DE3304736C2 - Gold-Lötmittel - Google Patents
Gold-LötmittelInfo
- Publication number
- DE3304736C2 DE3304736C2 DE3304736A DE3304736A DE3304736C2 DE 3304736 C2 DE3304736 C2 DE 3304736C2 DE 3304736 A DE3304736 A DE 3304736A DE 3304736 A DE3304736 A DE 3304736A DE 3304736 C2 DE3304736 C2 DE 3304736C2
- Authority
- DE
- Germany
- Prior art keywords
- gold
- solder
- alloys
- ver
- gold solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 36
- 239000010931 gold Substances 0.000 title claims abstract description 36
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 36
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 32
- 238000002844 melting Methods 0.000 claims abstract description 26
- 230000008018 melting Effects 0.000 claims abstract description 26
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 12
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 abstract description 15
- 239000000956 alloy Substances 0.000 abstract description 15
- 238000005476 soldering Methods 0.000 abstract description 10
- 229910001020 Au alloy Inorganic materials 0.000 abstract description 8
- 239000003353 gold alloy Substances 0.000 abstract description 8
- 229910017942 Ag—Ge Inorganic materials 0.000 abstract description 7
- 230000007797 corrosion Effects 0.000 abstract description 6
- 238000005260 corrosion Methods 0.000 abstract description 6
- 229910001347 Stellite Inorganic materials 0.000 abstract description 5
- AHICWQREWHDHHF-UHFFFAOYSA-N chromium;cobalt;iron;manganese;methane;molybdenum;nickel;silicon;tungsten Chemical compound C.[Si].[Cr].[Mn].[Fe].[Co].[Ni].[Mo].[W] AHICWQREWHDHHF-UHFFFAOYSA-N 0.000 abstract description 5
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 4
- 230000006866 deterioration Effects 0.000 abstract description 3
- 239000010935 stainless steel Substances 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract 1
- 238000012986 modification Methods 0.000 description 13
- 230000004048 modification Effects 0.000 description 13
- 239000000203 mixture Substances 0.000 description 10
- 229910017770 Cu—Ag Inorganic materials 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 150000001247 metal acetylides Chemical class 0.000 description 2
- 229910002058 ternary alloy Inorganic materials 0.000 description 2
- 229910002482 Cu–Ni Inorganic materials 0.000 description 1
- 229910017821 Cu—Ge Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3013—Au as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
- Adornments (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57033942A JPS58151992A (ja) | 1982-03-05 | 1982-03-05 | 金ロウ材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3304736A1 DE3304736A1 (de) | 1983-09-08 |
| DE3304736C2 true DE3304736C2 (de) | 1986-07-31 |
Family
ID=12400556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE3304736A Expired DE3304736C2 (de) | 1982-03-05 | 1983-02-11 | Gold-Lötmittel |
Country Status (6)
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4810313A (en) * | 1988-03-14 | 1989-03-07 | Virginia McReynolds | Gold solder fluxing composition and method of preparing the same |
| JP2731435B2 (ja) * | 1989-10-20 | 1998-03-25 | 田中貴金属工業株式会社 | エレクトロマイグレーション防止性ろう材及び外部リードをろう付けした電子部品 |
| JP2731434B2 (ja) * | 1989-10-20 | 1998-03-25 | 田中貴金属工業株式会社 | エレクトロマイグレーション防止性ろう材及び外部リードをろう付けした電子部品 |
| US5384089A (en) * | 1994-05-02 | 1995-01-24 | Diamond; Lawrence H. | Yellow karat gold casting alloys |
| EP0761017B1 (en) * | 1995-03-20 | 1999-09-08 | Koninklijke Philips Electronics N.V. | Semiconductor device of the type sealed in glass having a silver-copper bonding layer between slugs and connection conductors |
| WO2002076669A1 (fr) * | 2001-03-23 | 2002-10-03 | Citizen Watch Co., Ltd. | Metal d'apport de brasage |
| JP6084915B2 (ja) * | 2012-11-06 | 2017-02-22 | 日本碍子株式会社 | セラミックス部材と金属部材との接合体及びその製法 |
| WO2015193659A2 (en) * | 2014-06-16 | 2015-12-23 | Allied Gold Limited | Alloy compositions |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US219097A (en) * | 1879-09-02 | Improvement in alloys for jewelry | ||
| DE153895C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | ||||
| GB985281A (en) * | 1960-03-18 | 1965-03-03 | Texas Instruments Inc | Composite products for soldering and the like and method of their manufacture |
| DE1235714B (de) * | 1963-10-23 | 1967-03-02 | Telefunken Patent | Vakuumdichte Metall-Keramik-Loetverbindung an einer elektrischen Entladungsanordnung |
| DE2829284A1 (de) * | 1978-07-04 | 1980-01-17 | Wagner Fa Ferd | Goldlegierungsdraht fuer schmuckketten |
| US4330329A (en) * | 1979-11-28 | 1982-05-18 | Tanaka Denshi Kogyo Kabushiki Kaisha | Gold bonding wire for semiconductor elements and the semiconductor element |
| DE3019277A1 (de) * | 1980-05-21 | 1981-11-26 | Fa. Dr. Th. Wieland, 7530 Pforzheim | Kupferfreie goldlegierung fuer zahnaerztliche zwecke |
-
1982
- 1982-03-05 JP JP57033942A patent/JPS58151992A/ja active Granted
-
1983
- 1983-02-10 GB GB08303737A patent/GB2116210B/en not_active Expired
- 1983-02-11 DE DE3304736A patent/DE3304736C2/de not_active Expired
- 1983-02-16 US US06/466,902 patent/US4444719A/en not_active Expired - Fee Related
- 1983-02-24 CH CH103483A patent/CH642106A5/de not_active IP Right Cessation
-
1986
- 1986-02-05 HK HK98/86A patent/HK9886A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| GB2116210A (en) | 1983-09-21 |
| US4444719A (en) | 1984-04-24 |
| JPH029558B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-03-02 |
| GB2116210B (en) | 1985-07-10 |
| JPS58151992A (ja) | 1983-09-09 |
| CH642106A5 (de) | 1984-03-30 |
| GB8303737D0 (en) | 1983-03-16 |
| HK9886A (en) | 1986-02-14 |
| DE3304736A1 (de) | 1983-09-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |