DE3214614C2 - - Google Patents

Info

Publication number
DE3214614C2
DE3214614C2 DE19823214614 DE3214614A DE3214614C2 DE 3214614 C2 DE3214614 C2 DE 3214614C2 DE 19823214614 DE19823214614 DE 19823214614 DE 3214614 A DE3214614 A DE 3214614A DE 3214614 C2 DE3214614 C2 DE 3214614C2
Authority
DE
Germany
Prior art keywords
circuit
temperature
component
cooling device
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE19823214614
Other languages
German (de)
English (en)
Other versions
DE3214614A1 (de
Inventor
Robert Mark Tucson Ariz. Us Stitt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Burr Brown Research Corp
Original Assignee
Burr Brown Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burr Brown Research Corp filed Critical Burr Brown Research Corp
Publication of DE3214614A1 publication Critical patent/DE3214614A1/de
Application granted granted Critical
Publication of DE3214614C2 publication Critical patent/DE3214614C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE19823214614 1981-04-20 1982-04-20 Temperaturregelung fuer einen modularen schaltkreis und verfahren zur temperaturregelung Granted DE3214614A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US25577581A 1981-04-20 1981-04-20

Publications (2)

Publication Number Publication Date
DE3214614A1 DE3214614A1 (de) 1982-11-04
DE3214614C2 true DE3214614C2 (enrdf_load_stackoverflow) 1991-11-14

Family

ID=22969809

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19823214614 Granted DE3214614A1 (de) 1981-04-20 1982-04-20 Temperaturregelung fuer einen modularen schaltkreis und verfahren zur temperaturregelung

Country Status (4)

Country Link
JP (1) JPS57178349A (enrdf_load_stackoverflow)
DE (1) DE3214614A1 (enrdf_load_stackoverflow)
FR (1) FR2504293B1 (enrdf_load_stackoverflow)
GB (1) GB2097184B (enrdf_load_stackoverflow)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3326834A1 (de) * 1982-08-24 1984-03-01 General Electric Co., Schenectady, N.Y. Verfahren zur verbesserung der herstellung von kernbrennstoffprodukten
JPS5994891A (ja) * 1982-11-24 1984-05-31 Hitachi Ltd 半導体レ−ザ装置
US4691987A (en) * 1983-07-08 1987-09-08 Itek Graphix Corp. Optical fiber cable producer and method of bonding optical fibers to light emitting diodes
GB2163008A (en) * 1984-08-08 1986-02-12 Varian Associates Miniature, temperature controlled phase detector
DE3709201A1 (de) * 1987-03-20 1988-09-29 Bosch Gmbh Robert Waermestrahlungssensor
US5032897A (en) * 1990-02-28 1991-07-16 International Business Machines Corp. Integrated thermoelectric cooling
US5012325A (en) * 1990-04-24 1991-04-30 International Business Machines Corp. Thermoelectric cooling via electrical connections
DE4135853A1 (de) * 1991-10-31 1993-05-06 Alcatel Sel Aktiengesellschaft, 7000 Stuttgart, De Aktives halbleiterbauelement mit regelbarer waermequelle
DE4208858A1 (de) * 1992-03-19 1993-09-23 Sel Alcatel Ag Faseroptischer verstaerker mit regelung der pumplicht-wellenlaenge
DE4208857A1 (de) * 1992-03-19 1993-09-23 Sel Alcatel Ag Optisches nachrichtenuebertragungssystem mit faseroptischen verstaerkern und regelung der sender-wellenlaenge
FR2690571B1 (fr) * 1992-04-23 1994-06-03 Peugeot Dispositif de regulation de la temperature d'un module electronique.
US5419780A (en) * 1994-04-29 1995-05-30 Ast Research, Inc. Method and apparatus for recovering power from semiconductor circuit using thermoelectric device
US5720342A (en) * 1994-09-12 1998-02-24 Pes, Inc. Integrated converter for extending the life span of electronic components
US5712448A (en) * 1996-02-07 1998-01-27 California Institute Of Technology Cooling device featuring thermoelectric and diamond materials for temperature control of heat-dissipating devices
US6614109B2 (en) 2000-02-04 2003-09-02 International Business Machines Corporation Method and apparatus for thermal management of integrated circuits
GB2375431B (en) * 2001-05-10 2003-11-05 Bookham Technology Plc Method and device for balancing temperature

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB908662A (en) * 1960-01-11 1962-10-24 Ass Elect Ind Cooling apparatus
FR1363163A (fr) * 1963-02-06 1964-06-12 Thomson Houston Comp Francaise Perfectionnements aux étuves pour composants électroniques
IL23606A (en) * 1964-07-09 1969-11-12 Charbonnier R Electronic component with individual thermal regulation
DE1245458B (de) * 1966-04-27 1967-07-27 Telefunken Patent Integrierte Schaltung, deren Traegerplaettchen gut waermeleitfaehig ist
US3602721A (en) * 1967-11-20 1971-08-31 Malsushita Electric Ind Co Ltd Photoelectric device with enhanced photoconductive sensitivity and storage effect of input radiation
DE2337436C2 (de) * 1973-07-24 1982-02-04 Deutsche Itt Industries Gmbh, 7800 Freiburg Anordnung zur Konstanthaltung der Frequenz eines piezo- oder ferroelektrischen Schwingkristalls
JPS5370689A (en) * 1976-12-06 1978-06-23 Hitachi Ltd Semiconductor laser device
US4253515A (en) * 1978-09-29 1981-03-03 United States Of America As Represented By The Secretary Of The Navy Integrated circuit temperature gradient and moisture regulator
JPS55113390A (en) * 1980-01-25 1980-09-01 Hitachi Ltd Semiconductor laser device

Also Published As

Publication number Publication date
FR2504293B1 (fr) 1987-01-09
GB2097184A (en) 1982-10-27
FR2504293A1 (fr) 1982-10-22
JPS6322623B2 (enrdf_load_stackoverflow) 1988-05-12
GB2097184B (en) 1985-07-03
DE3214614A1 (de) 1982-11-04
JPS57178349A (en) 1982-11-02

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Legal Events

Date Code Title Description
8128 New person/name/address of the agent

Representative=s name: HIEKE, K., DIPL.-ING., PAT.-ANW., 8013 HAAR

8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee