DE3219502C2 - Vorrichtung zum automatischen Transport scheibenförmiger Objekte - Google Patents

Vorrichtung zum automatischen Transport scheibenförmiger Objekte

Info

Publication number
DE3219502C2
DE3219502C2 DE3219502A DE3219502A DE3219502C2 DE 3219502 C2 DE3219502 C2 DE 3219502C2 DE 3219502 A DE3219502 A DE 3219502A DE 3219502 A DE3219502 A DE 3219502A DE 3219502 C2 DE3219502 C2 DE 3219502C2
Authority
DE
Germany
Prior art keywords
wafer
transport
cassette
shaped objects
inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE3219502A
Other languages
German (de)
English (en)
Other versions
DE3219502A1 (de
Inventor
Hans-Dieter Dipl.-Ing. 6331 Werdorf Jacoby
Peter Dipl.-Ing. 6338 Hüttenberg Schmidt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leica Microsystems Holdings GmbH
Original Assignee
Ernst Leitz Wetzlar GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ernst Leitz Wetzlar GmbH filed Critical Ernst Leitz Wetzlar GmbH
Priority to DE3219502A priority Critical patent/DE3219502C2/de
Priority to US06/494,706 priority patent/US4501527A/en
Priority to JP58090153A priority patent/JPS58216835A/ja
Publication of DE3219502A1 publication Critical patent/DE3219502A1/de
Priority to US06/688,419 priority patent/US4695215A/en
Application granted granted Critical
Publication of DE3219502C2 publication Critical patent/DE3219502C2/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
DE3219502A 1982-05-25 1982-05-25 Vorrichtung zum automatischen Transport scheibenförmiger Objekte Expired DE3219502C2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE3219502A DE3219502C2 (de) 1982-05-25 1982-05-25 Vorrichtung zum automatischen Transport scheibenförmiger Objekte
US06/494,706 US4501527A (en) 1982-05-25 1983-05-16 Device for automatically transporting disk shaped objects
JP58090153A JPS58216835A (ja) 1982-05-25 1983-05-24 円板状物体の自動搬送装置
US06/688,419 US4695215A (en) 1982-05-25 1985-01-02 Device for automatically transporting disk shaped objects

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3219502A DE3219502C2 (de) 1982-05-25 1982-05-25 Vorrichtung zum automatischen Transport scheibenförmiger Objekte

Publications (2)

Publication Number Publication Date
DE3219502A1 DE3219502A1 (de) 1983-12-01
DE3219502C2 true DE3219502C2 (de) 1990-04-19

Family

ID=6164375

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3219502A Expired DE3219502C2 (de) 1982-05-25 1982-05-25 Vorrichtung zum automatischen Transport scheibenförmiger Objekte

Country Status (3)

Country Link
US (2) US4501527A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS58216835A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3219502C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3603534A1 (de) * 1986-02-05 1987-08-06 Fraunhofer Ges Forschung Reinraum mit foerdereinrichtung
DE3632403A1 (de) * 1986-09-24 1988-04-07 Heidelberg Instr Gmbh Verstelleinrichtung
DE4304301A1 (de) * 1993-02-12 1994-08-18 Suess Kg Karl Transportsystem und -verfahren für zueinander auszurichtende Objekte
DE4342901A1 (de) * 1993-12-16 1995-06-22 Itt Ind Gmbh Deutsche Saugpinzettenkopf
DE19510230A1 (de) * 1995-03-24 1996-09-26 Michael Geringer Transfervorrichtung für elektrische Bauelemente, insbesondere Chips

Families Citing this family (114)

* Cited by examiner, † Cited by third party
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US4582191A (en) * 1982-06-17 1986-04-15 Weigand Robert E Article handling apparatus and method
US4861222A (en) * 1984-03-09 1989-08-29 Tegal Corporation Cassette elevator for use in a modular article processing machine
US4699556A (en) * 1984-05-17 1987-10-13 Proconics International, Inc. Object handling apparatus
US4597708A (en) * 1984-06-04 1986-07-01 Tencor Instruments Wafer handling apparatus
US4609320A (en) * 1984-06-20 1986-09-02 Rubin Richard H Flexible workpiece transporter and roller assembly therefor
USRE34311E (en) * 1984-08-30 1993-07-13 Texas Instruments Incorporated Semiconductor slice cassette transport unit
US4673076B1 (en) * 1984-09-04 2000-02-01 Kearney & Trecker Corp Rotary shuttle for machine tools
JPH0620922B2 (ja) * 1984-10-19 1994-03-23 株式会社東芝 被検物の搬送装置
JPH0620091B2 (ja) * 1985-01-31 1994-03-16 株式会社ニコン 基板の搬送装置
JPS61188331A (ja) * 1985-02-15 1986-08-22 Nippon Texas Instr Kk 物体取出装置
US4818169A (en) * 1985-05-17 1989-04-04 Schram Richard R Automated wafer inspection system
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US4687542A (en) * 1985-10-24 1987-08-18 Texas Instruments Incorporated Vacuum processing system
US4754445A (en) * 1985-10-28 1988-06-28 Litton Industrial Automation Systems, Inc. Optical disc auto-changer
JPH0691150B2 (ja) * 1985-10-29 1994-11-14 キヤノン株式会社 基板処理方法
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DE3745134C2 (de) * 1986-05-16 1999-03-04 Silicon Valley Group Verfahren und Einrichtung zur Übertragung eines Wafers von einer Quelle zu einem Zielort
US4770590A (en) * 1986-05-16 1988-09-13 Silicon Valley Group, Inc. Method and apparatus for transferring wafers between cassettes and a boat
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US4808059A (en) * 1986-07-15 1989-02-28 Peak Systems, Inc. Apparatus and method for transferring workpieces
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US4951601A (en) * 1986-12-19 1990-08-28 Applied Materials, Inc. Multi-chamber integrated process system
US5882165A (en) * 1986-12-19 1999-03-16 Applied Materials, Inc. Multiple chamber integrated process system
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GB8702617D0 (en) * 1987-02-05 1987-03-11 Dynapert Precima Ltd Handling electrical/electronic components
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US4846626A (en) * 1987-02-09 1989-07-11 The Perkin-Elmer Corporation Wafer handling system
US4973217A (en) * 1987-02-09 1990-11-27 Svg Lithography Systems, Inc. Wafer handling system
US5085558A (en) * 1987-02-09 1992-02-04 Svg Lithography Systems, Inc. Wafer handling system
US4984953A (en) * 1987-02-20 1991-01-15 Canon Kabushiki Kaisha Plate-like article conveying system
JPS63208452A (ja) * 1987-02-20 1988-08-29 Canon Inc 基板搬送装置
US4801234A (en) * 1987-05-15 1989-01-31 Daymarc Corporation Vacuum pick and place mechanism for integrated circuit test handler
DE3716549A1 (de) * 1987-05-17 1988-12-08 Leitz Ernst Gmbh Handhabungsautomat fuer plattenfoermige objekte
EP0302542B1 (en) * 1987-07-14 1994-01-26 Koninklijke Philips Electronics N.V. Apparatus for the transport of carriers from and to a positioning device, and selection device for use in such an apparatus
JPH0622258B2 (ja) * 1987-07-24 1994-03-23 日立電子エンジニアリング株式会社 ウエハ表面検査装置
DE3827343A1 (de) * 1988-08-12 1990-02-15 Leybold Ag Vorrichtung nach dem karussel-prinzip zum beschichten von substraten
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US4881863A (en) * 1987-12-17 1989-11-21 Primary Systems Corporation Apparatus for inspecting wafers
US4907931A (en) * 1988-05-18 1990-03-13 Prometrix Corporation Apparatus for handling semiconductor wafers
US4900214A (en) * 1988-05-25 1990-02-13 American Telephone And Telegraph Company Method and apparatus for transporting semiconductor wafers
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JP2683933B2 (ja) * 1989-01-20 1997-12-03 信越半導体株式会社 半導体ウエーハの表裏および方位判定検査装置
US5007784A (en) * 1989-01-20 1991-04-16 Genmark Automation Dual end effector robotic arm
DE3903607A1 (de) * 1989-02-08 1990-08-09 Leybold Ag Vorrichtung zum reinigen, pruefen und einordnen von werkstuecken
US5102280A (en) * 1989-03-07 1992-04-07 Ade Corporation Robot prealigner
US5112205A (en) * 1989-05-15 1992-05-12 Sony Corporation Optical-disk manufacturing apparatus
US5372319A (en) * 1989-10-03 1994-12-13 Globe Products Inc. Apparatus for loading and unloading workpieces
JPH0736417B2 (ja) * 1989-10-24 1995-04-19 株式会社メツクス ウエハーの位置決め装置
EP0468409B1 (en) * 1990-07-23 1995-10-04 Dainippon Screen Mfg. Co., Ltd. Interface apparatus for transporting substrates between substrate processing apparatus
US5191694A (en) * 1991-07-03 1993-03-09 Shape Inc. Cassette assembly line
JP2751975B2 (ja) * 1991-12-20 1998-05-18 株式会社日立製作所 半導体処理装置のロードロック室
JP2867194B2 (ja) * 1992-02-05 1999-03-08 東京エレクトロン株式会社 処理装置及び処理方法
US5498118A (en) * 1992-02-07 1996-03-12 Nikon Corporation Apparatus for and method of carrying a substrate
US6473157B2 (en) * 1992-02-07 2002-10-29 Nikon Corporation Method of manufacturing exposure apparatus and method for exposing a pattern on a mask onto a substrate
US5344365A (en) * 1993-09-14 1994-09-06 Sematech, Inc. Integrated building and conveying structure for manufacturing under ultraclean conditions
DE4408537A1 (de) * 1994-03-14 1995-09-21 Leybold Ag Vorrichtung für den Transport von Substraten
US5486080A (en) * 1994-06-30 1996-01-23 Diamond Semiconductor Group, Inc. High speed movement of workpieces in vacuum processing
US5677758A (en) * 1995-02-09 1997-10-14 Mrs Technology, Inc. Lithography System using dual substrate stages
DE19514037C2 (de) * 1995-04-13 1997-09-04 Leybold Ag Transportvorrichtung
US5830272A (en) * 1995-11-07 1998-11-03 Sputtered Films, Inc. System for and method of providing a controlled deposition on wafers
US5789890A (en) * 1996-03-22 1998-08-04 Genmark Automation Robot having multiple degrees of freedom
US6121743A (en) * 1996-03-22 2000-09-19 Genmark Automation, Inc. Dual robotic arm end effectors having independent yaw motion
JPH10112490A (ja) * 1996-10-03 1998-04-28 Nidek Co Ltd 半導体ウェハ搬送装置
US6213708B1 (en) * 1997-03-12 2001-04-10 Advanced Micro Devices, Inc. System for sorting multiple semiconductor wafers
US6354791B1 (en) * 1997-04-11 2002-03-12 Applied Materials, Inc. Water lift mechanism with electrostatic pickup and method for transferring a workpiece
US6114705A (en) * 1997-09-10 2000-09-05 Varian Semiconductor Equipment Associates, Inc. System for correcting eccentricity and rotational error of a workpiece
US6878895B1 (en) * 1998-06-30 2005-04-12 Advance Micro Devices, Inc. Reticle sorter
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DE10061628B4 (de) * 2000-12-11 2006-06-08 Leica Microsystems Wetzlar Gmbh Vorrichtung und Verfahren zum Ergreifen und Transportieren von Wafern
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US7114903B2 (en) * 2002-07-16 2006-10-03 Semitool, Inc. Apparatuses and method for transferring and/or pre-processing microelectronic workpieces
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US20060201074A1 (en) * 2004-06-02 2006-09-14 Shinichi Kurita Electronic device manufacturing chamber and methods of forming the same
CN101866828B (zh) * 2004-06-02 2013-03-20 应用材料公司 电子装置制造室及其形成方法
US7784164B2 (en) * 2004-06-02 2010-08-31 Applied Materials, Inc. Electronic device manufacturing chamber method
JP2006237559A (ja) * 2005-01-28 2006-09-07 Dainippon Screen Mfg Co Ltd 基板処理装置
US11024527B2 (en) 2005-06-18 2021-06-01 Frederick A. Flitsch Methods and apparatus for novel fabricators with Cleanspace
US7513822B2 (en) 2005-06-18 2009-04-07 Flitsch Frederick A Method and apparatus for a cleanspace fabricator
US9159592B2 (en) 2005-06-18 2015-10-13 Futrfab, Inc. Method and apparatus for an automated tool handling system for a multilevel cleanspace fabricator
US10627809B2 (en) 2005-06-18 2020-04-21 Frederick A. Flitsch Multilevel fabricators
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US8229585B2 (en) 2005-09-18 2012-07-24 Flitsch Frederick A Methods and apparatus for vertically orienting substrate processing tools in a clean space
US10651063B2 (en) 2005-06-18 2020-05-12 Frederick A. Flitsch Methods of prototyping and manufacturing with cleanspace fabricators
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US9457442B2 (en) * 2005-06-18 2016-10-04 Futrfab, Inc. Method and apparatus to support process tool modules in a cleanspace fabricator
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JP5563397B2 (ja) * 2010-07-21 2014-07-30 大塚電子株式会社 被搬送物回転装置
US12189828B2 (en) 2013-01-05 2025-01-07 Frederick A. Flitsch Customized smart devices and touchscreen devices and cleanspace manufacturing methods to make them
KR102075528B1 (ko) * 2013-05-16 2020-03-03 삼성디스플레이 주식회사 증착장치, 유기발광 디스플레이 장치 제조방법 및 유기발광 디스플레이 장치
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CN115180400B (zh) * 2022-08-17 2024-06-04 深圳市诺泰芯装备有限公司 一种高温转盘储料装置及方法

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3603534A1 (de) * 1986-02-05 1987-08-06 Fraunhofer Ges Forschung Reinraum mit foerdereinrichtung
DE3632403A1 (de) * 1986-09-24 1988-04-07 Heidelberg Instr Gmbh Verstelleinrichtung
DE4304301A1 (de) * 1993-02-12 1994-08-18 Suess Kg Karl Transportsystem und -verfahren für zueinander auszurichtende Objekte
DE4342901A1 (de) * 1993-12-16 1995-06-22 Itt Ind Gmbh Deutsche Saugpinzettenkopf
DE19510230A1 (de) * 1995-03-24 1996-09-26 Michael Geringer Transfervorrichtung für elektrische Bauelemente, insbesondere Chips
DE19510230C2 (de) * 1995-03-24 1999-08-05 Michael Geringer Transfervorrichtung für elektrische Bauelemente, insbesondere Chips

Also Published As

Publication number Publication date
JPH0325380B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-04-05
DE3219502A1 (de) 1983-12-01
US4501527A (en) 1985-02-26
US4695215A (en) 1987-09-22
JPS58216835A (ja) 1983-12-16

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