DE3575525D1 - Verfahren und vorrichtung zum schleifen der oberflaeche einer halbleiterscheibe. - Google Patents

Verfahren und vorrichtung zum schleifen der oberflaeche einer halbleiterscheibe.

Info

Publication number
DE3575525D1
DE3575525D1 DE8585100672T DE3575525T DE3575525D1 DE 3575525 D1 DE3575525 D1 DE 3575525D1 DE 8585100672 T DE8585100672 T DE 8585100672T DE 3575525 T DE3575525 T DE 3575525T DE 3575525 D1 DE3575525 D1 DE 3575525D1
Authority
DE
Germany
Prior art keywords
grinding
semiconductor disc
disc
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8585100672T
Other languages
English (en)
Inventor
Toshiyuki Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp, Disco Abrasive Systems Ltd filed Critical Disco Corp
Application granted granted Critical
Publication of DE3575525D1 publication Critical patent/DE3575525D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
DE8585100672T 1984-01-23 1985-01-23 Verfahren und vorrichtung zum schleifen der oberflaeche einer halbleiterscheibe. Expired - Lifetime DE3575525D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59008534A JPS60155358A (ja) 1984-01-23 1984-01-23 半導体ウエ−ハの表面を研削する方法及び装置

Publications (1)

Publication Number Publication Date
DE3575525D1 true DE3575525D1 (de) 1990-03-01

Family

ID=11695813

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585100672T Expired - Lifetime DE3575525D1 (de) 1984-01-23 1985-01-23 Verfahren und vorrichtung zum schleifen der oberflaeche einer halbleiterscheibe.

Country Status (5)

Country Link
US (1) US4753049A (de)
EP (1) EP0150074B1 (de)
JP (1) JPS60155358A (de)
KR (1) KR920004063B1 (de)
DE (1) DE3575525D1 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62286707A (ja) * 1986-06-05 1987-12-12 富士電機株式会社 半導体素子の製造方法
JPH0637025B2 (ja) * 1987-09-14 1994-05-18 スピードファム株式会社 ウエハの鏡面加工装置
US5036624A (en) * 1989-06-21 1991-08-06 Silicon Technology Corporation Notch grinder
JP2613504B2 (ja) * 1991-06-12 1997-05-28 信越半導体株式会社 ウエーハのノッチ部面取り方法および装置
US5289661A (en) * 1992-12-23 1994-03-01 Texas Instruments Incorporated Notch beveling on semiconductor wafer edges
US5649854A (en) * 1994-05-04 1997-07-22 Gill, Jr.; Gerald L. Polishing apparatus with indexing wafer processing stations
US5533924A (en) * 1994-09-01 1996-07-09 Micron Technology, Inc. Polishing apparatus, a polishing wafer carrier apparatus, a replacable component for a particular polishing apparatus and a process of polishing wafers
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US7097544B1 (en) 1995-10-27 2006-08-29 Applied Materials Inc. Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
US6296553B1 (en) 1997-04-02 2001-10-02 Nippei Toyama Corporation Grinding method, surface grinder, workpiece support, mechanism and work rest
US6425812B1 (en) 1997-04-08 2002-07-30 Lam Research Corporation Polishing head for chemical mechanical polishing using linear planarization technology
US6244946B1 (en) 1997-04-08 2001-06-12 Lam Research Corporation Polishing head with removable subcarrier
JP3231659B2 (ja) * 1997-04-28 2001-11-26 日本電気株式会社 自動研磨装置
WO1999009588A1 (en) * 1997-08-21 1999-02-25 Memc Electronic Materials, Inc. Method of processing semiconductor wafers
US5920769A (en) 1997-12-12 1999-07-06 Micron Technology, Inc. Method and apparatus for processing a planar structure
US5827111A (en) * 1997-12-15 1998-10-27 Micron Technology, Inc. Method and apparatus for grinding wafers
US5827112A (en) * 1997-12-15 1998-10-27 Micron Technology, Inc. Method and apparatus for grinding wafers
DE69928319T2 (de) * 1998-04-27 2006-04-20 Tokyo Seimitsu Co. Ltd., Mitaka Oberflächenbearbeitungsverfahren und Oberflächenbearbeitungsvorrichtung für Halbleiterscheiben
US6214704B1 (en) 1998-12-16 2001-04-10 Memc Electronic Materials, Inc. Method of processing semiconductor wafers to build in back surface damage
US6294469B1 (en) 1999-05-21 2001-09-25 Plasmasil, Llc Silicon wafering process flow
US6340326B1 (en) 2000-01-28 2002-01-22 Lam Research Corporation System and method for controlled polishing and planarization of semiconductor wafers
US6705930B2 (en) 2000-01-28 2004-03-16 Lam Research Corporation System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
US6666756B1 (en) 2000-03-31 2003-12-23 Lam Research Corporation Wafer carrier head assembly
US7481695B2 (en) 2000-08-22 2009-01-27 Lam Research Corporation Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head
US6640155B2 (en) 2000-08-22 2003-10-28 Lam Research Corporation Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head
US6652357B1 (en) 2000-09-22 2003-11-25 Lam Research Corporation Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing
US6585572B1 (en) 2000-08-22 2003-07-01 Lam Research Corporation Subaperture chemical mechanical polishing system
US6471566B1 (en) 2000-09-18 2002-10-29 Lam Research Corporation Sacrificial retaining ring CMP system and methods for implementing the same
US6443815B1 (en) 2000-09-22 2002-09-03 Lam Research Corporation Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing
JP4455750B2 (ja) * 2000-12-27 2010-04-21 株式会社ディスコ 研削装置
US6949158B2 (en) * 2001-05-14 2005-09-27 Micron Technology, Inc. Using backgrind wafer tape to enable wafer mounting of bumped wafers
US20030102016A1 (en) * 2001-12-04 2003-06-05 Gary Bouchard Integrated circuit processing system
JP4561982B2 (ja) * 2005-01-06 2010-10-13 Ｔｄｋ株式会社 加工機
US20140242883A1 (en) * 2013-02-27 2014-08-28 Applied Materials, Inc. Determination of wafer angular position for in-sequence metrology
CN114030094B (zh) * 2021-11-18 2022-12-09 江苏纳沛斯半导体有限公司 一种可防止产生崩边的半导体晶圆制备的硅片划片系统

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3552584A (en) * 1968-01-03 1971-01-05 Hamco Machine And Electronics Work handling device
DE1918347A1 (de) * 1969-04-11 1970-10-29 Ernst Fr Weinz Fa Steuergeraet zum Schleifen eines Einkristalls
US3865254A (en) * 1973-05-21 1975-02-11 Kasker Instr Inc Prealignment system for an optical alignment and exposure instrument
JPS52107285A (en) * 1976-02-25 1977-09-08 Kobe Steel Ltd Prevention of attaching carbon to machinery and piping in which reduci ng gas is used
US4093378A (en) * 1976-11-01 1978-06-06 International Business Machines Corporation Alignment apparatus
JPS5633835A (en) * 1979-08-29 1981-04-04 Hitachi Ltd Holding mechanism for plate shaped substance
JPS56152562A (en) * 1980-04-24 1981-11-26 Fujitsu Ltd Grinder
JPS5789551A (en) * 1980-11-17 1982-06-03 Toshiba Corp Grinding process for sapphire wafer
JPS57156157A (en) * 1981-03-16 1982-09-27 Hitachi Seiko Ltd Grinding method and device
JPS57186340A (en) * 1981-05-12 1982-11-16 Nippon Kogaku Kk <Nikon> Positioning device for wafer

Also Published As

Publication number Publication date
KR920004063B1 (ko) 1992-05-23
EP0150074A2 (de) 1985-07-31
EP0150074A3 (en) 1987-05-13
KR850005306A (ko) 1985-08-24
US4753049A (en) 1988-06-28
EP0150074B1 (de) 1990-01-24
JPS60155358A (ja) 1985-08-15

Similar Documents

Publication Publication Date Title
DE3575525D1 (de) Verfahren und vorrichtung zum schleifen der oberflaeche einer halbleiterscheibe.
DE3884903D1 (de) Vorrichtung und Verfahren zum Abschneiden einer Halbleiterscheibe.
DE3483063D1 (de) Ausrichtungsmarkierungen auf halbleiterscheiben und verfahren zum herstellen der markierungen.
DE68917046D1 (de) Verfahren und Vorrichtung zum automatischen Abfasen einer Halbleiterplatte.
DE3686614T2 (de) Vorrichtung und verfahren zum automatisierten manipulieren einer kassette.
DE3580740D1 (de) Vorrichtung und verfahren zum gewinnen einer oberflaechenprofilometrie und von dreidimensionalen oberflaechenkonturen.
DE3580060D1 (de) Verfahren und vorrichtung zum auflegen von baendern.
DE3682381D1 (de) Verfahren und vorrichtung zur kontrolle einer oberflaeche.
DE69524404D1 (de) Verfahren und vorrichtung zum polieren einer halbleiterscheibe
DE3584881D1 (de) Verfahren zum einstellen der werkzeugkoordinaten.
DE3249032C2 (de) Plattenantrieb mit einer Kopf-Tr{gervorrichtung und Verfahren zum Zur}ckzeihen der Kopf-Tr{gervorrichtung von der Plattenoberfl{che
DE3585793D1 (de) Verfahren und vorrichtung zum topographischen aufnehmen einer radargegend.
DE3581426D1 (de) Verfahren zum zustellen eines honwerkzeuges und vorrichtung zum ausfuehren des verfahrens.
DE69023441T2 (de) Werkzeugverbindung und Verfahren zum Oberflächenhärten derselben.
DE3280050D1 (de) Verfahren zum beschichten von halbleiterscheiben und vorrichtung dafuer.
DE3854893T2 (de) Verfahren und Vorrichtung zum Abschrägen der Kerbe eines Halbleiterplättchen
AT381891B (de) Vorrichtung zum entgraten von werkstuecken
DE3861296D1 (de) Verfahren und vorrichtung zum betrieb von wirbelschicht-reaktoren.
DE3767041D1 (de) Verfahren und vorrichtung zum messen der freien oberflaeche einer fluessigkeit.
DE69119060T2 (de) Verfahren und vorrichtung zum regeln der breite einer flootglasscheibe
DE3672834D1 (de) Verfahren zum nullstellen einer rund-schleifmaschine und mittel zur durchfuehrung des verfahrens.
DE3670218D1 (de) Verfahren und vorrichtung zum verbessern des mahlens einer druckkammermahlvorrichtung.
DE3378256D1 (en) Method and device for surface machining
DE3750177D1 (de) Verfahren und vorrichtung zum tiefschleifen.
DE3581911D1 (de) Einrichtung zum inspizieren der oberflaeche von magnetspeicherplatten.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee