toko Inc インバータトランス
US5572180A (en) 1995-11-16 1996-11-05 Motorola, Inc. Surface mountable inductor
JPH09190942A (ja) * 1996-01-11 1997-07-22 Murata Mfg Co Ltd チップ型コイルの製造方法
JPH1022138A (ja) 1996-06-28 1998-01-23 Taiyo Yuden Co Ltd 面実装インダクタ
JPH1032670A (ja) 1996-07-12 1998-02-03 Canon Inc 情報処理方法、情報処理装置及び情報処理システム
US5789712A (en) 1996-07-19 1998-08-04 Power Trends, Inc. Toroid holder
US5796324A (en) * 1996-11-12 1998-08-18 Delco Electronics Corporation Surface mount coil assembly
US5831331A (en) 1996-11-22 1998-11-03 Philips Electronics North America Corporation Self-shielding inductor for multi-layer semiconductor integrated circuits
US5804952A (en) 1996-12-05 1998-09-08 Lucent Technologies Inc. Encapsulated package for a power magnetic device and method of manufacture therefor
US5896077A (en) 1996-12-18 1999-04-20 American Precision Industries Inc. Terminal for surface mountable electronic device
US5867891A (en) 1996-12-30 1999-02-09 Ericsson Inc. Continuous method of manufacturing wire wound inductors and wire wound inductors thereby
US5903207A (en) 1996-12-30 1999-05-11 Ericsson Inc. Wire wound inductors
US5877666A (en) 1997-03-12 1999-03-02 Lucent Technologies Inc. Stackable, passively-tunable, cost-reduced inductor
JPH10294221A (ja) 1997-04-18 1998-11-04 Toko Inc インダクタンス素子
JPH1154345A (ja) * 1997-08-04 1999-02-26 Hitachi Ferrite Electronics Ltd トランス
JPH11176659A (ja) * 1997-12-05 1999-07-02 Tdk Corp 低背チップ型コイル素子
KR20010045690A (ko) 1999-11-06 2001-06-05 이석순 표면실장형 인덕턴스 코일과 그 제조방법

Also Published As

Publication number Publication date
ATE273558T1 (de) 2004-08-15
JP2001185422A (ja) 2001-07-06
EP1096516A2 (de) 2001-05-02
EP1473744A3 (de) 2004-11-24
US6285272B1 (en) 2001-09-04
KR100785445B1 (ko) 2007-12-13
EP1096516B1 (de) 2004-08-11
EP1473744A2 (de) 2004-11-03
EP1096516A3 (de) 2002-04-17
USRE39453E1 (en) 2007-01-02
KR20010051244A (ko) 2001-06-25
DE60012847T2 (de) 2005-08-18

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Legal Events

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