DE3882557T2 - DRAM-Zelle und Herstellungsverfahren. - Google Patents

DRAM-Zelle und Herstellungsverfahren.

Info

Publication number
DE3882557T2
DE3882557T2 DE88101540T DE3882557T DE3882557T2 DE 3882557 T2 DE3882557 T2 DE 3882557T2 DE 88101540 T DE88101540 T DE 88101540T DE 3882557 T DE3882557 T DE 3882557T DE 3882557 T2 DE3882557 T2 DE 3882557T2
Authority
DE
Germany
Prior art keywords
manufacturing process
dram cell
dram
cell
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE88101540T
Other languages
English (en)
Other versions
DE3882557D1 (de
Inventor
Clarence Wan-Hsin Teng
Robert R Doering
Ashwin H Shah
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of DE3882557D1 publication Critical patent/DE3882557D1/de
Application granted granted Critical
Publication of DE3882557T2 publication Critical patent/DE3882557T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
    • H01L21/2251—Diffusion into or out of group IV semiconductors
    • H01L21/2254—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03—Making the capacitor or connections thereto
    • H10B12/038—Making the capacitor or connections thereto the capacitor being in a trench in the substrate
    • H10B12/0383—Making the capacitor or connections thereto the capacitor being in a trench in the substrate wherein the transistor is vertical
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/39—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor and the transistor being in a same trench
    • H10B12/395—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor and the transistor being in a same trench the transistor being vertical
DE88101540T 1987-03-16 1988-02-03 DRAM-Zelle und Herstellungsverfahren. Expired - Fee Related DE3882557T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/026,356 US4830978A (en) 1987-03-16 1987-03-16 Dram cell and method

Publications (2)

Publication Number Publication Date
DE3882557D1 DE3882557D1 (de) 1993-09-02
DE3882557T2 true DE3882557T2 (de) 1993-12-23

Family

ID=21831344

Family Applications (1)

Application Number Title Priority Date Filing Date
DE88101540T Expired - Fee Related DE3882557T2 (de) 1987-03-16 1988-02-03 DRAM-Zelle und Herstellungsverfahren.

Country Status (6)

Country Link
US (1) US4830978A (de)
EP (1) EP0282716B1 (de)
JP (1) JP2643255B2 (de)
KR (1) KR890013774A (de)
CN (1) CN1011369B (de)
DE (1) DE3882557T2 (de)

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JPH01125858A (ja) * 1987-11-10 1989-05-18 Fujitsu Ltd 半導体装置およびその製造方法
US4942554A (en) * 1987-11-26 1990-07-17 Siemens Aktiengesellschaft Three-dimensional, one-transistor cell arrangement for dynamic semiconductor memories comprising trench capacitor and method for manufacturing same
US5014099A (en) * 1988-05-26 1991-05-07 Texas Instruments Incorporated Dynamic RAM cell with trench capacitor and trench transistor
US5103276A (en) * 1988-06-01 1992-04-07 Texas Instruments Incorporated High performance composed pillar dram cell
US5106776A (en) * 1988-06-01 1992-04-21 Texas Instruments Incorporated Method of making high performance composed pillar dRAM cell
US5104481A (en) * 1988-09-28 1992-04-14 Lasa Industries, Inc. Method for fabricating laser generated I.C. masks
US5346834A (en) * 1988-11-21 1994-09-13 Hitachi, Ltd. Method for manufacturing a semiconductor device and a semiconductor memory device
US5049518A (en) * 1988-12-20 1991-09-17 Matsushita Electric Industrial Co., Ltd. Method of making a trench dram cell
US5028980A (en) * 1988-12-21 1991-07-02 Texas Instruments Incorporated Trench capacitor with expanded area
US4958212A (en) * 1988-12-30 1990-09-18 Texas Instruments Incorporated Trench memory cell
JPH02206175A (ja) * 1989-02-06 1990-08-15 Fuji Electric Co Ltd Ｍｏｓ型半導体装置
WO1990011619A1 (en) * 1989-03-23 1990-10-04 Grumman Aerospace Corporation Single trench mosfet-capacitor cell for analog signal processing
US5053350A (en) * 1989-03-23 1991-10-01 Grumman Aerospace Corporation Method of making trench MOSFET capacitor cell for analog signal processing
US4978634A (en) * 1989-07-25 1990-12-18 Texas Instruments, Incorporated Method of making trench DRAM cell with stacked capacitor and buried lateral contact
US4942137A (en) * 1989-08-14 1990-07-17 Motorola, Inc. Self-aligned trench with selective trench fill
US5064777A (en) * 1990-06-28 1991-11-12 International Business Machines Corporation Fabrication method for a double trench memory cell device
US4988637A (en) * 1990-06-29 1991-01-29 International Business Machines Corp. Method for fabricating a mesa transistor-trench capacitor memory cell structure
US5096849A (en) * 1991-04-29 1992-03-17 International Business Machines Corporation Process for positioning a mask within a concave semiconductor structure
US5198383A (en) * 1991-06-25 1993-03-30 Texas Instruments Incorporated Method of fabricating a composed pillar transistor DRAM Cell
US5156992A (en) * 1991-06-25 1992-10-20 Texas Instruments Incorporated Process for forming poly-sheet pillar transistor DRAM cell
US5214603A (en) * 1991-08-05 1993-05-25 International Business Machines Corporation Folded bitline, ultra-high density dynamic random access memory having access transistors stacked above trench storage capacitors
WO1993017452A1 (en) * 1992-02-28 1993-09-02 Lasa Industries, Inc. Laser generated i.c. mask
US5365097A (en) * 1992-10-05 1994-11-15 International Business Machines Corporation Vertical epitaxial SOI transistor, memory cell and fabrication methods
US5641694A (en) * 1994-12-22 1997-06-24 International Business Machines Corporation Method of fabricating vertical epitaxial SOI transistor
US5529944A (en) * 1995-02-02 1996-06-25 International Business Machines Corporation Method of making cross point four square folded bitline trench DRAM cell
KR100209212B1 (ko) 1996-10-22 1999-07-15 김영환 반도체메모리장치및그제조방법
US5858866A (en) * 1996-11-22 1999-01-12 International Business Machines Corportation Geometrical control of device corner threshold
EP0905783B1 (de) * 1997-09-30 2006-06-14 Infineon Technologies AG Vertikaler Transistor implementiert in einer Speicherzelle mit Grabenkondensator
US6236079B1 (en) 1997-12-02 2001-05-22 Kabushiki Kaisha Toshiba Dynamic semiconductor memory device having a trench capacitor
TW409408B (en) * 1998-03-31 2000-10-21 Siemens Ag Method and apparatus having improved control of a buried strap in trench capacitors
JP3214449B2 (ja) * 1998-06-12 2001-10-02 日本電気株式会社 半導体記憶装置の製造方法
US6828191B1 (en) * 1998-06-15 2004-12-07 Siemens Aktiengesellschaft Trench capacitor with an insulation collar and method for producing a trench capacitor
DE19845058A1 (de) * 1998-09-30 2000-04-13 Siemens Ag DRAM-Zellenanordnung und Verfahren zu deren Herstellung
JP3205306B2 (ja) * 1998-12-08 2001-09-04 松下電器産業株式会社 半導体装置およびその製造方法
US6331459B1 (en) * 1999-02-18 2001-12-18 Infineon Technologies Ag Use of dummy poly spacers and divot fill techniques for DT-aligned processing after STI formation for advanced deep trench capacitor DRAM
US6204140B1 (en) * 1999-03-24 2001-03-20 Infineon Technologies North America Corp. Dynamic random access memory
DE19930748C2 (de) * 1999-07-02 2001-05-17 Infineon Technologies Ag Verfahren zur Herstellung von EEPROM- und DRAM-Grabenspeicherzellbereichen auf einem Chip
US6426252B1 (en) * 1999-10-25 2002-07-30 International Business Machines Corporation Silicon-on-insulator vertical array DRAM cell with self-aligned buried strap
US6288422B1 (en) * 2000-03-31 2001-09-11 International Business Machines Corporation Structure and process for fabricating a 6F2 DRAM cell having vertical MOSFET and large trench capacitance
US6281539B1 (en) * 2000-03-31 2001-08-28 International Business Machines Corporation Structure and process for 6F2 DT cell having vertical MOSFET and large storage capacitance
US6339241B1 (en) 2000-06-23 2002-01-15 International Business Machines Corporation Structure and process for 6F2 trench capacitor DRAM cell with vertical MOSFET and 3F bitline pitch
US6573137B1 (en) 2000-06-23 2003-06-03 International Business Machines Corporation Single sided buried strap
JP2003031686A (ja) * 2001-07-16 2003-01-31 Sony Corp 半導体記憶装置およびその製造方法
EP1296369A1 (de) * 2001-09-20 2003-03-26 Infineon Technologies AG Verfahren zur Herstellung von Gateoxyd für Trench Gate DRAM Zellen
KR100454072B1 (ko) * 2001-12-24 2004-10-26 동부전자 주식회사 반도체소자 및 그 제조방법
DE10208249B4 (de) * 2002-02-26 2006-09-14 Infineon Technologies Ag Halbleiterspeicher mit vertikalem Auswahltransistor
US6894336B2 (en) * 2002-06-12 2005-05-17 Infineon Technologies Ag Vertical access transistor with curved channel
CN1324671C (zh) * 2002-09-06 2007-07-04 旺宏电子股份有限公司 波浪状电容器及其制造方法
DE10321742A1 (de) 2003-05-14 2004-12-09 Infineon Technologies Ag Integrierte Schaltungsanordnung mit Isoliergraben und Feldeffekttransistor sowie Herstellungsverfahren
WO2007027169A2 (en) * 2005-08-30 2007-03-08 University Of South Florida Method of manufacturing silicon topological capacitors
US7232719B2 (en) * 2005-03-28 2007-06-19 Promos Technologies Inc. Memories having a charge storage node at least partially located in a trench in a semiconductor substrate and electrically coupled to a source/drain region formed in the substrate
US7262095B1 (en) * 2005-06-07 2007-08-28 Spansion Llc System and method for reducing process-induced charging
US7435681B2 (en) * 2006-05-09 2008-10-14 Macronix International Co., Ltd. Methods of etching stacks having metal layers and hard mask layers
TWI405246B (zh) * 2009-12-29 2013-08-11 Taiwan Memory Corp 半導體溝槽製程
CN102130063B (zh) * 2010-01-13 2014-03-12 中国科学院微电子研究所 半导体器件及其制作方法
US9129945B2 (en) * 2010-03-24 2015-09-08 Applied Materials, Inc. Formation of liner and barrier for tungsten as gate electrode and as contact plug to reduce resistance and enhance device performance
CN113517288B (zh) * 2020-04-10 2024-03-29 长鑫存储技术有限公司 半导体结构及其形成方法

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DE2706155A1 (de) * 1977-02-14 1978-08-17 Siemens Ag In integrierter technik hergestellter elektronischer speicher
DE2737073C3 (de) * 1977-08-17 1981-09-17 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Herstellen eines Isolierschicht-Feldeffekttransistors für eine Ein-Transistor-Speicherzelle
JPS55133574A (en) * 1979-04-05 1980-10-17 Nec Corp Insulated gate field effect transistor
US4546367A (en) * 1982-06-21 1985-10-08 Eaton Corporation Lateral bidirectional notch FET with extended gate insulator
JPS59181045A (ja) * 1983-03-31 1984-10-15 Toshiba Corp 半導体装置
US4683486A (en) * 1984-09-24 1987-07-28 Texas Instruments Incorporated dRAM cell and array
US4651184A (en) * 1984-08-31 1987-03-17 Texas Instruments Incorporated Dram cell and array
EP0180026B1 (de) * 1984-10-31 1992-01-08 Texas Instruments Incorporated DRAM-Zelle und Verfahren
CN1004734B (zh) * 1984-12-07 1989-07-05 得克萨斯仪器公司 动态随机存取存贮器单元(dram)和生产方法
JPS61150366A (ja) * 1984-12-25 1986-07-09 Nec Corp Ｍｉｓ型メモリ−セル
US4673962A (en) * 1985-03-21 1987-06-16 Texas Instruments Incorporated Vertical DRAM cell and method
JPH0682800B2 (ja) * 1985-04-16 1994-10-19 株式会社東芝 半導体記憶装置
US4704368A (en) * 1985-10-30 1987-11-03 International Business Machines Corporation Method of making trench-incorporated monolithic semiconductor capacitor and high density dynamic memory cells including the capacitor

Also Published As

Publication number Publication date
EP0282716A1 (de) 1988-09-21
JPS63308370A (ja) 1988-12-15
CN88101174A (zh) 1988-12-07
JP2643255B2 (ja) 1997-08-20
KR890013774A (ko) 1989-09-26
DE3882557D1 (de) 1993-09-02
CN1011369B (zh) 1991-01-23
EP0282716B1 (de) 1993-07-28
US4830978A (en) 1989-05-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee