DE3485829T2 - Verfahren und vorrichtung zur kontinuierlichen herstellung eines isolierten substrates. - Google Patents
Verfahren und vorrichtung zur kontinuierlichen herstellung eines isolierten substrates.Info
- Publication number
- DE3485829T2 DE3485829T2 DE8484114295T DE3485829T DE3485829T2 DE 3485829 T2 DE3485829 T2 DE 3485829T2 DE 8484114295 T DE8484114295 T DE 8484114295T DE 3485829 T DE3485829 T DE 3485829T DE 3485829 T2 DE3485829 T2 DE 3485829T2
- Authority
- DE
- Germany
- Prior art keywords
- insulated substrate
- insulated
- continuously producing
- depositing
- insulation layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 3
- 238000000151 deposition Methods 0.000 abstract 2
- 238000009413 insulation Methods 0.000 abstract 2
- 238000004544 sputter deposition Methods 0.000 abstract 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 abstract 1
- 238000007740 vapor deposition Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
- C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/20—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
- H01L31/206—Particular processes or apparatus for continuous treatment of the devices, e.g. roll-to roll processes, multi-chamber deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Photovoltaic Devices (AREA)
- Chemical Vapour Deposition (AREA)
- Non-Insulated Conductors (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Processes Specially Adapted For Manufacturing Cables (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Laminated Bodies (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58227244A JPS60119784A (ja) | 1983-12-01 | 1983-12-01 | 絶縁金属基板の製法およびそれに用いる装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3485829D1 DE3485829D1 (de) | 1992-08-27 |
DE3485829T2 true DE3485829T2 (de) | 1992-12-10 |
Family
ID=16857773
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8484114295T Expired - Fee Related DE3485829T2 (de) | 1983-12-01 | 1984-11-27 | Verfahren und vorrichtung zur kontinuierlichen herstellung eines isolierten substrates. |
DE3486402T Expired - Fee Related DE3486402T2 (de) | 1983-12-01 | 1984-11-27 | Verfahren zum Herstellen eines elektrisch isolierten metallischen Substrats als kontinuierliches Band. |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3486402T Expired - Fee Related DE3486402T2 (de) | 1983-12-01 | 1984-11-27 | Verfahren zum Herstellen eines elektrisch isolierten metallischen Substrats als kontinuierliches Band. |
Country Status (7)
Country | Link |
---|---|
US (1) | US4585537A (de) |
EP (2) | EP0144055B1 (de) |
JP (1) | JPS60119784A (de) |
KR (1) | KR900008504B1 (de) |
AT (2) | ATE126551T1 (de) |
CA (1) | CA1267864A (de) |
DE (2) | DE3485829T2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010061732A1 (de) * | 2010-11-22 | 2012-05-24 | Von Ardenne Anlagentechnik Gmbh | Verfahren und Vorrichtung zum Aufbringen einer Schutzschicht auf einem Substrat |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6245079A (ja) * | 1985-08-22 | 1987-02-27 | Kanegafuchi Chem Ind Co Ltd | 太陽電池用基板およびその製法 |
JPH065772B2 (ja) * | 1987-04-03 | 1994-01-19 | 昭和アルミニウム株式会社 | 薄膜太陽電池用基板の製造方法 |
FR2614317B1 (fr) * | 1987-04-22 | 1989-07-13 | Air Liquide | Procede de protection de substrat polymerique par depot par plasma de composes du type oxynitrure de silicium et dispositif pour sa mise en oeuvre. |
US4763601A (en) * | 1987-09-02 | 1988-08-16 | Nippon Steel Corporation | Continuous composite coating apparatus for coating strip |
JPH0244738A (ja) * | 1988-08-05 | 1990-02-14 | Semiconductor Energy Lab Co Ltd | 電子装置作製方法 |
US5322716A (en) * | 1989-07-04 | 1994-06-21 | Matsushita Electric Industrial Co., Ltd. | Method for producing magnetic recording medium |
US5190631A (en) * | 1991-01-09 | 1993-03-02 | The Carborundum Company | Process for forming transparent silicon carbide films |
JPH06112625A (ja) * | 1991-10-18 | 1994-04-22 | Tokyo Kakoki Kk | 処理室の密閉構造 |
US5395662A (en) * | 1992-07-24 | 1995-03-07 | Dielectric Coating Industries | Improvements in high reflective aluminum sheeting and methods for making same |
US5431963A (en) * | 1993-02-01 | 1995-07-11 | General Electric Company | Method for adhering diamondlike carbon to a substrate |
US6074901A (en) * | 1993-12-03 | 2000-06-13 | Semiconductor Energy Laboratory Co., Ltd. | Process for crystallizing an amorphous silicon film and apparatus for fabricating the same |
CA2180665A1 (en) * | 1994-01-21 | 1995-07-27 | Irving B. Ruppel | Silicon carbide sputtering target |
US5480695A (en) * | 1994-08-10 | 1996-01-02 | Tenhover; Michael A. | Ceramic substrates and magnetic data storage components prepared therefrom |
WO1997022136A1 (de) * | 1995-12-08 | 1997-06-19 | Balzers Aktiengesellschaft | Hf-plasmabehandlungskammer bzw. pecvd-beschichtungskammer, deren verwendungen und verfahren zur beschichtung von speicherplatten |
US5755759A (en) * | 1996-03-14 | 1998-05-26 | Eic Laboratories, Inc. | Biomedical device with a protective overlayer |
CA2250535C (en) * | 1996-04-03 | 2004-05-18 | Alusuisse Technology & Management Ag | Coating substrate |
GB9712338D0 (en) | 1997-06-14 | 1997-08-13 | Secr Defence | Surface coatings |
JPH11246971A (ja) * | 1998-03-03 | 1999-09-14 | Canon Inc | 微結晶シリコン系薄膜の作製方法及び作製装置 |
US6489034B1 (en) * | 2000-02-08 | 2002-12-03 | Gould Electronics Inc. | Method of forming chromium coated copper for printed circuit boards |
US6489035B1 (en) | 2000-02-08 | 2002-12-03 | Gould Electronics Inc. | Applying resistive layer onto copper |
US6441301B1 (en) | 2000-03-23 | 2002-08-27 | Matsushita Electric Industrial Co., Ltd. | Solar cell and method of manufacturing the same |
US6622374B1 (en) | 2000-09-22 | 2003-09-23 | Gould Electronics Inc. | Resistor component with multiple layers of resistive material |
KR20020080159A (ko) * | 2001-04-12 | 2002-10-23 | 에프디테크 주식회사 | 유기 전계발광 표시 소자의 자동 제조를 위한아이티오전극 증착 장치 및 방법 |
EP1445804A4 (de) * | 2001-10-19 | 2008-03-05 | Josuke Nakata | Lichtemissions- oder lichtempfangshalbleitermodul und verfahren zu seiner herstellung |
US20030151118A1 (en) * | 2002-02-14 | 2003-08-14 | 3M Innovative Properties Company | Aperture masks for circuit fabrication |
US6821348B2 (en) * | 2002-02-14 | 2004-11-23 | 3M Innovative Properties Company | In-line deposition processes for circuit fabrication |
US20040040506A1 (en) * | 2002-08-27 | 2004-03-04 | Ovshinsky Herbert C. | High throughput deposition apparatus |
US7147900B2 (en) * | 2003-08-14 | 2006-12-12 | Asm Japan K.K. | Method for forming silicon-containing insulation film having low dielectric constant treated with electron beam radiation |
EP1518941A1 (de) | 2003-09-24 | 2005-03-30 | Sidmar N.V. | Verfahren und Vorrichtung zur Herstellung von Stahlprodukten mit metallischer Beschichtung |
SE527179C2 (sv) * | 2003-12-05 | 2006-01-17 | Sandvik Intellectual Property | Tunnfilmssolcell eller tunnfilmsbatteri, innefattande en zirkoniumoxidbelagd bandprodukt av ferritiskt kromstål |
GB0406049D0 (en) * | 2004-03-18 | 2004-04-21 | Secr Defence | Surface coatings |
US20060172536A1 (en) * | 2005-02-03 | 2006-08-03 | Brown Karl M | Apparatus for plasma-enhanced physical vapor deposition of copper with RF source power applied through the workpiece |
JP4650113B2 (ja) * | 2005-06-09 | 2011-03-16 | 富士ゼロックス株式会社 | 積層構造体、ドナー基板、および積層構造体の製造方法 |
JP2008108978A (ja) * | 2006-10-26 | 2008-05-08 | Matsushita Electric Works Ltd | 立体回路基板の絶縁膜形成方法および絶縁膜形成装置 |
DE102006055862B4 (de) * | 2006-11-22 | 2008-07-03 | Q-Cells Ag | Verfahren und Vorrichtung zum Herstellen einer elektrischen Solarzellen-Kontaktstruktur an einem Substrat |
CN101641195B (zh) * | 2007-03-31 | 2012-10-10 | 柯尼卡美能达精密光学株式会社 | 制造光学膜的方法、光学膜、偏振片以及显示装置 |
EP1988186A1 (de) * | 2007-04-24 | 2008-11-05 | Galileo Vacuum Systems S.p.A. | Multikammer-Vakuumbeschichtungssystem |
WO2008155786A1 (en) * | 2007-06-20 | 2008-12-24 | Cisel S.R.L. - Circuiti Stampati Per Applicazioni Elettroniche | Photovoltaic module and modular panel made with it to collect radiant solar energy and its transformation into electrical energy |
EP2031082B1 (de) * | 2007-08-31 | 2014-09-03 | Aperam Alloys Imphy | Metallsubstrat mit kristallographischer Struktur, Vorrichtung mit kristallographischer Struktur, Fotovoltaikzelle und modul, das eine solche Vorrichtung umfasst, und Depotverfahren von Dünnschichten. |
WO2009121685A1 (en) * | 2008-04-04 | 2009-10-08 | Applied Materials Inc., A Corporation Of The State Of Delaware | Method for depositing of barrier layers on a plastic substrate as well as coating device therefor and a layer system |
FR2934715B1 (fr) * | 2008-07-30 | 2010-08-27 | Serge Crasnianski | Installation et procede de fabrication de cellules solaires. |
US20100236629A1 (en) * | 2009-03-19 | 2010-09-23 | Chuan-Lung Chuang | CIGS Solar Cell Structure And Method For Fabricating The Same |
US20120137972A1 (en) * | 2010-12-07 | 2012-06-07 | Canon Anelva Corporation | Film forming apparatus |
US20160014878A1 (en) * | 2014-04-25 | 2016-01-14 | Rogers Corporation | Thermal management circuit materials, method of manufacture thereof, and articles formed therefrom |
CN110911516B (zh) * | 2019-11-29 | 2021-06-04 | 尚越光电科技股份有限公司 | 一种柔性cigs太阳能电池片层叠串焊装置 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2382432A (en) * | 1940-08-02 | 1945-08-14 | Crown Cork & Seal Co | Method and apparatus for depositing vaporized metal coatings |
DE1002584B (de) * | 1940-12-14 | 1957-02-14 | Dr Georg Hass | Verfahren zur Verbesserung der Haftfestigkeit von metallischen UEberzuegen |
CH236117A (de) * | 1941-08-16 | 1945-01-15 | Bosch Gmbh Robert | Verfahren zur Herstellung von metallisierten Bändern aus Isolierstoff. |
US3480922A (en) * | 1965-05-05 | 1969-11-25 | Ibm | Magnetic film device |
US4317844A (en) * | 1975-07-28 | 1982-03-02 | Rca Corporation | Semiconductor device having a body of amorphous silicon and method of making the same |
GB1601427A (en) * | 1977-06-20 | 1981-10-28 | Siemens Ag | Deposition of a layer of electrically-conductive material on a graphite body |
US4331526A (en) * | 1979-09-24 | 1982-05-25 | Coulter Systems Corporation | Continuous sputtering apparatus and method |
DE2941559C2 (de) * | 1979-10-13 | 1983-03-03 | Messerschmitt-Bölkow-Blohm GmbH, 8000 München | Verfahren zum Abscheiden von Silizium auf einem Substrat |
US4400409A (en) * | 1980-05-19 | 1983-08-23 | Energy Conversion Devices, Inc. | Method of making p-doped silicon films |
US4410558A (en) * | 1980-05-19 | 1983-10-18 | Energy Conversion Devices, Inc. | Continuous amorphous solar cell production system |
JPS5842126B2 (ja) * | 1980-10-31 | 1983-09-17 | 鐘淵化学工業株式会社 | アモルファスシリコンの製造方法 |
GB2095030B (en) * | 1981-01-08 | 1985-06-12 | Canon Kk | Photoconductive member |
US4438723A (en) * | 1981-09-28 | 1984-03-27 | Energy Conversion Devices, Inc. | Multiple chamber deposition and isolation system and method |
JPS58103178A (ja) * | 1981-12-15 | 1983-06-20 | Kanegafuchi Chem Ind Co Ltd | 耐熱性薄膜太陽電池 |
US4492181A (en) * | 1982-03-19 | 1985-01-08 | Sovonics Solar Systems | Apparatus for continuously producing tandem amorphous photovoltaic cells |
US4485125A (en) * | 1982-03-19 | 1984-11-27 | Energy Conversion Devices, Inc. | Method for continuously producing tandem amorphous photovoltaic cells |
US4398054A (en) * | 1982-04-12 | 1983-08-09 | Chevron Research Company | Compensated amorphous silicon solar cell incorporating an insulating layer |
US4462332A (en) * | 1982-04-29 | 1984-07-31 | Energy Conversion Devices, Inc. | Magnetic gas gate |
-
1983
- 1983-12-01 JP JP58227244A patent/JPS60119784A/ja active Pending
-
1984
- 1984-11-27 EP EP84114295A patent/EP0144055B1/de not_active Expired - Lifetime
- 1984-11-27 DE DE8484114295T patent/DE3485829T2/de not_active Expired - Fee Related
- 1984-11-27 AT AT91120878T patent/ATE126551T1/de not_active IP Right Cessation
- 1984-11-27 DE DE3486402T patent/DE3486402T2/de not_active Expired - Fee Related
- 1984-11-27 EP EP91120878A patent/EP0478010B1/de not_active Expired - Lifetime
- 1984-11-27 AT AT84114295T patent/ATE78522T1/de not_active IP Right Cessation
- 1984-11-28 CA CA000468803A patent/CA1267864A/en not_active Expired - Lifetime
- 1984-12-01 KR KR1019840007583A patent/KR900008504B1/ko not_active IP Right Cessation
- 1984-12-03 US US06/677,773 patent/US4585537A/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010061732A1 (de) * | 2010-11-22 | 2012-05-24 | Von Ardenne Anlagentechnik Gmbh | Verfahren und Vorrichtung zum Aufbringen einer Schutzschicht auf einem Substrat |
Also Published As
Publication number | Publication date |
---|---|
CA1267864C (en) | 1990-04-17 |
KR900008504B1 (ko) | 1990-11-24 |
EP0144055B1 (de) | 1992-07-22 |
EP0144055A2 (de) | 1985-06-12 |
KR850004370A (ko) | 1985-07-11 |
EP0144055A3 (en) | 1988-09-21 |
CA1267864A (en) | 1990-04-17 |
EP0478010A2 (de) | 1992-04-01 |
DE3486402T2 (de) | 1996-04-04 |
US4585537A (en) | 1986-04-29 |
ATE126551T1 (de) | 1995-09-15 |
DE3486402D1 (de) | 1995-09-21 |
ATE78522T1 (de) | 1992-08-15 |
DE3485829D1 (de) | 1992-08-27 |
EP0478010B1 (de) | 1995-08-16 |
EP0478010A3 (en) | 1992-05-13 |
JPS60119784A (ja) | 1985-06-27 |
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