JPS57178349A - High performance circuit module regulated at temperature and temperature regulating method - Google Patents

High performance circuit module regulated at temperature and temperature regulating method

Info

Publication number
JPS57178349A
JPS57178349A JP1694382A JP1694382A JPS57178349A JP S57178349 A JPS57178349 A JP S57178349A JP 1694382 A JP1694382 A JP 1694382A JP 1694382 A JP1694382 A JP 1694382A JP S57178349 A JPS57178349 A JP S57178349A
Authority
JP
Japan
Prior art keywords
temperature
high performance
circuit module
regulating method
performance circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1694382A
Other languages
Japanese (ja)
Other versions
JPS6322623B2 (en
Inventor
Maaku Suteitsuto Robaato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Burr Brown Research Corp
Original Assignee
Burr Brown Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burr Brown Research Corp filed Critical Burr Brown Research Corp
Publication of JPS57178349A publication Critical patent/JPS57178349A/en
Publication of JPS6322623B2 publication Critical patent/JPS6322623B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
JP1694382A 1981-04-20 1982-02-04 High performance circuit module regulated at temperature and temperature regulating method Granted JPS57178349A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US25577581A 1981-04-20 1981-04-20

Publications (2)

Publication Number Publication Date
JPS57178349A true JPS57178349A (en) 1982-11-02
JPS6322623B2 JPS6322623B2 (en) 1988-05-12

Family

ID=22969809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1694382A Granted JPS57178349A (en) 1981-04-20 1982-02-04 High performance circuit module regulated at temperature and temperature regulating method

Country Status (4)

Country Link
JP (1) JPS57178349A (en)
DE (1) DE3214614A1 (en)
FR (1) FR2504293B1 (en)
GB (1) GB2097184B (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3326834A1 (en) * 1982-08-24 1984-03-01 General Electric Co., Schenectady, N.Y. Process for improving the manufacture of nuclear fuel products
JPS5994891A (en) * 1982-11-24 1984-05-31 Hitachi Ltd Semiconductor laser device
US4691987A (en) * 1983-07-08 1987-09-08 Itek Graphix Corp. Optical fiber cable producer and method of bonding optical fibers to light emitting diodes
GB2163008A (en) * 1984-08-08 1986-02-12 Varian Associates Miniature, temperature controlled phase detector
DE3709201A1 (en) * 1987-03-20 1988-09-29 Bosch Gmbh Robert HEAT RADIATION SENSOR
US5032897A (en) * 1990-02-28 1991-07-16 International Business Machines Corp. Integrated thermoelectric cooling
US5012325A (en) * 1990-04-24 1991-04-30 International Business Machines Corp. Thermoelectric cooling via electrical connections
DE4135853A1 (en) * 1991-10-31 1993-05-06 Alcatel Sel Aktiengesellschaft, 7000 Stuttgart, De Active semiconductor element coupled to controllable heat source - which may be external heating element with thermal bridge, or resistive layer monolithically integrated into semiconductor
DE4208858A1 (en) * 1992-03-19 1993-09-23 Sel Alcatel Ag FIBER OPTICAL AMPLIFIER WITH CONTROL OF THE PUMP LIGHT WAVELENGTH
DE4208857A1 (en) * 1992-03-19 1993-09-23 Sel Alcatel Ag OPTICAL MESSAGE TRANSMISSION SYSTEM WITH FIBER OPTICAL AMPLIFIERS AND REGULATION OF THE TRANSMITTER WAVELENGTH
FR2690571B1 (en) * 1992-04-23 1994-06-03 Peugeot DEVICE FOR REGULATING THE TEMPERATURE OF AN ELECTRONIC MODULE.
US5419780A (en) * 1994-04-29 1995-05-30 Ast Research, Inc. Method and apparatus for recovering power from semiconductor circuit using thermoelectric device
US5720342A (en) * 1994-09-12 1998-02-24 Pes, Inc. Integrated converter for extending the life span of electronic components
US5712448A (en) * 1996-02-07 1998-01-27 California Institute Of Technology Cooling device featuring thermoelectric and diamond materials for temperature control of heat-dissipating devices
US6614109B2 (en) 2000-02-04 2003-09-02 International Business Machines Corporation Method and apparatus for thermal management of integrated circuits
GB2375431B (en) * 2001-05-10 2003-11-05 Bookham Technology Plc Method and device for balancing temperature

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5370689A (en) * 1976-12-06 1978-06-23 Hitachi Ltd Semiconductor laser device
JPS55113390A (en) * 1980-01-25 1980-09-01 Hitachi Ltd Semiconductor laser device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB908662A (en) * 1960-01-11 1962-10-24 Ass Elect Ind Cooling apparatus
FR1363163A (en) * 1963-02-06 1964-06-12 Thomson Houston Comp Francaise Improvements to ovens for electronic components
IL23606A (en) * 1964-07-09 1969-11-12 Charbonnier R Electronic component with individual thermal regulation
DE1245458B (en) * 1966-04-27 1967-07-27 Telefunken Patent Integrated circuit, the carrier plate of which has good thermal conductivity
US3602721A (en) * 1967-11-20 1971-08-31 Malsushita Electric Ind Co Ltd Photoelectric device with enhanced photoconductive sensitivity and storage effect of input radiation
DE2337436C2 (en) * 1973-07-24 1982-02-04 Deutsche Itt Industries Gmbh, 7800 Freiburg Arrangement for keeping the frequency of a piezo or ferroelectric oscillating crystal constant
US4253515A (en) * 1978-09-29 1981-03-03 United States Of America As Represented By The Secretary Of The Navy Integrated circuit temperature gradient and moisture regulator

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5370689A (en) * 1976-12-06 1978-06-23 Hitachi Ltd Semiconductor laser device
JPS55113390A (en) * 1980-01-25 1980-09-01 Hitachi Ltd Semiconductor laser device

Also Published As

Publication number Publication date
FR2504293B1 (en) 1987-01-09
JPS6322623B2 (en) 1988-05-12
GB2097184B (en) 1985-07-03
GB2097184A (en) 1982-10-27
FR2504293A1 (en) 1982-10-22
DE3214614A1 (en) 1982-11-04
DE3214614C2 (en) 1991-11-14

Similar Documents

Publication Publication Date Title
GB2114803B (en) High temperature cell
GB8426636D0 (en) Regulating temperature coolant in ic engine
JPS57178349A (en) High performance circuit module regulated at temperature and temperature regulating method
JPS57202068A (en) High temperature battery
DK167985A (en) Method of regulating a compression cooling system and heating/cooling arrangement for implementing the method
GB8326040D0 (en) Liquid temperature regulator
GB2029613B (en) Carry anticipator circuit and method
GB8314846D0 (en) Temperature controlled electronic devices
JPS57210162A (en) Electronic regulating ignition system
GB2120498B (en) Regulator circuit
JPS57194426A (en) Electronic thermostat
JPS57107061A (en) Module cooling device
JPS57167404A (en) Helmet with electronic cooling apparatus
JPS57156760A (en) Electronic cooling pillow
JPS57196549A (en) Method of assembling semiconductor device
GB2169109B (en) Method of regulating temperature
GB2070487B (en) Low temperature soldering
DE3176033D1 (en) High temperature alloy
GB8508905D0 (en) Regulator circuit
JPS57201002A (en) Method of trimming electronic element with laser
GB2122390B (en) Electronic thermostat
EP0075920A3 (en) Arrangement for the cooling of modules in electronic assemblies
GB2112924B (en) Method and device for coolant temperature control
JPS56113959A (en) Temperature regulator
JPS57180953A (en) Electronic cooling pillow