DE3586691T2 - Vorrichtung zur automatischen montage elektronischer bauteile. - Google Patents

Vorrichtung zur automatischen montage elektronischer bauteile.

Info

Publication number
DE3586691T2
DE3586691T2 DE8585101747T DE3586691T DE3586691T2 DE 3586691 T2 DE3586691 T2 DE 3586691T2 DE 8585101747 T DE8585101747 T DE 8585101747T DE 3586691 T DE3586691 T DE 3586691T DE 3586691 T2 DE3586691 T2 DE 3586691T2
Authority
DE
Germany
Prior art keywords
electronic components
automatic assembly
automatic
assembly
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8585101747T
Other languages
English (en)
Other versions
DE3586691D1 (de
Inventor
Takayuki Fujita
Shigetoshi Negishi
Kunio Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE3586691D1 publication Critical patent/DE3586691D1/de
Publication of DE3586691T2 publication Critical patent/DE3586691T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0411—Pick-and-place heads or apparatus, e.g. with jaws having multiple mounting heads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49137—Different components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part
DE8585101747T 1984-02-17 1985-02-16 Vorrichtung zur automatischen montage elektronischer bauteile. Expired - Lifetime DE3586691T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59028911A JPS60171799A (ja) 1984-02-17 1984-02-17 電子部品自動装着装置

Publications (2)

Publication Number Publication Date
DE3586691D1 DE3586691D1 (de) 1992-11-05
DE3586691T2 true DE3586691T2 (de) 1993-02-11

Family

ID=12261581

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585101747T Expired - Lifetime DE3586691T2 (de) 1984-02-17 1985-02-16 Vorrichtung zur automatischen montage elektronischer bauteile.

Country Status (4)

Country Link
US (1) US4631816A (de)
EP (1) EP0155512B1 (de)
JP (1) JPS60171799A (de)
DE (1) DE3586691T2 (de)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60197329A (ja) * 1984-03-19 1985-10-05 Sanyo Electric Co Ltd 電子部品装着装置
KR920003402B1 (ko) * 1984-09-12 1992-04-30 시티즌 도께이 가부시기가이샤 전자 부품 자동 삽입 장치
JPS62114289A (ja) * 1985-11-14 1987-05-26 松下電器産業株式会社 電子部品の装着方法および装置
JPS62114290A (ja) * 1985-11-14 1987-05-26 松下電器産業株式会社 電子部品装着装置
JPS62130596A (ja) * 1985-12-02 1987-06-12 三菱電機株式会社 電子部品自動組立装置
US4731923A (en) * 1986-03-15 1988-03-22 Tdk Corporation Apparatus and method for mounting circuit element on printed circuit board
US4910864A (en) * 1986-05-16 1990-03-27 Western Digital Corporation Pick-up head for component handling machine
JPS62292328A (ja) * 1986-06-12 1987-12-19 Matsushita Electric Ind Co Ltd 部品装着方法
JPH0685478B2 (ja) * 1986-06-24 1994-10-26 松下電器産業株式会社 電子部品自動装着装置
DE3750592T2 (de) * 1986-07-04 1995-02-16 Matsushita Electric Ind Co Ltd Anordnung zum Auswechseln eines Bestückungskopfes für eine Maschine zum Bestücken von Bauteilen.
JP2589075B2 (ja) * 1987-01-14 1997-03-12 三洋電機株式会社 自動装着装置
JPS63174395A (ja) * 1987-01-14 1988-07-18 三洋電機株式会社 自動装着装置
GB8702617D0 (en) * 1987-02-05 1987-03-11 Dynapert Precima Ltd Handling electrical/electronic components
DE8713041U1 (de) * 1987-09-28 1987-11-12 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De
DE3737506A1 (de) * 1987-11-05 1989-05-24 Ibm Deutschland Vorrichtung zur bestueckung insbesondere von leiterplatten
ATE75900T1 (de) * 1987-11-10 1992-05-15 Siemens Ag Vorrichtung und verfahren zum bestuecken von leiterplatten mit bauelementen.
US4810154A (en) * 1988-02-23 1989-03-07 Molex Incorporated Component feeder apparatus and method for vision-controlled robotic placement system
EP0360985B1 (de) * 1988-06-29 1995-01-25 Matsushita Electric Industrial Co., Ltd. Elektronischen Bauelemente ergreifendes Gerät
EP0355836A3 (de) * 1988-08-24 1991-05-02 TDK Corporation Vorrichtung und Verfahren zur automatischen Montage von elektronischen Bauteilen auf einer Leiterplatte
NL8900027A (nl) * 1989-01-06 1990-08-01 Philips Nv Werkwijze en inrichting voor het plaatsen van onderdelen op een drager.
US5038466A (en) * 1989-08-04 1991-08-13 Motorola, Inc. Multifunctional end effector and method of converting single purpose robot arm
JP2503082B2 (ja) * 1989-09-05 1996-06-05 富士機械製造株式会社 電子部品装着装置
JP2803247B2 (ja) * 1989-11-16 1998-09-24 松下電器産業株式会社 電子部品の位置規正爪装置
US5058263A (en) * 1989-12-21 1991-10-22 U.S. Philips Corporation Manipulation device
JPH0821790B2 (ja) * 1990-02-15 1996-03-04 松下電器産業株式会社 ロータリーヘッド式電子部品実装装置
US5040291A (en) * 1990-05-04 1991-08-20 Universal Instruments Corporation Multi-spindle pick and place method and apparatus
GB2262516B (en) * 1991-12-21 1995-03-22 Tdk Corp Electronic component feed system
JP3368923B2 (ja) * 1992-12-28 2003-01-20 松下電器産業株式会社 電子部品実装装置
JPH08228098A (ja) * 1995-12-14 1996-09-03 Sony Corp 電子部品の実装装置及び電子部品の実装方法
JP3196626B2 (ja) * 1995-12-26 2001-08-06 ソニー株式会社 部品実装方法
US6230393B1 (en) * 1997-07-07 2001-05-15 Matsushita Electric Industrial Co., Ltd. Method and device for mounting electronic component
AU1222199A (en) * 1998-12-02 2000-06-19 Ismeca Holding Sa Device for aligning part-bearing spindles on a circular conveyor
US6162007A (en) * 1999-01-14 2000-12-19 Witte; Stefan Apparatus for feeding electronic component tape
US6842974B1 (en) * 1999-09-27 2005-01-18 Matsushita Electric Industrial Co., Ltd. Component mounting method and component mounting apparatus
US6625878B2 (en) * 2001-09-05 2003-09-30 Delaware Capital Formation Method and apparatus for improving component placement in a component pick up and place machine
WO2004043126A1 (en) * 2002-11-08 2004-05-21 Assembléon N.V. Method for moving at least two elements of a placement machine as well as such a placement machine
CN2736833Y (zh) * 2004-09-06 2005-10-26 鸿富锦精密工业（深圳）有限公司 中央处理器拆装治具
EP2012576B1 (de) * 2007-07-06 2014-11-19 ASM Assembly Systems GmbH & Co. KG Bestückautomat und Verfahren zum Handhaben von Bauelementen
DE102007043868B4 (de) * 2007-09-14 2009-08-27 Siemens Ag Bestückkopf zum Bestücken von Substraten mit Bauelementen und Bestückautomat
CN111465311B (zh) * 2015-11-17 2021-02-26 株式会社富士 安装处理方法、安装系统及元件安装机

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3044860A1 (de) * 1980-11-28 1982-07-01 Blaupunkt-Werke Gmbh, 3200 Hildesheim Verfahren und vorrichtung zur bestueckung gedruckter schaltungen
GB2108015B (en) * 1981-08-24 1985-03-06 Tdk Electronics Co Ltd Apparatus for mounting chip type circuit elements on printed circuit boards

Also Published As

Publication number Publication date
EP0155512A3 (en) 1989-04-19
EP0155512B1 (de) 1992-09-30
EP0155512A2 (de) 1985-09-25
DE3586691D1 (de) 1992-11-05
JPS60171799A (ja) 1985-09-05
US4631816A (en) 1986-12-30
JPH0247119B2 (de) 1990-10-18

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Legal Events

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