DE4101318C1 - - Google Patents

Info

Publication number
DE4101318C1
DE4101318C1 DE4101318A DE4101318A DE4101318C1 DE 4101318 C1 DE4101318 C1 DE 4101318C1 DE 4101318 A DE4101318 A DE 4101318A DE 4101318 A DE4101318 A DE 4101318A DE 4101318 C1 DE4101318 C1 DE 4101318C1
Authority
DE
Germany
Prior art keywords
copper
reduction
plastic
oxide
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE4101318A
Other languages
German (de)
English (en)
Inventor
Chung Chieh Taipeh/T'ai-Pei Tw Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
COMPEQ Manufacturing Co Ltd LU CHU TAO YUAN TW
Original Assignee
COMPEQ Manufacturing Co Ltd LU CHU TAO YUAN TW
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by COMPEQ Manufacturing Co Ltd LU CHU TAO YUAN TW filed Critical COMPEQ Manufacturing Co Ltd LU CHU TAO YUAN TW
Application granted granted Critical
Publication of DE4101318C1 publication Critical patent/DE4101318C1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
    • C23C22/63—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/82—After-treatment
    • C23C22/83—Chemical after-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
DE4101318A 1990-05-07 1991-01-18 Expired - Fee Related DE4101318C1 (OSRAM)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/519,741 US5006200A (en) 1990-05-07 1990-05-07 Method of bonding copper and resin

Publications (1)

Publication Number Publication Date
DE4101318C1 true DE4101318C1 (OSRAM) 1992-08-27

Family

ID=24069587

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4101318A Expired - Fee Related DE4101318C1 (OSRAM) 1990-05-07 1991-01-18

Country Status (3)

Country Link
US (1) US5006200A (OSRAM)
DE (1) DE4101318C1 (OSRAM)
GB (1) GB2243577A (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19503186A1 (de) * 1994-02-02 1995-08-10 Hitachi Chemical Co Ltd Chemische Reduzierungslösung für Kupferoxid

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5250363A (en) * 1989-10-13 1993-10-05 Olin Corporation Chromium-zinc anti-tarnish coating for copper foil having a dark color
US5162144A (en) * 1991-08-01 1992-11-10 Motorola, Inc. Process for metallizing substrates using starved-reaction metal-oxide reduction
WO1993021708A1 (en) * 1992-04-20 1993-10-28 Silvio Micali Verifying secret keys in a public-key cryptosystem
US5315658B1 (en) * 1992-04-20 1995-09-12 Silvio Micali Fair cryptosystems and methods of use
USRE36918E (en) * 1992-04-20 2000-10-17 Certco Llc Fair cryptosystems and methods of use
DE4223887A1 (de) * 1992-07-21 1994-01-27 Basf Ag Verfahren zur Herstellung eines Polymer/Metall- oder Polymer/Halbleiter-Verbundes
US5492595A (en) * 1994-04-11 1996-02-20 Electrochemicals, Inc. Method for treating an oxidized copper film
US5900186A (en) * 1995-12-19 1999-05-04 Morton International, Inc. Composition and method for reducing copper oxide to metallic copper
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
US6294220B1 (en) 1999-06-30 2001-09-25 Alpha Metals, Inc. Post-treatment for copper on printed circuit boards
US6537429B2 (en) 2000-12-29 2003-03-25 Lam Research Corporation Diamond coatings on reactor wall and method of manufacturing thereof
AU2002366309A1 (en) * 2001-12-18 2003-06-30 Asahi Kasei Kabushiki Kaisha Metal oxide dispersion
US6716281B2 (en) * 2002-05-10 2004-04-06 Electrochemicals, Inc. Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates
CN103120037B (zh) 2010-07-06 2017-05-10 纳美仕有限公司 处理铜表面以增强对印刷电路板中使用的有机衬底的粘着力的方法
KR101822118B1 (ko) 2010-07-06 2018-01-25 아토테크 도이칠란드 게엠베하 금속 표면의 처리 방법 및 그에 의해 형성된 장치
JP6832581B2 (ja) * 2016-07-15 2021-02-24 ナミックス株式会社 プリント配線板に用いる銅箔の製造方法
CN112533388B (zh) * 2019-09-19 2022-10-18 比亚迪股份有限公司 陶瓷覆铜板及其制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2291592A (en) * 1940-08-10 1942-07-28 Union Switch & Signal Co Electrical rectifier
GB1200367A (en) * 1966-09-13 1970-07-29 Chase Brass & Copper Co Metal laminate and method of producing the same
JPS61176192A (ja) * 1985-01-31 1986-08-07 株式会社日立製作所 銅と樹脂との接着方法
US4702793A (en) * 1986-03-12 1987-10-27 Etd Technology Inc. Method for manufacturing a laminated layered printed wiring board using a sulfuroxy acid and an oxiding treatment of the metallic wiring patterns to insure the integrity of the laminate product
US4775444A (en) * 1987-08-26 1988-10-04 Macdermid, Incorporated Process for fabricating multilayer circuit boards
JPH0713304B2 (ja) * 1987-12-14 1995-02-15 日立化成工業株式会社 銅の表面処理法

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
GB-Z: Derwent-Referat 87-004862/01 (JP 61-2 66 228) *
GB-Z: Derwent-Referat 87-179934/25 (EP 3 21 067) GB-Z: Derwent-Referat 87-310006/44 (JP 62-2 18 124) *
GB-Z: Derwent-Referat 87-267594/38 (JP 62-1 85 884) *
GB-Z: Derwent-Referat 89-109795 (JP 01-1 09 795) *
JP-Z: Pat. Abstr. Japan. C-413, 3.3.1988, Vol. 11/No. 101 (JP 61-2 50 036) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19503186A1 (de) * 1994-02-02 1995-08-10 Hitachi Chemical Co Ltd Chemische Reduzierungslösung für Kupferoxid

Also Published As

Publication number Publication date
US5006200A (en) 1991-04-09
GB2243577A (en) 1991-11-06
GB9010022D0 (en) 1990-06-27

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Legal Events

Date Code Title Description
8100 Publication of patent without earlier publication of application
D1 Grant (no unexamined application published) patent law 81
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee