DE3852124D1 - Verfahren zum Herstellen einer Halbleiteranordnung vom harzumhüllten Typ. - Google Patents
Verfahren zum Herstellen einer Halbleiteranordnung vom harzumhüllten Typ.Info
- Publication number
- DE3852124D1 DE3852124D1 DE3852124T DE3852124T DE3852124D1 DE 3852124 D1 DE3852124 D1 DE 3852124D1 DE 3852124 T DE3852124 T DE 3852124T DE 3852124 T DE3852124 T DE 3852124T DE 3852124 D1 DE3852124 D1 DE 3852124D1
- Authority
- DE
- Germany
- Prior art keywords
- resin
- manufacturing
- semiconductor device
- type semiconductor
- coated type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62232945A JPH0815165B2 (ja) | 1987-09-17 | 1987-09-17 | 樹脂絶縁型半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3852124D1 true DE3852124D1 (de) | 1994-12-22 |
DE3852124T2 DE3852124T2 (de) | 1995-03-23 |
Family
ID=16947315
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3852124T Expired - Fee Related DE3852124T2 (de) | 1987-09-17 | 1988-09-16 | Verfahren zum Herstellen einer Halbleiteranordnung vom harzumhüllten Typ. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5038200A (de) |
EP (1) | EP0307946B1 (de) |
JP (1) | JPH0815165B2 (de) |
KR (1) | KR910009419B1 (de) |
DE (1) | DE3852124T2 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5309027A (en) * | 1992-06-15 | 1994-05-03 | Motorola, Inc. | Encapsulated semiconductor package having protectant circular insulators |
DE9311223U1 (de) * | 1993-07-27 | 1993-09-09 | Siemens AG, 80333 München | Mikrosensor mit Steckeranschluß |
TW270213B (de) * | 1993-12-08 | 1996-02-11 | Matsushita Electric Ind Co Ltd | |
US5886400A (en) * | 1995-08-31 | 1999-03-23 | Motorola, Inc. | Semiconductor device having an insulating layer and method for making |
JP3344684B2 (ja) * | 1996-05-20 | 2002-11-11 | 株式会社村田製作所 | 電子部品 |
US6476481B2 (en) * | 1998-05-05 | 2002-11-05 | International Rectifier Corporation | High current capacity semiconductor device package and lead frame with large area connection posts and modified outline |
JP3833464B2 (ja) * | 2000-11-01 | 2006-10-11 | 株式会社三井ハイテック | リードフレーム |
US7466016B2 (en) * | 2007-04-07 | 2008-12-16 | Kevin Yang | Bent lead transistor |
EP2051298B1 (de) * | 2007-10-18 | 2012-09-19 | Sencio B.V. | Gehäuse mit integrierter Schaltung |
US7839004B2 (en) * | 2008-07-30 | 2010-11-23 | Sanyo Electric Co., Ltd. | Semiconductor device, semiconductor module, method for manufacturing semiconductor device, and lead frame |
JP2010103411A (ja) * | 2008-10-27 | 2010-05-06 | Shindengen Electric Mfg Co Ltd | 半導体装置及びその製造方法 |
TWI425907B (zh) * | 2010-09-21 | 2014-02-01 | Delta Electronics Inc | 電子元件和散熱裝置之組合結構及其絕緣元件 |
CN104247012B (zh) * | 2012-10-01 | 2017-08-25 | 富士电机株式会社 | 半导体装置及其制造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5946052A (ja) * | 1982-09-08 | 1984-03-15 | Nec Corp | 樹脂封止絶縁型半導体装置 |
JPS59130449A (ja) * | 1983-01-17 | 1984-07-27 | Nec Corp | 絶縁型半導体素子用リードフレーム |
JPS6132434A (ja) * | 1984-07-24 | 1986-02-15 | Sanken Electric Co Ltd | 樹脂封止型半導体装置の製造方法 |
JPS6163849U (de) * | 1984-09-29 | 1986-04-30 | ||
JPS6191937A (ja) * | 1984-10-12 | 1986-05-10 | Sanken Electric Co Ltd | 樹脂封止型半導体装置の製造方法 |
JPS61208242A (ja) * | 1985-03-13 | 1986-09-16 | Hitachi Ltd | 半導体装置 |
-
1987
- 1987-09-17 JP JP62232945A patent/JPH0815165B2/ja not_active Expired - Fee Related
-
1988
- 1988-09-16 EP EP88115240A patent/EP0307946B1/de not_active Expired - Lifetime
- 1988-09-16 DE DE3852124T patent/DE3852124T2/de not_active Expired - Fee Related
- 1988-09-16 KR KR1019880011977A patent/KR910009419B1/ko not_active IP Right Cessation
-
1990
- 1990-11-28 US US07/618,591 patent/US5038200A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0307946A3 (en) | 1989-07-05 |
KR910009419B1 (ko) | 1991-11-15 |
EP0307946B1 (de) | 1994-11-17 |
JPS6474746A (en) | 1989-03-20 |
JPH0815165B2 (ja) | 1996-02-14 |
DE3852124T2 (de) | 1995-03-23 |
US5038200A (en) | 1991-08-06 |
EP0307946A2 (de) | 1989-03-22 |
KR890005860A (ko) | 1989-05-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |