DE3587732D1 - Verfahren zum Vorbereiten von numerischen Steuerungsdaten für das Einsetzen von Bauelementen. - Google Patents

Verfahren zum Vorbereiten von numerischen Steuerungsdaten für das Einsetzen von Bauelementen.

Info

Publication number
DE3587732D1
DE3587732D1 DE85113005T DE3587732T DE3587732D1 DE 3587732 D1 DE3587732 D1 DE 3587732D1 DE 85113005 T DE85113005 T DE 85113005T DE 3587732 T DE3587732 T DE 3587732T DE 3587732 D1 DE3587732 D1 DE 3587732D1
Authority
DE
Germany
Prior art keywords
components
control data
numerical control
preparing numerical
preparing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE85113005T
Other languages
English (en)
Other versions
DE3587732T2 (de
Inventor
Yoshinao Arai
Shino Takahashi
Eigo Oikawa
Shigeru Hitachi Hachimany Sato
Hideaki Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE3587732D1 publication Critical patent/DE3587732D1/de
Publication of DE3587732T2 publication Critical patent/DE3587732T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/4097—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by using design data to control NC machines, e.g. CAD/CAM
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H05K13/0853—Determination of transport trajectories inside mounting machines
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31047—Display image of finished workpiece on screen, show how, where to mount next part
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31068—Relative positioning of assembled parts with small geometric deviations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y10T29/53043—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor including means to divert defective work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
DE3587732T 1985-02-22 1985-10-14 Verfahren zum Vorbereiten von numerischen Steuerungsdaten für das Einsetzen von Bauelementen. Expired - Fee Related DE3587732T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60032875A JPH0668696B2 (ja) 1985-02-22 1985-02-22 挿入機用ｎｃデータ作成方法

Publications (2)

Publication Number Publication Date
DE3587732D1 true DE3587732D1 (de) 1994-03-03
DE3587732T2 DE3587732T2 (de) 1994-05-19

Family

ID=12371047

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3587732T Expired - Fee Related DE3587732T2 (de) 1985-02-22 1985-10-14 Verfahren zum Vorbereiten von numerischen Steuerungsdaten für das Einsetzen von Bauelementen.

Country Status (5)

Country Link
US (1) US4706187A (de)
EP (1) EP0192822B1 (de)
JP (1) JPH0668696B2 (de)
KR (1) KR900004251B1 (de)
DE (1) DE3587732T2 (de)

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JPS62144392A (ja) * 1985-12-19 1987-06-27 ティーディーケイ株式会社 電子部品実装方法
AU7728187A (en) * 1986-09-12 1988-03-17 Digital Equipment Corporation Cad of logic circuits: rule structure for inserting new elements
JPH0833764B2 (ja) * 1987-02-19 1996-03-29 横河電機株式会社 Ｎｃ実装機の実装経路の決定方法
JPH0734165B2 (ja) * 1987-04-07 1995-04-12 株式会社日立製作所 プリント板組立ｎｃデータ編集方法
JP2695798B2 (ja) * 1987-10-14 1998-01-14 株式会社日立製作所 面付混載基板用ｎｃデータ作成方法
US4924419A (en) * 1988-05-24 1990-05-08 Eastman Kodak Company System and a method for detecting a malfunction in the operation of a parts assembly machine
JP2776860B2 (ja) * 1989-01-11 1998-07-16 株式会社日立製作所 電子部品装着装置及び装着方法
US5313401A (en) * 1989-07-17 1994-05-17 Canon Kabushiki Kaisha Mounting system including a plurality of hand mechanisms for picking up, moving and mounting works on an object board
JPH03100807A (ja) * 1989-09-14 1991-04-25 Hitachi Ltd 対話型実装機ｎｃデータ作成装置
DE3936079A1 (de) * 1989-10-30 1991-05-02 Truetzschler & Co Verfahren und vorrichtung zum oeffnen von ballen aus fasermaterial, z. b. baumwolle, chemiefasern u. dgl.
JP2619540B2 (ja) * 1989-11-07 1997-06-11 富士通株式会社 自動組立機の部品実装順序決定処理方法
JP3092809B2 (ja) * 1989-12-21 2000-09-25 株式会社日立製作所 検査方法、並びに検査プログラムデータの自動作成機能を有する検査装置
US5258915A (en) * 1990-09-28 1993-11-02 Hewlett-Packard Company System and method for optimum operation assignments in printed circuit board manufacturing
US5170554A (en) * 1990-09-28 1992-12-15 Hewlett-Packard Company High mix printed circuit assembly technique
JPH05304396A (ja) * 1991-07-12 1993-11-16 Canon Inc 部品の実装順序の決定方法及びその装置
JP2974183B2 (ja) * 1991-11-07 1999-11-08 オークマ株式会社 数値制御工作機械における干渉チェック装置
US5339248A (en) * 1992-08-27 1994-08-16 Matsushita Electric Industrial Co., Ltd. Apparatus for mounting electronic component on substrate
US5283943A (en) * 1992-08-31 1994-02-08 Kermit Aguayo Automated assembly apparatus
DE19502434A1 (de) * 1994-04-29 1995-11-02 Hewlett Packard Co System und Verfahren zur inkrementalen Herstellung von Schaltungsplatinen
JP3449789B2 (ja) * 1994-07-14 2003-09-22 松下電器産業株式会社 部品実装方法
US5933349A (en) * 1995-12-29 1999-08-03 Compaq Computer Corporation Component placement
KR980007918A (ko) * 1996-06-29 1998-03-30 배순훈 자삽 경로 작성장치 및 그 자삽 경로생성 방법
MX9709038A (es) * 1996-11-25 1998-08-30 Samsung Electronics Co Ltd Sistema y metodo de produccion de montajes de tableros de circuitos impresos.
KR19980039100A (ko) * 1996-11-27 1998-08-17 배순훈 부품의 클린칭 방향을 이용한 미삽 검사장치 및 방법
JP3422645B2 (ja) * 1997-02-14 2003-06-30 富士通株式会社 回路素子配置装置
KR100287822B1 (ko) * 1998-06-27 2001-04-16 전주범 부품 삽입기를 위한 자동 경로 생성 옵션의 설정방법
EP1081998B1 (de) * 1999-09-03 2005-11-30 Matsushita Electric Industrial Co., Ltd. Bauteilen-bestückungsverfahren und Einrichtung
JP3609315B2 (ja) * 2000-02-28 2005-01-12 富士通株式会社 プリント配線板の製造データ作成システム、及びプリント配線板の製造システム
EP1350419B1 (de) * 2000-08-04 2013-02-20 Panasonic Corporation Verfahren zur optimierung der bestückungsfolge, vorichtung dafür und bestücker
US6718630B2 (en) * 2000-09-18 2004-04-13 Matsushita Electric Industrial Co., Ltd. Apparatus and method for mounting components on substrate
EP1898326A4 (de) * 2005-06-24 2009-07-29 Fujitsu Ltd Verfahren, programm und system zur unterstützung der entwicklung von bauelementen
US8229778B2 (en) * 2006-11-16 2012-07-24 International Business Machines Corporation Constructing change plans from component interactions
US9008836B2 (en) * 2007-01-09 2015-04-14 Abb Inc. Method and system for robotic assembly parameter optimization
DE102007046434A1 (de) * 2007-09-28 2008-12-04 Siemens Ag Verfahren zur Ermittlung einer optimalen Reihenfolge beim Bestücken von Substraten mit Bauelementen
JP2009124019A (ja) * 2007-11-16 2009-06-04 Fujitsu Ltd 基板ユニットの製造方法及びマウンタ装置
EP3043629B1 (de) * 2013-09-02 2020-05-13 FUJI Corporation Datenverarbeitungsvorrichtung zur verwendung in einer substratarbeitsmaschine und substratarbeitssystem damit
US11058040B2 (en) 2016-03-29 2021-07-06 Fuji Corporation Operation checking device of electronic mounting machine
US10657297B2 (en) * 2018-06-01 2020-05-19 Mentor Graphics Corporation Part number consolidation in printed circuit board assembly design
JP7393257B2 (ja) * 2020-03-10 2023-12-06 ヤマハ発動機株式会社 干渉確認装置及びそれを備えた実装機

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58112387A (ja) * 1981-12-26 1983-07-04 池上通信機株式会社 電子部品のプリント基板への自動插入装置
JPS58163001A (ja) * 1982-03-23 1983-09-27 Toyoda Mach Works Ltd 干渉チエツク機能を備えた数値制御装置
JPS58186548A (ja) * 1982-04-21 1983-10-31 Toyoda Mach Works Ltd 自動プログラミング機能を備えた数値制御装置
JPS5936810A (ja) * 1982-08-24 1984-02-29 Mitsubishi Electric Corp 数値制御加工機械の加工情報監視方法
JPS59216208A (ja) * 1983-05-23 1984-12-06 Mitsubishi Electric Corp 数値制御装置

Also Published As

Publication number Publication date
EP0192822A3 (en) 1989-04-26
JPS61194507A (ja) 1986-08-28
KR900004251B1 (ko) 1990-06-18
DE3587732T2 (de) 1994-05-19
KR860006725A (ko) 1986-09-13
EP0192822A2 (de) 1986-09-03
EP0192822B1 (de) 1994-01-19
US4706187A (en) 1987-11-10
JPH0668696B2 (ja) 1994-08-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee