DE3627654C2 - Elektrisch-anisotropes Haftmittel - Google Patents

Elektrisch-anisotropes Haftmittel

Info

Publication number
DE3627654C2
DE3627654C2 DE3627654A DE3627654A DE3627654C2 DE 3627654 C2 DE3627654 C2 DE 3627654C2 DE 3627654 A DE3627654 A DE 3627654A DE 3627654 A DE3627654 A DE 3627654A DE 3627654 C2 DE3627654 C2 DE 3627654C2
Authority
DE
Germany
Prior art keywords
adhesive
thermoplastic elastomer
electrical
anisotropic adhesive
styrene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3627654A
Other languages
German (de)
English (en)
Other versions
DE3627654A1 (de
Inventor
Toshiyuki Kawaguchi
Hideki Suzuki
Tsuneo Usuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Publication of DE3627654A1 publication Critical patent/DE3627654A1/de
Application granted granted Critical
Publication of DE3627654C2 publication Critical patent/DE3627654C2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/24—Graft or block copolymers according to groups C08L51/00, C08L53/00 or C08L55/02; Derivatives thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE3627654A 1985-08-16 1986-08-14 Elektrisch-anisotropes Haftmittel Expired - Lifetime DE3627654C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60180350A JPS6241277A (ja) 1985-08-16 1985-08-16 異方導電性接着剤

Publications (2)

Publication Number Publication Date
DE3627654A1 DE3627654A1 (de) 1987-04-09
DE3627654C2 true DE3627654C2 (de) 1995-01-05

Family

ID=16081693

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3627654A Expired - Lifetime DE3627654C2 (de) 1985-08-16 1986-08-14 Elektrisch-anisotropes Haftmittel

Country Status (4)

Country Link
US (1) US4701279A (https=)
JP (1) JPS6241277A (https=)
DE (1) DE3627654C2 (https=)
GB (1) GB2179357B (https=)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6386781A (ja) * 1986-09-30 1988-04-18 Sekisui Chem Co Ltd 異方導電性接着シ−ト
US5296074A (en) * 1987-03-30 1994-03-22 E. I. Du Pont De Nemours And Company Method for bonding small electronic components
JPH0291360U (https=) * 1988-12-29 1990-07-19
JPH02310566A (ja) * 1989-05-26 1990-12-26 Canon Inc 電子写真用弾性部材
US5180523A (en) * 1989-11-14 1993-01-19 Poly-Flex Circuits, Inc. Electrically conductive cement containing agglomerate, flake and powder metal fillers
US5334330A (en) * 1990-03-30 1994-08-02 The Whitaker Corporation Anisotropically electrically conductive composition with thermal dissipation capabilities
JPH048769A (ja) * 1990-04-27 1992-01-13 Dai Ichi Kogyo Seiyaku Co Ltd 帯電防止性及びイオン導伝性樹脂組成物
JPH04245109A (ja) * 1991-01-31 1992-09-01 Shin Etsu Chem Co Ltd 異方性導電膜用組成物
JP2730357B2 (ja) * 1991-11-18 1998-03-25 松下電器産業株式会社 電子部品実装接続体およびその製造方法
US5286417A (en) * 1991-12-06 1994-02-15 International Business Machines Corporation Method and composition for making mechanical and electrical contact
US5340640A (en) * 1992-03-25 1994-08-23 Molex Incorporated Conductive ink for use with printed circuit modules
SE470081B (sv) * 1992-05-19 1993-11-01 Gustavsson Magnus Peter M Elektriskt uppvärmt plagg eller liknande
US5620795A (en) * 1993-11-10 1997-04-15 Minnesota Mining And Manufacturing Company Adhesives containing electrically conductive agents
US5439541A (en) * 1994-02-08 1995-08-08 The Board Of Trustees Of The University Of Illinois Method for producing and using crosslinked copolyesters
US5637176A (en) * 1994-06-16 1997-06-10 Fry's Metals, Inc. Methods for producing ordered Z-axis adhesive materials, materials so produced, and devices, incorporating such materials
US5531942A (en) * 1994-06-16 1996-07-02 Fry's Metals, Inc. Method of making electroconductive adhesive particles for Z-axis application
US20010028953A1 (en) * 1998-11-16 2001-10-11 3M Innovative Properties Company Adhesive compositions and methods of use
WO1997003143A1 (en) 1995-07-10 1997-01-30 Minnesota Mining And Manufacturing Company Screen printable adhesive compositions
DE19528247A1 (de) * 1995-08-01 1997-02-06 Licentia Gmbh Flüssigkristallanzeige und Verfahren zu ihrer Herstellung
FI118127B (fi) * 1999-03-04 2007-07-13 Valtion Teknillinen Sähköä johtava termoplastinen elastomeeri ja siitä valmistettu tuote
KR100925361B1 (ko) 1999-10-22 2009-11-09 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 저온 경화형 이방성 도전 접속재료
US20050208278A1 (en) * 2001-08-22 2005-09-22 Landi Vincent R Method for improving bonding of circuit substrates to metal and articles formed thereby
WO2003020000A1 (en) * 2001-08-22 2003-03-06 World Properties Inc. Method for improving bonding of circuit substrates to metal and articles formed thereby
JP2004051755A (ja) * 2002-07-18 2004-02-19 Ricoh Co Ltd 弾性導電樹脂及び弾性導電接合構造
AU2003269917A1 (en) * 2002-07-24 2004-02-09 Eggs In The Pipeline, Llc. Attachable modular electronic systems
US6981879B2 (en) * 2004-03-18 2006-01-03 International Business Machines Corporation Land grid array (LGA) interposer with adhesive-retained contacts and method of manufacture
US20070227627A1 (en) * 2006-03-30 2007-10-04 Daewoong Suh Solder composition having dispersoid particles for increased creep resistance
US20100044088A1 (en) * 2006-07-05 2010-02-25 Ablestik (Japan) Co. Ltd. Conductive adhesive
US20080081879A1 (en) * 2006-09-29 2008-04-03 Kim Balfour Crosslinked block copolymer composition and method
US20080081874A1 (en) * 2006-09-29 2008-04-03 Kim Balfour Poly(arylene ether) composition, method, and article
US20100221533A1 (en) * 2007-10-15 2010-09-02 Hitachi Chemical Company, Ltd. Circuit connecting adhesive film and circuit connecting structure
KR101330018B1 (ko) * 2009-02-16 2013-11-15 가부시키가이샤 무라타 세이사쿠쇼 도전성 수지 조성물, 그것을 사용한 전자부품의 제조방법, 접합방법, 접합구조, 및 전자부품
CN104663007B (zh) * 2012-09-20 2017-10-24 株式会社可乐丽 电路基板及其制造方法
JP2018522954A (ja) 2015-05-01 2018-08-16 ロード コーポレイション ゴム接合用接着剤
CN112852342B (zh) * 2021-01-08 2021-09-28 深圳市维美德材料科技有限公司 一种用于5g频谱的超软导电胶及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3567607A (en) * 1966-02-18 1971-03-02 Dow Chemical Co Irradiated metal-polymer compositions
GB1202891A (en) * 1967-01-06 1970-08-19 Glass Sealer Company Ltd Articles made from synthetic rubbers
US3862056A (en) * 1967-12-15 1975-01-21 Allied Chem Semiconductor polymer compositions comprising a grafted block copolymer of synthetic rubber and polyolefin and carbon black
US3806558A (en) * 1971-08-12 1974-04-23 Uniroyal Inc Dynamically partially cured thermoplastic blend of monoolefin copolymer rubber and polyolefin plastic
JPS492324A (https=) * 1972-04-22 1974-01-10
US4042534A (en) * 1974-02-28 1977-08-16 Andrianov Kuzma A Conducting anisotropic polymer material
JPS5953281B2 (ja) * 1974-04-08 1984-12-24 三井東圧化学株式会社 硬化方法
JPS55774A (en) * 1979-05-01 1980-01-07 Seikosha Co Ltd Electrically conductive adhesive part and its use
JPS565840A (en) * 1979-06-28 1981-01-21 Shin Etsu Polymer Co Ltd Anisotropic pressure electrically-conductive elastomer molded article
JPS5964685A (ja) * 1982-10-05 1984-04-12 Shin Etsu Polymer Co Ltd 異方導電熱接着性フイルム
US4592861A (en) * 1984-06-08 1986-06-03 Uniroyal Chemical Company, Inc. Antistatic thermoplastic composition comprising a graft polymer, halogenated thermoplastic polymer and conductive carbon black
JPS6147760A (ja) * 1984-08-16 1986-03-08 Shin Etsu Polymer Co Ltd 異方導電接着剤

Also Published As

Publication number Publication date
GB2179357A (en) 1987-03-04
JPH0410916B2 (https=) 1992-02-26
DE3627654A1 (de) 1987-04-09
JPS6241277A (ja) 1987-02-23
US4701279A (en) 1987-10-20
GB2179357B (en) 1989-01-18
GB8619454D0 (en) 1986-09-17

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Legal Events

Date Code Title Description
8125 Change of the main classification

Ipc: C09J 9/02

8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition