GB2097184B - Temperature regulating an electronic circuit module - Google Patents
Temperature regulating an electronic circuit moduleInfo
- Publication number
- GB2097184B GB2097184B GB8202783A GB8202783A GB2097184B GB 2097184 B GB2097184 B GB 2097184B GB 8202783 A GB8202783 A GB 8202783A GB 8202783 A GB8202783 A GB 8202783A GB 2097184 B GB2097184 B GB 2097184B
- Authority
- GB
- United Kingdom
- Prior art keywords
- electronic circuit
- circuit module
- temperature regulating
- regulating
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/345—Arrangements for heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US25577581A | 1981-04-20 | 1981-04-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
GB2097184A GB2097184A (en) | 1982-10-27 |
GB2097184B true GB2097184B (en) | 1985-07-03 |
Family
ID=22969809
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8202783A Expired GB2097184B (en) | 1981-04-20 | 1982-02-01 | Temperature regulating an electronic circuit module |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS57178349A (en) |
DE (1) | DE3214614A1 (en) |
FR (1) | FR2504293B1 (en) |
GB (1) | GB2097184B (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3326834A1 (en) * | 1982-08-24 | 1984-03-01 | General Electric Co., Schenectady, N.Y. | Process for improving the manufacture of nuclear fuel products |
JPS5994891A (en) * | 1982-11-24 | 1984-05-31 | Hitachi Ltd | Semiconductor laser device |
US4691987A (en) * | 1983-07-08 | 1987-09-08 | Itek Graphix Corp. | Optical fiber cable producer and method of bonding optical fibers to light emitting diodes |
GB2163008A (en) * | 1984-08-08 | 1986-02-12 | Varian Associates | Miniature, temperature controlled phase detector |
DE3709201A1 (en) * | 1987-03-20 | 1988-09-29 | Bosch Gmbh Robert | HEAT RADIATION SENSOR |
US5032897A (en) * | 1990-02-28 | 1991-07-16 | International Business Machines Corp. | Integrated thermoelectric cooling |
US5012325A (en) * | 1990-04-24 | 1991-04-30 | International Business Machines Corp. | Thermoelectric cooling via electrical connections |
DE4135853A1 (en) * | 1991-10-31 | 1993-05-06 | Alcatel Sel Aktiengesellschaft, 7000 Stuttgart, De | Active semiconductor element coupled to controllable heat source - which may be external heating element with thermal bridge, or resistive layer monolithically integrated into semiconductor |
DE4208858A1 (en) * | 1992-03-19 | 1993-09-23 | Sel Alcatel Ag | FIBER OPTICAL AMPLIFIER WITH CONTROL OF THE PUMP LIGHT WAVELENGTH |
DE4208857A1 (en) * | 1992-03-19 | 1993-09-23 | Sel Alcatel Ag | OPTICAL MESSAGE TRANSMISSION SYSTEM WITH FIBER OPTICAL AMPLIFIERS AND REGULATION OF THE TRANSMITTER WAVELENGTH |
FR2690571B1 (en) * | 1992-04-23 | 1994-06-03 | Peugeot | DEVICE FOR REGULATING THE TEMPERATURE OF AN ELECTRONIC MODULE. |
US5419780A (en) * | 1994-04-29 | 1995-05-30 | Ast Research, Inc. | Method and apparatus for recovering power from semiconductor circuit using thermoelectric device |
US5720342A (en) * | 1994-09-12 | 1998-02-24 | Pes, Inc. | Integrated converter for extending the life span of electronic components |
US5712448A (en) * | 1996-02-07 | 1998-01-27 | California Institute Of Technology | Cooling device featuring thermoelectric and diamond materials for temperature control of heat-dissipating devices |
US6614109B2 (en) | 2000-02-04 | 2003-09-02 | International Business Machines Corporation | Method and apparatus for thermal management of integrated circuits |
GB2375431B (en) * | 2001-05-10 | 2003-11-05 | Bookham Technology Plc | Method and device for balancing temperature |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB908662A (en) * | 1960-01-11 | 1962-10-24 | Ass Elect Ind | Cooling apparatus |
FR1363163A (en) * | 1963-02-06 | 1964-06-12 | Thomson Houston Comp Francaise | Improvements to ovens for electronic components |
IL23606A (en) * | 1964-07-09 | 1969-11-12 | Charbonnier R | Electronic component with individual thermal regulation |
DE1245458B (en) * | 1966-04-27 | 1967-07-27 | Telefunken Patent | Integrated circuit, the carrier plate of which has good thermal conductivity |
US3602721A (en) * | 1967-11-20 | 1971-08-31 | Malsushita Electric Ind Co Ltd | Photoelectric device with enhanced photoconductive sensitivity and storage effect of input radiation |
DE2337436C2 (en) * | 1973-07-24 | 1982-02-04 | Deutsche Itt Industries Gmbh, 7800 Freiburg | Arrangement for keeping the frequency of a piezo or ferroelectric oscillating crystal constant |
JPS5370689A (en) * | 1976-12-06 | 1978-06-23 | Hitachi Ltd | Semiconductor laser device |
US4253515A (en) * | 1978-09-29 | 1981-03-03 | United States Of America As Represented By The Secretary Of The Navy | Integrated circuit temperature gradient and moisture regulator |
JPS55113390A (en) * | 1980-01-25 | 1980-09-01 | Hitachi Ltd | Semiconductor laser device |
-
1982
- 1982-01-27 FR FR8201246A patent/FR2504293B1/en not_active Expired
- 1982-02-01 GB GB8202783A patent/GB2097184B/en not_active Expired
- 1982-02-04 JP JP1694382A patent/JPS57178349A/en active Granted
- 1982-04-20 DE DE19823214614 patent/DE3214614A1/en active Granted
Also Published As
Publication number | Publication date |
---|---|
FR2504293B1 (en) | 1987-01-09 |
JPS6322623B2 (en) | 1988-05-12 |
GB2097184A (en) | 1982-10-27 |
FR2504293A1 (en) | 1982-10-22 |
DE3214614A1 (en) | 1982-11-04 |
JPS57178349A (en) | 1982-11-02 |
DE3214614C2 (en) | 1991-11-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |