DE4434504C2 - Laserschneidemaschine - Google Patents

Laserschneidemaschine

Info

Publication number
DE4434504C2
DE4434504C2 DE4434504A DE4434504A DE4434504C2 DE 4434504 C2 DE4434504 C2 DE 4434504C2 DE 4434504 A DE4434504 A DE 4434504A DE 4434504 A DE4434504 A DE 4434504A DE 4434504 C2 DE4434504 C2 DE 4434504C2
Authority
DE
Germany
Prior art keywords
mirror
axis
wave component
deflecting mirror
cutting machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE4434504A
Other languages
German (de)
English (en)
Other versions
DE4434504A1 (de
Inventor
Kiyoshi Sato
Hajime Osanai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE4434504A1 publication Critical patent/DE4434504A1/de
Application granted granted Critical
Publication of DE4434504C2 publication Critical patent/DE4434504C2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/706—Protective screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
DE4434504A 1993-09-27 1994-09-27 Laserschneidemaschine Expired - Fee Related DE4434504C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24016093 1993-09-27

Publications (2)

Publication Number Publication Date
DE4434504A1 DE4434504A1 (de) 1995-03-30
DE4434504C2 true DE4434504C2 (de) 1998-07-16

Family

ID=17055394

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4434504A Expired - Fee Related DE4434504C2 (de) 1993-09-27 1994-09-27 Laserschneidemaschine

Country Status (5)

Country Link
US (2) US5637243A (US20050103857A1-20050519-P00003.png)
KR (1) KR0131710B1 (US20050103857A1-20050519-P00003.png)
CN (1) CN1106721A (US20050103857A1-20050519-P00003.png)
DE (1) DE4434504C2 (US20050103857A1-20050519-P00003.png)
TW (1) TW245669B (US20050103857A1-20050519-P00003.png)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19738236A1 (de) * 1997-09-02 1999-03-11 Messer Griesheim Schweistechni Laser-Bearbeitungsanlage
DE29722240U1 (de) * 1997-12-17 1998-02-05 Hubert Anton W Schneidvorrichtung
ITTO980225A1 (it) * 1998-03-16 1999-09-16 Prima Ind Spa Macchina operatrice con braccio a sbalzo, in particolare macchina laser.
US6246025B1 (en) 1999-04-30 2001-06-12 W. A. Whitney Co. Insulated slag collection bed for a laser-equipped machine tool
US6127648A (en) 1999-04-30 2000-10-03 W. A. Whitney Co. Laser-equipped machine tool having a retractable scrap removal system
US6392192B1 (en) * 1999-09-15 2002-05-21 W. A. Whitney Co. Real time control of laser beam characteristics in a laser-equipped machine tool
US6128138A (en) * 1999-07-15 2000-10-03 W. A. Whitney Co. Reflective laser collimator
DE19942083C2 (de) * 1999-09-03 2003-12-24 Heinz Peter Brandstetter Werkzeug-, Handhabung- oder Messmaschine
JP3678120B2 (ja) * 2000-06-06 2005-08-03 ウシオ電機株式会社 偏光光照射装置
US6455807B1 (en) 2000-06-26 2002-09-24 W.A. Whitney Co. Method and apparatus for controlling a laser-equipped machine tool to prevent self-burning
US6423928B1 (en) 2000-10-12 2002-07-23 Ase Americas, Inc. Gas assisted laser cutting of thin and fragile materials
US7128266B2 (en) * 2003-11-13 2006-10-31 Metrologic Instruments. Inc. Hand-supportable digital imaging-based bar code symbol reader supporting narrow-area and wide-area modes of illumination and image capture
AU2002311615A1 (en) * 2001-06-19 2003-01-02 Idea Machine Development Compact linear scanner system
US6835912B2 (en) * 2002-05-28 2004-12-28 Trumpf, Inc. Laser cutting machine with two Y-axis drives
FR2849794B1 (fr) * 2003-01-09 2006-05-05 S M T C Latte pour table de machine de decouple laser
US7161114B2 (en) * 2003-10-01 2007-01-09 Trumpf Inc. Laser cutting installation with parts unloading unit
US7045740B2 (en) * 2003-10-01 2006-05-16 Trumpf, Inc. Laser processing installation with integrated loading/unloading of workpieces
US7141758B2 (en) * 2003-10-01 2006-11-28 Trumpf, Inc. Laser processing installation with readily accessible cutting unit
US7511247B2 (en) * 2004-03-22 2009-03-31 Panasonic Corporation Method of controlling hole shape during ultrafast laser machining by manipulating beam polarization
US20060213884A1 (en) * 2005-03-23 2006-09-28 Button International Co., Ltd. Multi-angular laser processing apparatus
JP2007000963A (ja) * 2005-06-23 2007-01-11 Disco Abrasive Syst Ltd チャックテーブル移動機構
PL1742307T3 (pl) * 2005-07-08 2009-01-30 Trumpf Werkzeugmaschinen Gmbh Co Kg Przyrząd wpływający na polaryzację wiązki laserowej
US8168514B2 (en) * 2006-08-24 2012-05-01 Corning Incorporated Laser separation of thin laminated glass substrates for flexible display applications
US20080087652A1 (en) * 2006-10-13 2008-04-17 Great Computer Corporation Device for dissipating hot air accumulated in a laser cutter
SE532695C2 (sv) * 2008-02-25 2010-03-16 Igems Software Ab Verktygshållare
FR2940153B1 (fr) * 2008-12-23 2011-02-25 Commissariat Energie Atomique Embouchure d'avaloir d'aspiration de particules fines et dispositif d'ablation laser d'une couche superficielle d'une paroi comprenant un tel avaloir
DE102009046100B4 (de) * 2009-10-28 2018-01-25 Trumpf Laser- Und Systemtechnik Gmbh Laserbearbeitungsmaschine mit geteiltem Ausleger
DE102010027927B9 (de) * 2010-04-19 2012-05-03 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Laserbearbeitungsmaschine und Verfahren zum Umrüsten derselben
DE102010029791A1 (de) 2010-06-08 2011-12-08 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zur Lasermaterialbearbeitung eines Werkstücks
CN102284791A (zh) * 2010-06-15 2011-12-21 株式会社Lg化学 利用激光的膜片卷切割设备
KR101256954B1 (ko) * 2010-06-15 2013-04-25 (주)엔에스 레이저를 이용한 롤 필름 절단 장치
JP5091287B2 (ja) * 2010-08-06 2012-12-05 ファナック株式会社 加工点にエネルギー又は物質を供給する加工機における加工情報取得装置
JP5645595B2 (ja) 2010-10-25 2014-12-24 株式会社アマダ レーザ加工装置及びレーザ加工方法
CN102554464A (zh) * 2010-12-21 2012-07-11 上海团结普瑞玛激光设备有限公司 激光切割机的全行程光路补偿装置
CN102101217A (zh) * 2011-02-28 2011-06-22 深圳市大族激光科技股份有限公司 一种激光切割装置
CN102179624B (zh) * 2011-05-16 2016-02-10 江苏扬力数控机床有限公司 一种复合驱动技术的数控激光切割机
CN102398115A (zh) * 2011-11-30 2012-04-04 上海埃锡尔数控机床有限公司 一种激光切割机
CN102861995A (zh) * 2012-09-28 2013-01-09 信源电子制品(昆山)有限公司 镭射切割机
CN102848083A (zh) * 2012-10-11 2013-01-02 句容市大华激光科技开发有限公司 一种悬臂式激光切割机
US9266199B2 (en) 2013-01-08 2016-02-23 Fedtech, Inc. Copper-tipped slats for laser cutting
CN103600171B (zh) * 2013-04-28 2015-12-09 宝山钢铁股份有限公司 一种金属板上下料及切割的方法及系统
CN103600170B (zh) * 2013-04-28 2015-08-26 宝山钢铁股份有限公司 一种纵向金属板上下料与切割方法及其系统
CN103223556B (zh) * 2013-05-07 2015-08-12 深圳市木森科技有限公司 一种薄膜切割光路系统
CN103419096B (zh) * 2013-08-07 2016-01-13 桂林电子科技大学 自动确定麻花钻头钻尖初始角度的智能系统
CN103909346B (zh) * 2013-12-26 2015-12-16 广东大族粤铭激光科技股份有限公司 大幅面激光打标装置
CN107438495B (zh) 2015-02-12 2021-02-05 格罗弗治公司 云控制激光制造
US10509390B2 (en) 2015-02-12 2019-12-17 Glowforge Inc. Safety and reliability guarantees for laser fabrication
US11112618B2 (en) 2015-09-03 2021-09-07 Asml Netherlands B.V. Beam splitting apparatus
CN105081563A (zh) * 2015-09-18 2015-11-25 大族激光科技产业集团股份有限公司 一种激光加工设备的光路补偿方法
WO2018098396A1 (en) 2016-11-25 2018-05-31 Glowforge Inc. Multi-user computer-numerically-controlled machine
CN110226137A (zh) 2016-11-25 2019-09-10 格罗弗治公司 借助图像跟踪进行制造
WO2018098397A1 (en) 2016-11-25 2018-05-31 Glowforge Inc. Calibration of computer-numerically-controlled machine
WO2018098399A1 (en) 2016-11-25 2018-05-31 Glowforge Inc. Controlled deceleration of moveable components in a computer numerically controlled machine
WO2018098398A1 (en) 2016-11-25 2018-05-31 Glowforge Inc. Preset optical components in a computer numerically controlled machine
WO2018098393A1 (en) 2016-11-25 2018-05-31 Glowforge Inc. Housing for computer-numerically-controlled machine
WO2018098395A1 (en) 2016-11-25 2018-05-31 Glowforge Inc. Improved engraving in a computer numerically controlled machine
JP7360384B2 (ja) 2017-09-22 2023-10-12 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 位相シフト反射器を有する音響光学システム
IT201900014184A1 (it) 2019-08-06 2021-02-06 Efort Europe S R L Macchina per la lavorazione di precisione di un corpo tridimensionale mediante il taglio o la saldatura laser
KR102243721B1 (ko) * 2019-12-26 2021-04-23 주식회사 에스에프에이 레이저 가공장치 및 이를 구비하는 하향식 기판 에칭장치
US11740608B2 (en) 2020-12-24 2023-08-29 Glowforge, Inc Computer numerically controlled fabrication using projected information
US11698622B2 (en) 2021-03-09 2023-07-11 Glowforge Inc. Previews for computer numerically controlled fabrication

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58134289U (ja) * 1982-03-05 1983-09-09 三菱電機株式会社 レ−ザ−加工機
JPS61242782A (ja) * 1985-04-22 1986-10-29 Mitsubishi Electric Corp レ−ザ加工装置
JPS61296985A (ja) * 1985-06-25 1986-12-27 Mitsubishi Electric Corp レ−ザ加工装置
DE3638678A1 (de) * 1985-07-11 1987-04-16 Coherent Inc Lasersystem
JPH04327394A (ja) * 1991-04-30 1992-11-16 Amada Co Ltd 光移動型レーザ加工機
JPH0577075A (ja) * 1991-09-20 1993-03-30 Amada Co Ltd レーザ加工機
JPH06316894A (ja) * 1993-05-07 1994-11-15 Dai Ichi Kogyo Seiyaku Co Ltd 和紙補強剤

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS607489B2 (ja) * 1979-07-18 1985-02-25 旭光学工業株式会社 レ−ザ−メス装置のカウンタ−バランス機構
JPS58134289A (ja) * 1982-02-03 1983-08-10 Hiroshi Kawada リリ−フバルブ
JPS5961585A (ja) * 1982-09-29 1984-04-07 Toshiba Corp レ−ザ光伝送装置
US4571149A (en) * 1983-04-14 1986-02-18 Westinghouse Electric Corp. General purpose orthogonal axes manipulator system
US4659902A (en) * 1985-04-22 1987-04-21 Westinghouse Electric Corp. Robot laser system
JPS61253193A (ja) * 1985-05-04 1986-11-11 Nec Corp レ−ザ加工装置
US4746202A (en) * 1985-07-11 1988-05-24 Coherent, Inc. Polarization preserving reflector and method
JPS62263889A (ja) * 1986-05-09 1987-11-16 Mitsubishi Electric Corp レ−ザ加工装置
JPS6316894A (ja) * 1986-07-07 1988-01-23 Mitsubishi Electric Corp レ−ザ加工装置
IT1196856B (it) * 1986-12-19 1988-11-25 Fiat Auto Spa Procedimento di lavorazione di grandi stampi in ghisa particolarmente per lo stampaggio di lamiere di veicoli ed attrezzature per la sua realizzazione
JPS63242484A (ja) * 1987-03-31 1988-10-07 Fuji Electric Co Ltd レ−ザ−加工装置
JPS6455076A (en) * 1987-08-26 1989-03-02 Fuji Electric Co Ltd Feeding system using polyphase multiple pwm inverter
JPH0763862B2 (ja) * 1987-09-16 1995-07-12 ファナック株式会社 レーザ加工用ビームベンダ
US4775289A (en) * 1987-09-25 1988-10-04 Regents Of The University Of Minnesota Statically-balanced direct-drive robot arm
GB8810188D0 (en) * 1988-04-29 1988-06-02 Unilever Plc Detergent composition
JPH02104488A (ja) * 1988-10-13 1990-04-17 Mitsubishi Electric Corp レーザ加工機の回転ヘッド
CH677332A5 (en) * 1988-10-28 1991-05-15 Bystronic Laser Ag Laser machining system - has rotary workpiece drive unit pivot mounted at end of table to allow retraction when not in use
JPH02137688A (ja) * 1988-11-18 1990-05-25 Fuji Electric Co Ltd レーザ加工装置
US5128512A (en) * 1990-07-26 1992-07-07 Masahiro Seki Laser beam machining device
EP0483652A1 (en) * 1990-10-31 1992-05-06 Yamazaki Mazak Kabushiki Kaisha Laser machining cell

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58134289U (ja) * 1982-03-05 1983-09-09 三菱電機株式会社 レ−ザ−加工機
JPS61242782A (ja) * 1985-04-22 1986-10-29 Mitsubishi Electric Corp レ−ザ加工装置
JPS61296985A (ja) * 1985-06-25 1986-12-27 Mitsubishi Electric Corp レ−ザ加工装置
DE3638678A1 (de) * 1985-07-11 1987-04-16 Coherent Inc Lasersystem
JPH04327394A (ja) * 1991-04-30 1992-11-16 Amada Co Ltd 光移動型レーザ加工機
JPH0577075A (ja) * 1991-09-20 1993-03-30 Amada Co Ltd レーザ加工機
JPH06316894A (ja) * 1993-05-07 1994-11-15 Dai Ichi Kogyo Seiyaku Co Ltd 和紙補強剤

Also Published As

Publication number Publication date
KR0131710B1 (ko) 1998-04-17
US5756961A (en) 1998-05-26
TW245669B (US20050103857A1-20050519-P00003.png) 1995-04-21
US5637243A (en) 1997-06-10
DE4434504A1 (de) 1995-03-30
KR950008022A (ko) 1995-04-15
CN1106721A (zh) 1995-08-16

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