EP1096516A3 - Niedrigprofil-Induktivkomponente - Google Patents

Niedrigprofil-Induktivkomponente Download PDF

Info

Publication number
EP1096516A3
EP1096516A3 EP00122307A EP00122307A EP1096516A3 EP 1096516 A3 EP1096516 A3 EP 1096516A3 EP 00122307 A EP00122307 A EP 00122307A EP 00122307 A EP00122307 A EP 00122307A EP 1096516 A3 EP1096516 A3 EP 1096516A3
Authority
EP
European Patent Office
Prior art keywords
low profile
inductive component
core
soldering pads
aperture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP00122307A
Other languages
English (en)
French (fr)
Other versions
EP1096516A2 (de
EP1096516B1 (de
Inventor
James G. Boytor
Catalin C. Girbaci
Helen O. Gogny
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coilcraft Inc
Original Assignee
Coilcraft Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23700904&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP1096516(A3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Coilcraft Inc filed Critical Coilcraft Inc
Priority to EP04018835A priority Critical patent/EP1473744A3/de
Publication of EP1096516A2 publication Critical patent/EP1096516A2/de
Publication of EP1096516A3 publication Critical patent/EP1096516A3/de
Application granted granted Critical
Publication of EP1096516B1 publication Critical patent/EP1096516B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/29Terminals; Tapping arrangements for signal inductances
    • H01F27/292Surface mounted devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/02Casings
    • H01F27/027Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/04Fixed inductances of the signal type  with magnetic core
    • H01F17/045Fixed inductances of the signal type  with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Magnetic Heads (AREA)
  • Magnetically Actuated Valves (AREA)
EP00122307A 1999-10-28 2000-10-20 Niedrigprofil-Induktivkomponente Expired - Lifetime EP1096516B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP04018835A EP1473744A3 (de) 1999-10-28 2000-10-20 Niedrigprofil-Induktivkomponente

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/428,904 US6285272B1 (en) 1999-10-28 1999-10-28 Low profile inductive component
US428904 1999-10-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP04018835A Division EP1473744A3 (de) 1999-10-28 2000-10-20 Niedrigprofil-Induktivkomponente

Publications (3)

Publication Number Publication Date
EP1096516A2 EP1096516A2 (de) 2001-05-02
EP1096516A3 true EP1096516A3 (de) 2002-04-17
EP1096516B1 EP1096516B1 (de) 2004-08-11

Family

ID=23700904

Family Applications (2)

Application Number Title Priority Date Filing Date
EP00122307A Expired - Lifetime EP1096516B1 (de) 1999-10-28 2000-10-20 Niedrigprofil-Induktivkomponente
EP04018835A Withdrawn EP1473744A3 (de) 1999-10-28 2000-10-20 Niedrigprofil-Induktivkomponente

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP04018835A Withdrawn EP1473744A3 (de) 1999-10-28 2000-10-20 Niedrigprofil-Induktivkomponente

Country Status (6)

Country Link
US (2) US6285272B1 (de)
EP (2) EP1096516B1 (de)
JP (1) JP2001185422A (de)
KR (1) KR100785445B1 (de)
AT (1) ATE273558T1 (de)
DE (1) DE60012847T2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6717500B2 (en) 2001-04-26 2004-04-06 Coilcraft, Incorporated Surface mountable electronic component
TW482319U (en) * 2001-06-18 2002-04-01 Delta Electronics Inc Surface mounted device and the base structure thereof
US6690255B2 (en) 2002-02-21 2004-02-10 Coilcraft, Incorporated Electronic component
US20030184423A1 (en) * 2002-03-27 2003-10-02 Holdahl Jimmy D. Low profile high current multiple gap inductor assembly
US7002074B2 (en) 2002-03-27 2006-02-21 Tyco Electronics Corporation Self-leaded surface mount component holder
US6847280B2 (en) * 2002-06-04 2005-01-25 Bi Technologies Corporation Shielded inductors
US6914506B2 (en) 2003-01-21 2005-07-05 Coilcraft, Incorporated Inductive component and method of manufacturing same
JP2006013054A (ja) * 2004-06-24 2006-01-12 Citizen Electronics Co Ltd Smd型コイルパッケージの製造方法
CN101325122B (zh) * 2007-06-15 2013-06-26 库帕技术公司 微型屏蔽磁性部件
US8102237B2 (en) 2008-06-12 2012-01-24 Power Integrations, Inc. Low profile coil-wound bobbin
JP5126244B2 (ja) * 2010-02-12 2013-01-23 株式会社村田製作所 回路モジュール
DE102011112826B4 (de) * 2011-05-23 2020-06-18 Micro-Epsilon Messtechnik Gmbh & Co. Kg Sensor und Verfahren zur Herstellung des Sensors
US9253910B2 (en) * 2013-01-30 2016-02-02 Texas Instruments Incorporated Circuit assembly
US9087634B2 (en) 2013-03-14 2015-07-21 Sumida Corporation Method for manufacturing electronic component with coil
US9576721B2 (en) 2013-03-14 2017-02-21 Sumida Corporation Electronic component and method for manufacturing electronic component
DE102014105370A1 (de) * 2014-04-15 2015-10-15 Epcos Ag Kernbauteil
CN105931820A (zh) * 2016-06-15 2016-09-07 无锡东洋电器有限公司 组装式变压器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5307041A (en) * 1991-07-16 1994-04-26 Tdk Corporation Coil component
JPH07288210A (ja) * 1994-04-18 1995-10-31 Tdk Corp 表面実装用インダクタ
US5760669A (en) * 1994-12-02 1998-06-02 Dale Electronics, Inc. Low profile inductor/transformer component
JPH1154345A (ja) * 1997-08-04 1999-02-26 Hitachi Ferrite Electronics Ltd トランス

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2850707A (en) 1954-04-15 1958-09-02 Sylvania Electric Prod Electromagnetic coils
US2962679A (en) 1955-07-25 1960-11-29 Gen Electric Coaxial core inductive structures
US2976502A (en) 1958-03-13 1961-03-21 Aladdin Ind Inc Inductive devices
US3663913A (en) 1967-12-22 1972-05-16 Tohoku Metal Ind Ltd Core coil having a improved temperature characteristic
US3735214A (en) 1972-01-27 1973-05-22 Coilcraft Inc A header for mounting circuit elements for incorporation in an electric circuit
JPS57170519U (de) * 1981-04-20 1982-10-27
JPS58184815A (ja) 1982-04-22 1983-10-28 Toshiba Corp シユミツト回路
GB2154374A (en) * 1984-02-15 1985-09-04 Standard Telephones Cables Ltd Miniature transformers and inductors
EP0157927B1 (de) 1984-03-23 1989-03-22 Siemens Aktiengesellschaft Elektronisches Bauteil, insbesondere für eine Chip-Induktivität
US4934048A (en) 1985-06-07 1990-06-19 American Precision Industries Inc. Method of making surface mountable electronic device
US4801912A (en) 1985-06-07 1989-01-31 American Precision Industries Inc. Surface mountable electronic device
US4757610A (en) 1986-02-21 1988-07-19 American Precision Industries, Inc. Surface mount network and method of making
US4725806A (en) * 1987-05-21 1988-02-16 Standex International Corporation Contact elements for miniature inductor
JPH0197519U (de) * 1987-12-21 1989-06-29
JP2615151B2 (ja) 1988-08-19 1997-05-28 株式会社村田製作所 チップ型コイル及びその製造方法
US4914804A (en) 1989-03-29 1990-04-10 American Precision Industries Inc. Method of making a surface mountable electronic device
FR2661675B1 (fr) 1990-05-03 1992-07-17 Norsolor Sa Nouveau procede de fabrication du methacrylate de benzyle.
WO1992005568A1 (en) 1990-09-21 1992-04-02 Coilcraft, Inc. Inductive device and method of manufacture
US5301030A (en) 1991-08-13 1994-04-05 Samsung Electronics Co., Ltd. Optical illumination apparatus for a display unit with efficient light source polarization
US5359313A (en) * 1991-12-10 1994-10-25 Toko, Inc. Step-up transformer
US5363080A (en) 1991-12-27 1994-11-08 Avx Corporation High accuracy surface mount inductor
JP3180262B2 (ja) 1993-08-31 2001-06-25 株式会社トーキン 薄型インダクタ
JPH0794342A (ja) 1993-09-21 1995-04-07 Taiyo Yuden Co Ltd 面実装型コイル
JP3117348B2 (ja) * 1993-12-06 2000-12-11 長野日本無線株式会社 トランス
JP3497276B2 (ja) * 1994-07-20 2004-02-16 松下電器産業株式会社 インダクタンス素子とその製造方法
US5541567A (en) * 1994-10-17 1996-07-30 International Business Machines Corporation Coaxial vias in an electronic substrate
JP3152088B2 (ja) 1994-11-28 2001-04-03 株式会社村田製作所 コイル部品の製造方法
JPH08167531A (ja) * 1994-12-12 1996-06-25 Tdk Corp 薄型巻線部品
JPH09153418A (ja) * 1995-09-29 1997-06-10 Toko Inc インバータトランス
US5572180A (en) 1995-11-16 1996-11-05 Motorola, Inc. Surface mountable inductor
JPH09190942A (ja) * 1996-01-11 1997-07-22 Murata Mfg Co Ltd チップ型コイルの製造方法
JPH1022138A (ja) 1996-06-28 1998-01-23 Taiyo Yuden Co Ltd 面実装インダクタ
JPH1032670A (ja) 1996-07-12 1998-02-03 Canon Inc 情報処理方法、情報処理装置及び情報処理システム
US5789712A (en) 1996-07-19 1998-08-04 Power Trends, Inc. Toroid holder
US5796324A (en) * 1996-11-12 1998-08-18 Delco Electronics Corporation Surface mount coil assembly
US5831331A (en) 1996-11-22 1998-11-03 Philips Electronics North America Corporation Self-shielding inductor for multi-layer semiconductor integrated circuits
US5804952A (en) 1996-12-05 1998-09-08 Lucent Technologies Inc. Encapsulated package for a power magnetic device and method of manufacture therefor
US5896077A (en) 1996-12-18 1999-04-20 American Precision Industries Inc. Terminal for surface mountable electronic device
US5867891A (en) 1996-12-30 1999-02-09 Ericsson Inc. Continuous method of manufacturing wire wound inductors and wire wound inductors thereby
US5903207A (en) 1996-12-30 1999-05-11 Ericsson Inc. Wire wound inductors
US5877666A (en) 1997-03-12 1999-03-02 Lucent Technologies Inc. Stackable, passively-tunable, cost-reduced inductor
JPH10294221A (ja) 1997-04-18 1998-11-04 Toko Inc インダクタンス素子
JPH11176659A (ja) * 1997-12-05 1999-07-02 Tdk Corp 低背チップ型コイル素子
KR20010045690A (ko) 1999-11-06 2001-06-05 이석순 표면실장형 인덕턴스 코일과 그 제조방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5307041A (en) * 1991-07-16 1994-04-26 Tdk Corporation Coil component
JPH07288210A (ja) * 1994-04-18 1995-10-31 Tdk Corp 表面実装用インダクタ
US5760669A (en) * 1994-12-02 1998-06-02 Dale Electronics, Inc. Low profile inductor/transformer component
JPH1154345A (ja) * 1997-08-04 1999-02-26 Hitachi Ferrite Electronics Ltd トランス

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 02 29 February 1996 (1996-02-29) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 05 31 May 1999 (1999-05-31) *

Also Published As

Publication number Publication date
EP1096516A2 (de) 2001-05-02
JP2001185422A (ja) 2001-07-06
EP1473744A3 (de) 2004-11-24
ATE273558T1 (de) 2004-08-15
DE60012847D1 (de) 2004-09-16
KR100785445B1 (ko) 2007-12-13
KR20010051244A (ko) 2001-06-25
USRE39453E1 (en) 2007-01-02
EP1096516B1 (de) 2004-08-11
EP1473744A2 (de) 2004-11-03
US6285272B1 (en) 2001-09-04
DE60012847T2 (de) 2005-08-18

Similar Documents

Publication Publication Date Title
EP1473744A3 (de) Niedrigprofil-Induktivkomponente
GB2344463B (en) Back electrode type electronic part and electronic assembly with the same mounted on printed circuit board
HK1027899A1 (en) Circuit board having thereon coupled ceramic capacitors and method for the manufacture thereof.
GB2316237B (en) Printed circuit board with electronic devices mounted thereon
AU3492395A (en) Printed circuit board inductor
ATE522122T1 (de) Gehäuse für stromwandler mit verbessertem transformatorbetrieb
EP0598336A3 (en) Electrical connector for connecting printed circuit boards.
DE69327765D1 (de) Leiterplatte mit darauf montierten elektrischen Bauelementen
IL106325A0 (en) Wire termination block
GB9813668D0 (en) Printed circuit board current sensor
WO2005056734A3 (en) Electronic component
PL335803A1 (en) Printed circuit board mounting
EP0767977A4 (de) Leiterplattenverbinder hoher dichte mit drehbaren federn
WO2004068509A3 (en) Inductive component and method of manufacturing same
DE69211200D1 (de) Elektrische Verbindung zwischen Leiterplatten
GB2316901B (en) Printed circuit board for flow soldering
EP0344793A3 (en) Device for mounting and/or soldering or gluing electronic components, particularly smd-components on printed circuit boards
EP1189247A3 (de) Breitbandige Mikrowellendrossel und oberflächenmontierter Träger
MY107294A (en) Coil arrangement
EP0660460A3 (de) Elektrischer Verbinder für die Montage auf einer gedrückten Schaltung.
EP0140615A3 (de) Elektrischer Zusammenbau und Stiftbuchse für Leiterplatte
GB9909208D0 (en) Connector assembly for printed circuit
GB2274029B (en) Printed circuit board terminal assembly
GB2337862B (en) Printed circuit board
EP0603757A3 (en) Electrical connector for connecting flexible printed circuit board.

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

17P Request for examination filed

Effective date: 20020925

17Q First examination report despatched

Effective date: 20021114

AKX Designation fees paid

Free format text: AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED.

Effective date: 20040811

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20040811

Ref country code: LI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20040811

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20040811

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20040811

Ref country code: BE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20040811

Ref country code: CH

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20040811

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20040811

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REF Corresponds to:

Ref document number: 60012847

Country of ref document: DE

Date of ref document: 20040916

Kind code of ref document: P

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20041020

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20041020

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20041031

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20041111

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20041111

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20041111

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20041122

NLV1 Nl: lapsed or annulled due to failure to fulfill the requirements of art. 29p and 29m of the patents act
REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

ET Fr: translation filed
REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

26N No opposition filed

Effective date: 20050512

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20051028

Year of fee payment: 6

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20070629

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20050111

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20061031

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20081029

Year of fee payment: 9

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20100127

Year of fee payment: 10

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20091020

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 60012847

Country of ref document: DE

Effective date: 20110502

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20110502