DE3781597D1 - Programmierbares verbindungselement niedriger impedanz. - Google Patents

Programmierbares verbindungselement niedriger impedanz.

Info

Publication number
DE3781597D1
DE3781597D1 DE8787303971T DE3781597T DE3781597D1 DE 3781597 D1 DE3781597 D1 DE 3781597D1 DE 8787303971 T DE8787303971 T DE 8787303971T DE 3781597 T DE3781597 T DE 3781597T DE 3781597 D1 DE3781597 D1 DE 3781597D1
Authority
DE
Germany
Prior art keywords
conductive layer
insulating layer
low impedance
programmable low
over
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8787303971T
Other languages
English (en)
Other versions
DE3781597T2 (de
Inventor
Amr M Mohsen
John L Mccollum
Esmat Z Hamdy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Microsemi SoC Corp
Original Assignee
Actel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Actel Corp filed Critical Actel Corp
Publication of DE3781597D1 publication Critical patent/DE3781597D1/de
Application granted granted Critical
Publication of DE3781597T2 publication Critical patent/DE3781597T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B20/00—Read-only memory [ROM] devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5252—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising anti-fuses, i.e. connections having their state changed from non-conductive to conductive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
  • Read Only Memory (AREA)
  • Networks Using Active Elements (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Logic Circuits (AREA)
DE8787303971T 1986-05-09 1987-05-01 Programmierbares verbindungselement niedriger impedanz. Expired - Lifetime DE3781597T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/861,519 US4823181A (en) 1986-05-09 1986-05-09 Programmable low impedance anti-fuse element

Publications (2)

Publication Number Publication Date
DE3781597D1 true DE3781597D1 (de) 1992-10-15
DE3781597T2 DE3781597T2 (de) 1993-01-07

Family

ID=25336027

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787303971T Expired - Lifetime DE3781597T2 (de) 1986-05-09 1987-05-01 Programmierbares verbindungselement niedriger impedanz.

Country Status (6)

Country Link
US (1) US4823181A (de)
EP (1) EP0250078B1 (de)
JP (1) JP2571785B2 (de)
KR (1) KR0162073B1 (de)
AT (1) ATE80499T1 (de)
DE (1) DE3781597T2 (de)

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* Cited by examiner, † Cited by third party
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US4823181A (en) 1989-04-18
EP0250078B1 (de) 1992-09-09
EP0250078A3 (en) 1988-09-07
JPS62281365A (ja) 1987-12-07
KR870011683A (ko) 1987-12-26
KR0162073B1 (ko) 1998-12-01
ATE80499T1 (de) 1992-09-15
DE3781597T2 (de) 1993-01-07
EP0250078A2 (de) 1987-12-23
JP2571785B2 (ja) 1997-01-16

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