DE3741436A1 - Waermebehandlungsofen - Google Patents

Waermebehandlungsofen

Info

Publication number
DE3741436A1
DE3741436A1 DE19873741436 DE3741436A DE3741436A1 DE 3741436 A1 DE3741436 A1 DE 3741436A1 DE 19873741436 DE19873741436 DE 19873741436 DE 3741436 A DE3741436 A DE 3741436A DE 3741436 A1 DE3741436 A1 DE 3741436A1
Authority
DE
Germany
Prior art keywords
substrate
heat treatment
thermocouple
connections
movable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19873741436
Other languages
German (de)
English (en)
Other versions
DE3741436C2 (https=
Inventor
Kenichi Terauchi
Takeo Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Publication of DE3741436A1 publication Critical patent/DE3741436A1/de
Application granted granted Critical
Publication of DE3741436C2 publication Critical patent/DE3741436C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any of groups F27B1/00 - F27B15/00
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Chamber type furnaces specially adapted for treating semiconductor wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Control Of Resistance Heating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE19873741436 1986-12-11 1987-12-08 Waermebehandlungsofen Granted DE3741436A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61296131A JPH0693438B2 (ja) 1986-12-11 1986-12-11 基板温度測定装置

Publications (2)

Publication Number Publication Date
DE3741436A1 true DE3741436A1 (de) 1988-06-23
DE3741436C2 DE3741436C2 (https=) 1989-12-21

Family

ID=17829543

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19873741436 Granted DE3741436A1 (de) 1986-12-11 1987-12-08 Waermebehandlungsofen

Country Status (4)

Country Link
US (1) US4820907A (https=)
JP (1) JPH0693438B2 (https=)
KR (1) KR920000677B1 (https=)
DE (1) DE3741436A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0710727A3 (de) * 1994-09-06 1996-11-06 Ald Aichelin Gmbh Verfahren und Vorrichtung zum Wärmebehandeln metallischer Werkstücke
DE19547601A1 (de) * 1995-12-20 1997-06-26 Sel Alcatel Ag Vorrichtung zum Sintern von porösen Schichten

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01185437A (ja) * 1988-01-20 1989-07-25 Horiba Ltd 真空チャンバの試料加熱装置
JPH0623935B2 (ja) * 1988-02-09 1994-03-30 大日本スクリーン製造株式会社 再現性を高めた熱処理制御方法
DE4007123A1 (de) * 1990-03-07 1991-09-12 Siegfried Dipl Ing Dr Straemke Plasma-behandlungsvorrichtung
JP2704309B2 (ja) * 1990-06-12 1998-01-26 大日本スクリーン製造株式会社 基板処理装置及び基板の熱処理方法
JP2780866B2 (ja) * 1990-10-11 1998-07-30 大日本スクリーン製造 株式会社 光照射加熱基板の温度測定装置
CA2179315A1 (en) * 1993-12-17 1995-06-22 Roger S. Cubicciotti Nucleotide-directed assembly of bimolecular and multimolecular drugs and devices
US5471033A (en) * 1994-04-15 1995-11-28 International Business Machines Corporation Process and apparatus for contamination-free processing of semiconductor parts
US5881208A (en) * 1995-12-20 1999-03-09 Sematech, Inc. Heater and temperature sensor array for rapid thermal processing thermal core
US5820266A (en) * 1996-12-10 1998-10-13 Fedak; Tibor J. Travelling thermocouple method & apparatus
JP4739544B2 (ja) * 2001-02-21 2011-08-03 株式会社アルバック インライン式熱処理装置用温度測定装置
KR101237782B1 (ko) * 2004-07-10 2013-02-28 온웨이퍼 테크놀로지즈 인코포레이티드 왜곡이 적은 파라미터측정을 위한 방법 및 장치
JP2006352145A (ja) * 2006-07-06 2006-12-28 Hitachi Kokusai Electric Inc 熱処理装置およびその装置に用いられる温度検出ユニット、半導体装置の製造方法
JP2008139067A (ja) * 2006-11-30 2008-06-19 Dainippon Screen Mfg Co Ltd 温度測定用基板および温度測定システム
PL235229B1 (pl) * 2017-09-29 2020-06-15 Amp Spolka Z Ograniczona Odpowiedzialnoscia Przyłącze termoparowe do pieca próżniowego
TW202601750A (zh) * 2023-12-12 2026-01-01 新加坡商尼得科美亞科技有限公司 測量夾具

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2969471A (en) * 1959-10-30 1961-01-24 Wilhelm A Schneider Crystal temperature control device
US3883715A (en) * 1973-12-03 1975-05-13 Sybron Corp Controlled environment module
JPS5925142B2 (ja) * 1977-01-19 1984-06-14 株式会社日立製作所 熱処理装置
US4586006A (en) * 1984-06-25 1986-04-29 Frequency And Time Systems, Inc. Crystal oscillator assembly
US4593258A (en) * 1985-02-13 1986-06-03 Gerald Block Energy conserving apparatus for regulating temperature of monitored device
JPH0741151Y2 (ja) * 1985-02-19 1995-09-20 東芝機械株式会社 マスクガラス等の温度測定機構
US4684783A (en) * 1985-11-06 1987-08-04 Sawtek, Inc. Environmental control apparatus for electrical circuit elements
JP3090787B2 (ja) * 1992-07-16 2000-09-25 富士通株式会社 半導体装置の製造方法
JPH06267813A (ja) * 1993-03-10 1994-09-22 Hitachi Ltd 露光パターン形成装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
RUGE, I.: Halbleiter-Technologie, Springer-Verlag,Heidelberg 1975, S. 79, Abb. 3.24 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0710727A3 (de) * 1994-09-06 1996-11-06 Ald Aichelin Gmbh Verfahren und Vorrichtung zum Wärmebehandeln metallischer Werkstücke
DE19547601A1 (de) * 1995-12-20 1997-06-26 Sel Alcatel Ag Vorrichtung zum Sintern von porösen Schichten

Also Published As

Publication number Publication date
JPH0693438B2 (ja) 1994-11-16
US4820907A (en) 1989-04-11
KR880008425A (ko) 1988-08-31
JPS63148623A (ja) 1988-06-21
DE3741436C2 (https=) 1989-12-21
KR920000677B1 (ko) 1992-01-20

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee